Abstract: Remote sensor units for a vehicle are described. An apparatus may comprise a satellite housing having an electrical connector interface portion, and an electrical connector disposed within the electrical connector interface portion of the satellite housing. The electrical connector may be arranged to conduct electrical signals for an electronic component having an electronic sensor operative to monitor conditions for a vehicle, the electrical connector comprising a capture portion at a first end and a pin portion at a second end, the capture portion having a pair of opposing mechanical contact elements arranged to receive at least one edge of the electronic component. Other embodiments are described and claimed.

Abstract: In an embodiment of the present invention a method for making an electronic assembly is provided. The method comprises positioning a substrate having a plurality of segmented portions. A first segmented portion has a first plurality of conductive traces terminating to form a first plurality of conductive pads. A second segmented portion has a second plurality of conductive traces terminating to form a second plurality of conductive pads. A flex circuit is placed onto the conductive pads. The flex circuit includes a third plurality of conductive traces terminating at a first end to form a first plurality of connecting pads and terminating at a second end to form a second plurality of connecting pads. Electronic components are electrically coupled to the first and second plurality of conductive traces to form a primary PCB and a daughter PCB. The connecting pads are electrically coupled to the conductive pads for electrically coupling the daughter PCB to the primary PCB.

Abstract: An electrical system and method for making the same includes a main circuit board and a plurality of contact pads located on a surface of the main circuit board. The contact pads are electrically conductive. Additionally, an integrated circuit package having at least one electrical device is attached to the surface of the main circuit board. A ball grid array made from a plurality of solder balls is located on a bottom side of the integrated circuit package. The ball grid array has a plurality of solder balls being electrically conductive and in electrical communication with the at least one electrical device. The solder balls further include solder balls of different material properties.

Abstract: Remote sensor units for a vehicle are described. An apparatus may comprise a satellite housing having an electrical connector interface portion, and an electrical connector disposed within the electrical connector interface portion of the satellite housing. The electrical connector may be arranged to conduct electrical signals for an electronic component having an electronic sensor operative to monitor conditions for a vehicle, the electrical connector comprising a capture portion at a first end and a pin portion at a second end, the capture portion having a pair of opposing mechanical contact elements arranged to receive at least one edge of the electronic component. Other embodiments are described and claimed.

Abstract: In an embodiment of the present invention a method for making an electronic assembly is provided. The method comprises positioning a substrate having a plurality of segmented portions. A first segmented portion has a first plurality of conductive traces terminating to form a first plurality of conductive pads. A second segmented portion has a second plurality of conductive traces terminating to form a second plurality of conductive pads. A flex circuit is placed onto the conductive pads. The flex circuit includes a third plurality of conductive traces terminating at a first end to form a first plurality of connecting pads and terminating at a second end to form a second plurality of connecting pads. Electronic components are electrically coupled to the first and second plurality of conductive traces to form a primary PCB and a daughter PCB. The connecting pads are electrically coupled to the conductive pads for electrically coupling the daughter PCB to the primary PCB.

Abstract: A motor vehicle motion sensor assembly includes a daughter board assembly having an alignment feature, a circuit board having electronic components, and a housing element having a receiving feature for receiving the daughter board assembly. The circuit board is electrically connected with the daughter board assembly by a flexible electrical connector. The circuit board is further connected with an external circuit connector. The alignment feature of the daughter board assembly is adapted to engage the receiving feature of the housing element.

Abstract: An improved accelerometer assembly including a circuit board and an accelerometer is provided. The accelerometer is configured to sense acceleration along a sensing axis. The accelerometer is attached to the circuit board and configured to sense acceleration along a sensing axis. A housing is configured to receive the circuit board in a first and second orientation, wherein the sensing axis in the first orientation is rotated 90° from the sensing axis in the second orientation.

Abstract: An improved accelerometer assembly including a circuit board and an accelerometer is provided. The accelerometer is configured to sense acceleration along a sensing axis. The accelerometer is attached to the circuit board and configured to sense acceleration along a sensing axis. A housing is configured to receive the circuit board in a first and second orientation, wherein the sensing axis in the first orientation is rotated 90° from the sensing axis in the second orientation.

Abstract: A seat sensor 10 including a pressure sensing mat 12, and several barbed members or tabs 14 which are integrally formed within sensing mat 12. Sensor 10 is adapted to be operatively installed on a conventional vehicle seat. In order to install sensor 10, several holes or cavities 20 are formed within the foam 22 of the seat in a conventional manner prior to assembly, and tabs 14 are forced into cavities 20. Once tabs 14 are inserted into cavities 20, barbed portions 18 “spring” outward against the sides of the cavities 20, thereby frictionally engaging and/or piercing the sides of the cavities 20 and securing seat sensor 10 to the seat.

Abstract: A leg assembly for a keyboard or the like is disclosed. The leg assembly is of relatively simple construction; a leg member, a pivot pin, a stud, a spring, and a C-clip are the components in the preferred embodiment. The leg assembly has two detent positions; in one detent position the leg member is held in a fully retracted position and in the other detent position the leg member is held in a deployed position. In a standard application, two leg assemblies would be employed per keyboard.