Abstract: An alignment structure (14) and method for aligning a first circuit image region (18) of a microelectronic chip (10) with a second circuit region (20) of a wafer (12). The alignment structure comprises a plurality of passive coupling elements (22) attached to the chip and arranged in a linear array and further comprises a plurality of electrodes (24) attached to the wafer and arranged in a linear array. The electrodes are arranged into a set of first driven electrodes (46), a set of second driven electrodes (48) and a set of sensing electrodes (50). The first driven, second driven and sensing electrodes are arranged alternatingly with one another and may each include one or more plates (62). The first and second driven electrodes are driven, respectively, with sine wave signals 180 degrees out of phase with one another.

Abstract: An alignment structure (14) and method for aligning a first circuit image region (18) of a microelectronic chip (10) with a second circuit region (20) of a wafer (12). The alignment structure comprises a plurality of passive coupling elements (22) attached to the chip and arranged in a linear array and further comprises a plurality of electrodes (24) attached to the wafer and arranged in a linear array. The electrodes are arranged into a set of first driven electrodes (46), a set of second driven electrodes (48) and a set of sensing electrodes (50). The first driven, second driven and sensing electrodes are arranged alternatingly with one another and may each include one or more plates (62). The first and second driven electrodes are driven, respectively, with sine wave signals 180 degrees out of phase with one another.

Abstract: A fluid delivery system that includes a fluid delivery tool having a connector element and a location for holding a fluid container. The fluid container location of the tool has a replaceable template with a first key element portion. The fluid delivery system also includes a fluid container having a connector portion for connecting the fluid container to the connector element of the fluid delivery tool so that the fluid in the fluid container may be delivered to the fluid delivery tool. The fluid container may also have a second key element portion distinct from its connector portion and configured to mate with the first key element portion of the tool template. Alternatively, the fluid container may have a body portion integral with and distinct from its connector portion, and a key element is provided on at least a portion of the fluid container body portion and configured to mate with the first key element portion of the tool template.

Abstract: A structure and method for removing and recovering an anodically bonded glass device from a substrate using a metal interlayer interposed between the glass and the substrate is provided. As used in semiconductor mask fabrication, the structure comprises a silicon wafer substrate coated with a membrane on which a metal interlayer is disposed. The metal interlayer and a glass device are anodically bonded together. Recovery of the glass device is accomplished by chemically and mechanically removing the wafer and its membrane from the metal interlayer. The membrane is preferably removed using reactive ion etching to which the metal interlayer is resistant. The metal interlayer is then removed from the glass device using a highly corrosive chemical solution. The recovered glass device may then be reused.

Abstract: A temperature-sensitive film such as a resist is baked onto a semiconductor substrate such as a mask blank by immersion in a heated liquid. A barrier coating may optionally be applied to the substrate prior to immersion and later removed. The substrate is subsequently cooled by immersing the substrate in a cooling liquid or dissolving the heated liquid from the substrate with a rinsing liquid at a temperature sufficiently lower than that of the heated liquid. Temperature uniformity within .+-.0.2.degree. C. is thereby achieved across the regions of varying thickness in the silicon wafer and membrane. Where a resist has been deposited on the mask blank substrate, heating and cooling by immersion results in improved line size control after exposure and development down to 0.25 .mu.m.

Abstract: Acid sensitive polymeric compositions, and improved chemically amplified microlithographic resist compositions comprising the acid sensitive polymeric compositions, and methods for the preparation and use thereof are disclosed. The compositions comprise, in admixture, a polymeric binder, an acid labile moiety which provides selective aqueous base solubility upon cleavage, and a compound that generates acid upon exposure of the resist composition to imaging radiation. More particularly, the compositions have one or more acid labile ketal groups, which may be chemically linked to a polymeric resin or which may be incorporated into a separate component to form a dissolution inhibitor. Crosslinking of the polymer to produce a high molecular weight, nonpolar resin may also occur by ketal exchange. Upon exposure, molecular weight and polarity changes of the crosslinked resin produce high contrast during development.