Abstract: A semiconductor structure includes a first semiconductor substrate, a first interconnect structure disposed below the first semiconductor substrate, a through substrate via (TSV) penetrating through the first semiconductor substrate and extending into the first interconnect structure, and a first bonding conductor disposed below the first interconnect structure and electrically coupled to the TSV through the first interconnect structure. The TSV includes a first surface in the first interconnect structure and a second surface opposite to the first surface, and the first bonding conductor includes a first bonding surface facing away the first interconnect structure. In a view, a boundary of the first bonding surface of the first bonding conductor overlaps a boundary of the first surface of the TSV.

Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

Abstract: The electronic device includes a substrate; an active layer disposed above the first substrate; a first signal line disposed above the substrate; and a conductive pattern. The conductive pattern is in electrical contact with the active layer, wherein the conductive pattern includes a first side extending in a first direction, a second side extending in the first direction, and a third side connected between the first side and the second side, and wherein the third side includes a part that the part is not parallel to the first direction and not perpendicular to the first direction, and the part is located out of the first signal line.

Abstract: The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a first region and a second region; a first semiconductor mesa formed on the semiconductor substrate within the first region; a second semiconductor mesa formed on the semiconductor substrate within the second region; and a field effect transistor (FET) formed on the semiconductor substrate. The FET includes a first doped feature of a first conductivity type formed in a top portion of the first semiconductor mesa; a second doped feature of a second conductivity type formed in a bottom portion of the first semiconductor mesa, the second semiconductor mesa, and a portion of the semiconductor substrate between the first and second semiconductor mesas; a channel in a middle portion of the first semiconductor mesa and interposed between the source and drain; and a gate formed on sidewall of the first semiconductor mesa.

Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.

Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.

Abstract: A manufacturing method of a semiconductor structure is provided. A first semiconductor die includes a first semiconductor substrate, a first interconnect structure formed thereon, a first bonding conductor formed thereon, and a conductive via extending from the first interconnect structure toward a back surface of the first semiconductor substrate. The first semiconductor substrate is thinned to accessibly expose the conductive via to form a through semiconductor via (TSV). A second semiconductor die is bonded to the first semiconductor die. The second semiconductor die includes a second semiconductor substrate including an active surface facing the back surface of the first semiconductor substrate, a second interconnect structure between the second and the first semiconductor substrates, and a second bonding conductor between the second interconnect structure and the first semiconductor substrate and bonded to the TSV.

Abstract: A transform model is established by the calibration system for color transformation between a first color space and a second color space. Three first target curves are defined and transformed by the transform model so as to establish three look-up tables. The display is calibrated according to the three look-up tables such that the color temperature of the display may be substantially constant for every gray-level.

Abstract: An optical sensing module is adapted to be assembled to a frame of a display device. The display device comprises a display module and the frame, and the display module has a display area and the frame surrounds the display area. The optical sensing module comprises a casing and an optical sensor. The casing is pivoted to the frame and the optical sensor is configured in the casing for sensing external light projecting on a side of the casing. The optical sensor is capable of sensing a brightness of the display area when the side of the casing faces the display area and sensing a brightness of an ambient light when the side of the casing doesn't face the display area.

Abstract: A calibration system and a method thereof for color calibration of a display are provided. A transform model is established by the calibration system for color transformation between a first color space and a second color space. Three first target curves are defined and transformed by the transform model so as to establish three look-up tables. The display is calibrated according to the three look-up tables such that the color temperature of the display may be substantially constant for every gray-level.

Abstract: The invention discloses light source devices applied in backlight modules of image display panels. The light source device includes a current source unit generating a driving current, a plurality of light emitting units coupled in series to the current source unit, a plurality of current shunts corresponding to the light emitting units respectively and providing current bypasses for the driving current to bypass the corresponding light emitting units, a plurality of light sensing units sensing the brightness of the light emitting units, and a control unit generating a plurality of current shunt control signals for separately controlling the current shunts. Each of the current shunt control signals is generated according to the sensed brightness of the corresponding light emitting unit and is used in controlling the conduction statement of the current bypass provided by the corresponding current shunt.

Abstract: A display includes a display module, a light source, a light source driving circuit, a display driving circuit, and an optical sensor. The optical sensor is installed next to the light source for detecting the luminance and color temperature of the light source. The optical sensor is coupled to the display driving circuit for generating a feedback signal to the display driving circuit according to the luminance and the color temperature of the light source. The display driving circuit drives the display module to display an image according to a received image signal and updates the data of the image signal according to the feedback signal so as to adjust the luminance and the color temperature of the image.

Abstract: An optical sensing module is adapted to be assembled to a frame of a display device. The display device comprises a display module and the frame, and the display module has a display area and the frame surrounds the display area. The optical sensing module comprises a casing and an optical sensor. The casing is pivoted to the frame and the optical sensor is configured in the casing for sensing external light projecting on a side of the casing. The optical sensor is capable of sensing a brightness of the display area when the side of the casing faces the display area and sensing a brightness of an ambient light when the side of the casing doesn't face the display area.

Abstract: A connector for a circuit board has a pins that are compatible with a standard ISA connector. The connector includes at least 38 pins connected to a ground potential, at least 23 pins connected to a VCC potential, and a plurality of bus select pins, through which the circuit board can select a particular bus. Over the selected bus, communications are transmitted to and from the circuit board.