Patents by Inventor Chaojie Wang

Chaojie Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147134
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137684
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137683
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137681
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137689
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137687
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137693
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137690
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240133398
    Abstract: Embodiments of this application provide a heating control method and apparatus, an oil pump, and a heat exchange system. The method includes: in a cold state, injecting a heating current into an oil pump motor, where when the oil pump motor is not started, a torque that the heating current is capable of generating is zero, and after the oil pump motor is started, heating power of the heating current is greater than heating power of an energy-saving current, where the energy-saving current is a current capable of enabling a first motor to reach a target operating condition when oil temperature is greater than a preset temperature threshold.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 25, 2024
    Inventors: Chaojie SHI, Bayaer EERHEMU, Chaoqiang WU, Shaohua WANG, Xiaowei XIE
  • Publication number: 20240137692
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137682
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20230228468
    Abstract: A heat pump system and control method thereof. The heat pump system includes: a main flow path with a compressor, a reversing valve, a first heat exchanger, a first throttling device and a second heat exchanger; the heat pump system further includes an ejector comprising a high-pressure fluid inlet, a fluid suction inlet and a fluid outlet, the high-pressure fluid inlet of the ejector is connected between the second heat exchanger and the first throttling device on the main flow path through a second throttling device, the fluid suction inlet of the ejector is connected to the reversing valve, and the fluid outlet of the ejector is connected to a separator, and a gas phase outlet of the separator is connected to the compressor, and a liquid phase outlet of the separator is connected between the first heat exchanger and the first throttling device on the main flow path.
    Type: Application
    Filed: January 13, 2023
    Publication date: July 20, 2023
    Inventors: Chaojie Wang, Guangyu Shen
  • Patent number: 11598065
    Abstract: A method for stabilizing and lifting a channel board by underwater grouting includes (A) when the channel board is damaged, removing the damaged channel board, cleaning and leveling a gravel layer under the damaged channel board, placing an undamaged channel board installed with first grouting pipes and a second grouting pipe on the gravel layer, wherein multiple geotextile bags are respectively bound to the first grouting pipes; when the channel board is subsided, installing first grouting pipes and a second grouting pipe into first grouting holes and a second grouting hole, respectively; (B) performing a first polymer grouting through the first grouting pipes, and performing a second polymer grouting through the second grouting pipe; (C) cutting off a part of the first grouting pipes the second grouting pipe which are exposed to the channel board, and leveling incisions; and (D) removing excess polymer left on the channel board.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: March 7, 2023
    Assignees: Zhengzhou University, SAFEKEY Engineering Technology (Zhengzhou), Ltd.
    Inventors: Fuming Wang, Mingsheng Shi, Chaojie Wang, Chengchao Guo, Peng Zhao, Binghan Xue, Yangyang Xia, Yanjie Hao, Xijun Zhang, Xianfeng Zhao, Yingli Wang
  • Publication number: 20230029619
    Abstract: The present disclosure discloses a method for calculating an internal explosion load speed based on an incremental crack growth distance of a pipeline. The method includes steps of: respectively measuring at least three groups of distances between neighboring markings on forward and backward crack surfaces, and calculating the average values respectively to obtain the average incremental growth distances of forward and backward cracks; calculating the natural vibration frequency of the pipeline; and setting the ratio of backward crack speed to forward crack speed of the pipeline, then calculating the internal explosion load speed of the pipeline by a formula. The present disclosure provides a new effective method for calculating the internal explosion load speed based on the available parameters of the ruptured pipeline after explosion, which can provide a comparatively accurate estimation of internal explosion load speed, thereby providing references for inferring the explosion type occurred in the pipeline.
    Type: Application
    Filed: July 22, 2019
    Publication date: February 2, 2023
    Inventors: Yang DU, Wenchun JIANG, Fan ZHOU, Jinyang ZHENG, Chaojie WANG, Guoming CHEN
  • Patent number: 11566987
    Abstract: The present disclosure discloses a method for calculating an internal explosion load speed based on an incremental crack growth distance of a pipeline. The method includes steps of: respectively measuring at least three groups of distances between neighboring markings on forward and backward crack surfaces, and calculating the average values respectively to obtain the average incremental growth distances of forward and backward cracks; calculating the natural vibration frequency of the pipeline; and setting the ratio of backward crack speed to forward crack speed of the pipeline, then calculating the internal explosion load speed of the pipeline by a formula. The present disclosure provides a new effective method for calculating the internal explosion load speed based on the available parameters of the ruptured pipeline after explosion, which can provide a comparatively accurate estimation of internal explosion load speed, thereby providing references for inferring the explosion type occurred in the pipeline.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: January 31, 2023
    Assignee: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA)
    Inventors: Yang Du, Wenchun Jiang, Fan Zhou, Jinyang Zheng, Chaojie Wang, Guoming Chen
  • Patent number: 11499284
    Abstract: A trough plate for constructing a locked polymer anti-seepage wall includes a plate body, a guide tube, a grouting pipe and an anti-blocking head. A construction method of the locked polymer anti-seepage wall includes the steps of positioning an Nth trough plate and then pressing the Nth trough plate into ground, wherein N is a natural number larger than and equal to 1; engaging an (N+1)th trough plate with the Nth trough plate, and then pressing the (N+1)th trough plate into the ground; connecting a grouting pipe of the Nth trough plate with a grouting machine, pulling out the Nth trough plate, and simultaneously grouting through the grouting pipe of the Nth trough plate by the grouting machine; and repeating the steps (B) and (C) till the locked polymer anti-seepage wall is completed, wherein the steps (B) and (C) are repeated every time, N is automatically increased by 1.
    Type: Grant
    Filed: May 29, 2021
    Date of Patent: November 15, 2022
    Assignees: Zhengzhou University, Henan Institute of Sun Yat-sen University
    Inventors: Fuming Wang, Chengchao Guo, Chaojie Wang, Mingsheng Shi, Peng Zhao, Yanhui Pan, Xianfeng Zhao, Binghan Xue, Yanjie Hao, Xijun Zhang, Yangyang Xia, Yingli Wang
  • Publication number: 20210285180
    Abstract: A trough plate for constructing a locked polymer anti-seepage wall includes a plate body, a guide tube, a grouting pipe and an anti-blocking head. A construction method of the locked polymer anti-seepage wall includes the steps of positioning an Nth trough plate and then pressing the Nth trough plate into ground, wherein N is a natural number larger than and equal to 1; engaging an (N+1)th trough plate with the Nth trough plate, and then pressing the (N+1)th trough plate into the ground; connecting a grouting pipe of the Nth trough plate with a grouting machine, pulling out the Nth trough plate, and simultaneously grouting through the grouting pipe of the Nth trough plate by the grouting machine; and repeating the steps (B) and (C) till the locked polymer anti-seepage wall is completed, wherein the steps (B) and (C) are repeated every time, N is automatically increased by 1.
    Type: Application
    Filed: May 29, 2021
    Publication date: September 16, 2021
    Inventors: Fuming Wang, Chengchao Guo, Chaojie Wang, Mingsheng Shi, Peng Zhao, Yanhui Pan, Xianfeng Zhao, Binghan Xue, Yanjie Hao, Xijun Zhang, Yangyang Xia, Yingli Wang
  • Publication number: 20210285179
    Abstract: A method for stabilizing and lifting a channel board by underwater grouting includes (A) when the channel board is damaged, removing the damaged channel board, cleaning and leveling a gravel layer under the damaged channel board, placing an undamaged channel board installed with first grouting pipes and a second grouting pipe on the gravel layer, wherein multiple geotextile bags are respectively bound to the first grouting pipes; when the channel board is subsided, installing first grouting pipes and a second grouting pipe into first grouting holes and a second grouting hole, respectively; (B) performing a first polymer grouting through the first grouting pipes, and performing a second polymer grouting through the second grouting pipe; (C) cutting off a part of the first grouting pipes the second grouting pipe which are exposed to the channel board, and leveling incisions; and (D) removing excess polymer left on the channel board.
    Type: Application
    Filed: May 27, 2021
    Publication date: September 16, 2021
    Inventors: Fuming Wang, Mingsheng Shi, Chaojie Wang, Chengchao Guo, Peng Zhao, Binghan Xue, Yangyang Xia, Yanjie Hao, Xijun Zhang, Xianfeng Zhao, Yingli Wang