Abstract: A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser light to a waveguide and light from the same waveguide to a detector. The described components can be formed as an array to operate within system that operation over parallel optical fibers. Applicability for these components is for optical time domain reflectometry, bi-directional optical communications, remote fiber sensing, and optical range finders.

Abstract: A photonic device is described that contains patterns on the backside of a transparent substrate that perform several functions, including anti-reflection coating in certain areas but not in other areas, light blocking in certain areas and not in others. The patterned layers provide improved product performance and improved radiation tolerance.

Abstract: A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser light to a waveguide and light from the same waveguide to a detector. The described components can be formed as an array to operate within system that operation over parallel optical fibers. Applicability for these components is for optical time domain reflectometry, bi-directional optical communications, remote fiber sensing, and optical range finders.

Abstract: A component system and method is described that is made of components for transmitting, routing and receiving “in-air” optical signals for placement on printed wiring boards (PWBs). The transmitters are components including a light source attached to a transparent substrate and aligned to a coupling lens. The transparent substrate can contain circuitry for controlling the light source, or the circuitry could be attached to the transparent substrate. The receivers include a light detector attached to a transparent substrate with circuitry for converting optical signals to electrical circuitry (integrated onto the transparent substrate or separately attached). The routing components include a lens for coupling light into an optical waveguide, an optical waveguide and, optionally, a second lens for coupling light from the optical waveguide.

Abstract: A connector attachment to a low height module is described that has a lid configured with an attached spring extension that is substantially planar to the lid. At the end of the spring extension is a spring or compressing mechanism that fits over an external mechanically transferable (MT) ferrule, the ferrule being connected to a ribbon of fibers or communication lines. The external ferrule is fitted to a side of the low height profile module that has an opening to couple the communication lines to the interior/devices in the module. The connector attachment is secured to the module via screws, for example. The combination of the lid with the spring extension and spring/compressing mechanism provides for a very elegant low profile connector assembly that allows communication lines to be more robustly attached to the module than currently practiced and also preserves the overall height of the low height profile module.

Abstract: An integrated circuit/optoelectronic packaging system (100) which comprises OE and IC components packaged to provide electrical input/output, thermal management, an optical window, and precise passive or mechanical alignment to external optical receivers or transmitters. A transparent insulating substrate having electrical circuitry in a thin silicon layer formed on its top side is positioned between the optical fiber and the optoelectronic device such that an optical path is described between the optoelectronic device and the optical fiber core through the transparent insulating substrate. The optoelectronic devices are mounted on the transparent insulating substrate in a precise positional relationship to guide holes in the substrate. The optical fibers are fixed in an optical fiber connector and are held in a precise positional relationship to guide holes in the connector.

Abstract: An optical-optoelectronic coupling structure comprising a flip-chip optoelectronic/ultrathin silicon-on-sapphire device mounted on a V-groove, optical-fiber-bearing carrier substrate, including light-reflective structures for launching light into the optical fiber core or transmitting light emitted by the optical fiber core to the optoelectronic device. The optical fiber may be immobilized in the V-groove using a curable resin adhesive characterized by a refractive index substantially similar to the refractive index of the optical fiber.

Abstract: An integrated circuit/optoelectronic packaging system (100) which comprises OE and IC components packaged to provide electrical input/output, thermal management, an optical window, and precise passive or mechanical alignment to external optical receivers or transmitters. A transparent insulating substrate having electrical circuitry in a thin silicon layer formed on its top side is positioned between the optical fiber and the optoelectronic device such that an optical path is described between the optoelectronic device and the optical fiber core through the transparent insulating substrate. Arrays of fibers may be coupled to arrays of optoelectronic devices through a single transparent substrate. The optoelectronic devices are mounted on the transparent insulating substrate in a precise positional relationship to guide holes in the substrate. The optical fibers are fixed in an optical fiber connector and are held in a precise positional relationship to guide holes in the connector.

Abstract: An integrated photodetector means for controlling the output of a light source, where the control means is a photodetector formed on a silicon-on-insulator substrate. The integrated photodetector senses the optical power from the light source and provides an electrical feedback signal which can be used to adjust the DC bias levels of the light source control driver circuit. The approach readily lends itself to large arrays of light sources bonded to silicon-on-sapphire driver circuits and is especially suitable for controlling light sources such as VCSELs in arrays such as are found in communications systems.

Abstract: An optical-optoelectronic coupling structure comprising a flip-chip optoelectronic/ultrathin silicon-on-sapphire device mounted on a V-groove, optical-fiber-bearing carrier substrate, including light-reflective structures for launching light into the optical fiber core or transmitting light emitted by the optical fiber core to the optoelectronic device. The optical fiber may be immobilized in the V-groove using a curable resin adhesive characterized by a refractive index substantially similar to the refractive index of the optical fiber.