Abstract: The use of tricholine phosphate, tris [(2-hydroxyethyl) trimethylammonium] phosphate as a surface treating agent employed during the manufacture of printed wire boards, semiconductors and the like, particularly as a stripper for photoresists and as a cleaner for silicon wafers, furnace tubes and the like.

Abstract: A method is disclosed for preparing and using buffered aqueous solutions of carboxylic acids and metal salts of carboxylic acids. Such solutions are useful as mold inhibitors in bread, cakes, and animal feeds. Buffered aqueous solutions of about 40 to 80 percent of compounds of carboxylic acids and carboxylic acid metal salts, such as sodium diacetate, sodium dipropionate, sodium dibutyrate or sodium dibenzoate have been found to have a reduced corrosive nature to metals and alloys used to contain, transport, and apply these solutions, thereby permitting the use of these metals and alloys in existing and new facilities.