Abstract: An extended catheter includes a catheter body, a pushing reinforcement wire, a pushing rod, and a positioning balloon. The catheter body is provided with a delivery channel, and a proximal end of the catheter body is provided with an inlet connected to the delivery channel. The pushing reinforcement wire is arranged on a side wall of the catheter body along an axial direction of the catheter body. A distal end of the pushing rod is connected to the proximal end of the catheter body, and an interior of the pushing rod is provided with a filling channel. The positioning balloon is sleeved on the catheter body, and an inner cavity of the positioning balloon is connected to the filling channel. Problem of existing catheters unable to effectively reach the designated position in curved and narrow branch blood vessels for treatment is solved.

Abstract: A cutting balloon catheter with concealed blades is provided. A pressure channel communicated with the balloon is formed by a gap between the outer tube and the inner tube. The cutting assembly includes first support rings sleeved on the outer tube and a blade group, the first support rings are capable of generating radial elastic deformation and sliding freely. The push-pull tube is sleeved on the outer tube, and the protective bag is configured to encapsulate the balloon and the cutting assembly. When the cutting assembly is pushed to the balloon, after the balloon is expanded, the blade group cuts a section of the protective bag opposite to the balloon to expose the blade group. The catheter can pass through the complex and tortuous blood vessels to reach the lesion site, and realize effective cutting while reducing the damage to the blood vessels.

Abstract: Disclosed are an oven controlled crystal oscillator device and a frequency compensation method thereof. The oven controlled crystal oscillator device includes: an oven, a microcontroller, an oven controlled crystal oscillator disposed in the oven, and a current detection circuit. The current detection circuit is coupled to the oven controlled crystal oscillator, and is configured to obtain an operating current value of the oven controlled crystal oscillator and provide the operating current value to the microcontroller. The microcontroller is configured to determine a frequency compensation amount according to the operating current value based on a frequency compensation rule, and output the frequency compensation amount to the oven controlled crystal oscillator to compensate an output frequency.

Abstract: The disclosure relates to the technical field of quartz crystal oscillators, in particular to a direct temperature measurement oven controlled crystal oscillator. The direct temperature measurement oven controlled crystal oscillator according to the present disclosure does not require additional components for measuring the temperature of the wafer inside the crystal oscillator. Instead, the temperature measurement device is disposed on the surface of the wafer to directly measure the temperature of the wafer itself, In order to achieve the exact temperature of the wafer itself. The oven controlled crystal oscillator according to the present disclosure has a simple in structure and is easy to be manufactured. The temperature of the wafer itself is directly measured to make temperature measurement more accurate.

Abstract: The present disclosure relates to the technical field of quartz crystal oscillators, and particularly, to a directly-heating oven controlled crystal oscillator. The surface of a wafer is provided with wires, two ends of each wire are respectively connected to one ends of support columns located inside a mounting space, and the other ends of the support columns located outside the mounting space are connected to a crystal pin. Accordingly, the wires on the surface of the wafer are connected to an external circuit by means of the support columns and the crystal pins, and the wires generate heat to heat the wafer after the wires are given a current by the external circuit.

Abstract: The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision.

Abstract: A method and an apparatus for measuring sedimentation of a solid-liquid two-phase mixture are provided. A standard work curve and/or standard mathematical model, indicating a relationship between thermal conductivity (k) and concentration (?) (and/or density (?)), are provided for measuring sedimentation of the solid-liquid two-phase mixture. To measure the sediment, thermal conductivities (k) are measured at settling times (t) to obtain a relationship (k?t). Concentrations (?) and/or densities (?) are then determined, based on the measured relationship (k?t) and the standard work curve and/or the standard mathematical model. A sedimentation rate is determined according to a variation rate of the thermal conductivity. A sedimentation status, sedimentation degree, and/or complete sedimentation degree are determined according to variation rate and variation degree of the thermal conductivity (k), the concentration (?) and/or the density (?) of the solid-liquid two-phase mixture to be measured.

Abstract: The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision.

Abstract: A surface mounted oven controlled crystal oscillator includes a crystal oscillator shell, a crystal oscillation circuit, several functional pins and a base plate. The crystal oscillation circuit is accommodated in a cavity that is formed by the crystal oscillator shell and the base plated and electrically connects with the functional pins. The functional pins drill through the base plate from the cavity. An insulating layer is formed between each functional pin and the base plate. The surface mounted oven controlled crystal oscillator further includes several pads formed at an outer surface of the base plate. The insulating layer is also formed between each pad and the base plate, and the functional pins are electrically connected with the corresponding pads respectively. Added pads, the oven controlled crystal oscillator has high stability, simple manufacturing process, and low manufacturing cost.

Abstract: An oven controlled crystal oscillator includes a thermostatic bath, an inner circuit board, an outer circuit board, a heating element, and a temperature sensor. The inner circuit board comprising a crystal oscillation circuit is positioned inside the thermostatic bath and electrically connected with the outer circuit board via a pin. The outer circuit board has a temperature control circuit and a power supply circuit. The heating element and the temperature sensor electrically connect with the outer circuit board. A through slot is formed through the outer circuit board, and the thermostatic bath is inserted into the through slot. By inserting the thermostatic bath into the through slot of the outer circuit board, the height and the weight of the oven controlled crystal oscillator are reduced, the electric connection performance is enhanced, and thus the stability of the output frequency of the oven controlled crystal oscillator is improved.

Abstract: A surface mounted oven controlled crystal oscillator includes a crystal oscillator shell, a crystal oscillation circuit, several functional pins and a base plate. The crystal oscillation circuit is accommodated in a cavity that is formed by the crystal oscillator shell and the base plated and electrically connects with the functional pins. The functional pins drill through the base plate from the cavity. An insulating layer is formed between each functional pin and the base plate. The surface mounted oven controlled crystal oscillator further includes several pads formed at an outer surface of the base plate. The insulating layer is also formed between each pad and the base plate, and the functional pins are electrically connected with the corresponding pads respectively. Added pads, the oven controlled crystal oscillator has high stability, simple manufacturing process, and low manufacturing cost.

Abstract: An oven controlled crystal oscillator includes a thermostatic bath, an inner circuit board, an outer circuit board, a heating element, and a temperature sensor. The inner circuit board is positioned inside the thermostatic bath and electrically connected with the outer circuit board via a pin, and the inner circuit board has a crystal oscillation circuit. The outer circuit board has a temperature control circuit and a power supply circuit electrically connecting with the temperature control circuit. The heating element and the temperature sensor electrically connect with the outer circuit board. A though slot is formed through the outer circuit board, and the thermostatic bath is inserted into the though slot.