Abstract: Embodiments of a heat transfer apparatus, and related methods, involve at least one boundary wall defining a first flow path through a neck portion, a first heat source external to and in thermal communication with the boundary wall, and a working fluid (e.g., a first fluid component with a second fluid component entrained therein). The neck portion may be shaped such that at least a portion of the second fluid component impinges upon at least a portion of the boundary wall as the working fluid flows therethrough, whereby heat is transferred from the first heat source to the working fluid through the boundary wall.

Abstract: Embodiments of a heat transfer apparatus, and related methods, involve a first flow path through at least one neck portion defined by at least one boundary wall, a first heat source external to and in thermal communication with the at least one boundary wall, an inflow portion in fluid communication with the first flow path, an outflow portion in fluid communication with the first flow path, and a drive system for driving a first fluid through the first flow path, whereby heat is transferred from the first heat source to the first fluid as it flows through the first flow path.

Abstract: Embodiments of a heat transfer apparatus, and related methods, involve a curved flow path, a heat source external to and in thermal communication with at least a portion of an inner radial boundary of the curved flow path, and a working fluid, including a heavier component and a lighter component, flowing through the flow path. The flow path causes the working fluid to experience centrifugal force so as to preferentially force the heavier component toward the exterior wall portion and thereby cause the lighter component to preferentially absorb heat from the interior wall portion.

Abstract: Heat pumps move heat from a source to a higher temperature heat sink. This invention enables spontaneous source-to-sink heat transfer. Spontaneous heat transfer is accomplished by conducting heat from the source through rotating disks to a portion of the generally warmer sink flow that is cooled to a temperature below that of the source by the Bernoulli effect. The nozzled flow required for Bernoulli cooling is provided by the corotating disk pairs. The distance between the opposing surfaces of the disk pair decreases with distance from the rotation axis, forming a nozzle. The heat-sink flow through the nozzle is maintained by centrifugal force caused by the circular motion of the gas near the disk surfaces. Embodiments of the invention differ in the paths followed by the source and sink fluid flows, by the number of disk pairs and by the state (gas or liquid.) of the heat source.

Abstract: Heat pumps move heat from a source to a higher temperature heat sink. This invention enables spontaneous source-to-sink heat transfer. Spontaneous heat transfer is accomplished by conducting heat from the source through rotating disks to a portion of the generally warmer sink flow that is cooled to a temperature below that of the source by the Bernoulli effect. The nozzled flow required for Bernoulli cooling is provided by the corotating disk pairs. The distance between the opposing surfaces of the disk pair decreases with distance from the rotation axis, forming a nozzle. The heat-sink flow through the nozzle is maintained by centrifugal force caused by the circular motion of the gas near the disk surfaces. Embodiments of the invention differ in the paths followed by the source and sink fluid flows, by the number of disk pairs and by the state (gas or liquid.) of the heat source.

Abstract: Embodiments of a heat transfer apparatus, and related methods, involve a curved flow path, a heat source external to and in thermal communication with at least a portion of an inner radial boundary of the curved flow path, and a working fluid, including a heavier component and a lighter component, flowing through the flow path. The flow path causes the working fluid to experience centrifugal force so as to preferentially force the heavier component toward the exterior wall portion and thereby cause the lighter component to preferentially absorb heat from the interior wall portion.

Abstract: Embodiments of a heat transfer apparatus, and related methods, involve a first flow path through a neck portion of a venturi defined by at least one boundary wall, a first heat source external to and in thermal communication with the boundary wall, and a drive system for driving a first fluid through the neck portion, whereby heat is transferred from the first heat source to the first fluid through the boundary wall.

Abstract: Embodiments of a heat transfer apparatus, and related methods, involve a radial array of blades including a plurality of blades arranged about a central portion defining an entrance flow path, the plurality of blades defining a first flow path therebetween, a first heat source in thermal communication with the blades, and a drive system for driving a first fluid into the central portion through the entrance flow path and out through the first flow path between adjacent blades whereby heat is transferred from the first heat source to the first fluid flowing within the first flow path.

Abstract: Embodiments of a heat transfer apparatus, and related methods, involve a first flow path through at least one neck portion defined by at least one boundary wall, a first heat source external to and in thermal communication with the at least one boundary wall, an inflow portion in fluid communication with the first flow path, an outflow portion in fluid communication with the first flow path, and a drive system for driving a first fluid through the first flow path, whereby heat is transferred from the first heat source to the first fluid as it flows through the first flow path.

Abstract: Embodiments of a heat transfer apparatus, and related methods, involve at least one boundary wall defining a first flow path through a neck portion, a first heat source external to and in thermal communication with the boundary wall, and a working fluid (e.g., a first fluid component with a second fluid component entrained therein). The neck portion may be shaped such that at least a portion of the second fluid component impinges upon at least a portion of the boundary wall as the working fluid flows therethrough, whereby heat is transferred from the first heat source to the working fluid through the boundary wall.

Abstract: Heat pumps consume power in order to transfer heat from a source to a higher-temperature sink. This invention enables spontaneous heat transfer from a heat source to a small portion of the generally warmer working fluid that is cooled locally by the Bernoulli effect to a temperature below that of the heat source. The Bernoulli effect occurs in a Venturi shaped duct shaped to maintain attached flow. Heat-transfer efficiency is improved by restriction of the heat transfer to a small portion of the Venturi in which the flow temperature, velocity, pressure gradient and the Nusselt effect enhance heat transfer. Within this region, heat transfer is maximized by a thermally conducting grid extending across the Venturi neck.

Abstract: Heat pumps move heat from a source to a warmer sink, with Bernoulli heat pumps accomplishing this movement by reducing the temperature in a portion of the generally-warmer heat-sink flow. Heat flows spontaneously from the generally cooler heat-source flow into the locally cold portion of the heat-sink flow, which is the neck of a Venturi. The temperature reduction results from the Bernoulli conversion of random gas-particle motion (temperature and pressure) into directed motion (flow). This invention is a Bernoulli heat pump in which the heat transfer into the Venturi neck exploits unusual thermodynamic transport properties of rare-gases. Rare gases, especially mixtures of them, possess unusually small Prandtl numbers and thereby facilitate the diffusion of random particle motion (heat) relative to the diffusion of directed particle motion (viscosity), viscous friction being responsible for most of the power consumed by a Bernoulli heat pump.