Abstract: The concentration of the active ingredient in a rolling oil emulsion can be rapidly determined, and correction of the concentration of the active ingredient can be undertaken by measuring the measuring the amount of light reflected from the emulsion at the peak absorbing wavelength of the dye to obtain a first reflectance value and measuring the amount of light reflected from said emulsion at a wavelength other than the peak absorbing wavelength of the dye to obtain a second reflectance value for at least two different concentrations of the rolling oil in the rolling oil emulsion, establishing a calibration curve, and then monitoring the rolling oil emulsion in like manner. The results may be utilized to feed additional additive to the emulsion, or may be used to feed water into the emulsion system.

Abstract: Antistatically modified fixturing cements useful in the polishing of silicon wafers are disclosed. The fixturing adhesives disclosed generally comprise:(a) a solvent carrier having a boiling point no greater than 200.degree. F. under a vacuum of 25 inches of mercury;(b) a fixturing adhesive soluble in the solvent carrier; and,(c) an antistatic agent.

Abstract: An adhesive composition for a insect-control agent, such as gypsy moth pheromone beads, provides retention and water insolubility to such pesticide upon deposit of an aqueous mixture of such adhesive composition and insect-control agent. The adhesive composition concentrate comprises a salt such as sodium sulfate, an ethoxylated alkylphenol, a polymeric adhesive material, and a high molecular weight acrylate polymer.

Abstract: A colloidal silica slurry comprising: a low metals ammonium-stabilized silica sol having the following characteristics: SiO.sub.2 present in the range between about 15 to about 50 weight percent; a pH in the range between about 8.5 to about 11.3; a particle diameter in the range between about 4.0 to about 130 nm; aluminum, as Al, present in an amount less than about 100 ppm, based on SiO.sub.2 ; iron, as Fe, present in an amount less than about 50 ppm, based on SiO.sub.2 ; potassium, as K, present in an amount less than about 25 ppm, based on SiO.sub.2 ; and sodium, as Na, present in an amount less than about 500 ppm, based on SiO.sub.2 ; and a bactericide, a polishing rate accelerator which differs from the bactericide, and/or a sodium chlorite or sodium hypochlorite biocide. Optionally, a fungicide may also be added to the colloidal silica slurry to inhibit fungi growth.

Abstract: Superiority in retained slide angle of antiskid paper is achieved by spraying the paper with a composition of matter consisting essentially of an acrylamide, glycerine, balance antiskid aqueous silica sol.

Abstract: Composition of matter and method of cleaning silicon wafers; the composition of matter is an aqueous solution of potassium hydroxide and a nitrogen-containing compound, preferably tetramethylammonium hydroxide. The wafer is immersed in the solution, rinsed and dried.

Abstract: A concentrated lapping composition having the following makeup:______________________________________ Ingredient % by Weight ______________________________________ Finely divided inorganic 5-70 abrasive Carboxylic acid dispersant 0.1-1 polymer having a molecular weight of from 500-50,000 Lubricant 0.5-29 ______________________________________said lapping composition having its pH adjusted to greater than 8.5 in order to afford an improved lapping rate.

Abstract: A lubricating composition for use in slicing or cutting silicon wafers. The composition includes a soap, a phosphorous containing compound, and an ethylene oxide-propylene oxide polymer. The phosphorous compound is a low temperature, extreme pressure lubricant. The ethylene oxide propylene oxide polymer is a high temperature, extreme pressure lubricant. Suitable soaps include C6-C18 fatty acids reacted with triethanolamine or aminoethanolamine. Additionally, biocides or fungicides may be added. Also an antifoam and a complexing aid such as EDTA may be used.

Abstract: Improved lapping compositions are disclosed which contain;______________________________________ % by weight Ingredients General Preferred ______________________________________ Finely divided inorganic 5-70 40-60 abrasive Biocide .05-3 .1-2 Carboxylic acid .1-1 .2-.5 dispersant polymer Carboxylic acid 0.5-5 .2-1.5 polymer thickener Water-soluble corrosion .5-5 1-3 inhibitor Lubricant (optional) .

Abstract: A composition useful in polishing silicon wafers and like materials which comprises an aqueous colloidal silica sol or gel and from 0.1-5% by weight based on the SiO.sub.2 content of the sol or gel of piperazine.

Abstract: In a process of manufacturing discrete, ceramic fiber insulation products, the steps of:(a) providing an alkali-stabilized water suspension of colloidal silica;(b) incorporating a water-soluble salt of an inorganic oxygen-containing acid in said suspension to form a modified suspension;(c) and either infusing said modified suspension into a pre-treated mat of alumino silicate fibers or infusing the alkali stabilized water suspension of colloidal silica into the pre-treated mat and then subjecting the thus-treated mat to an acidic gas; and then,(d) drying said mats.

Abstract: It is now known that molecular sieve cracking catalysts used in fluid catalytic cracking units which have been contaminated with such metals as vanadium and nickel can be restored by contacting such contaminated catalysts with antimony-containing compounds and then subsequently subjecting the thus-treated catalysts to elevated temperatures and an oxygen-containing gas whereby revitalization is achieved.The above process can be improved by using as a source of antimony oxide an oil-in-water emulsion of an aqueous antimony sol.

Abstract: A method of producing iron acetate coated silica sol which comprises the steps of passing a mixture of ion-free colloidal silica and an inorganic iron salt in contact with a strong base anion exchange resin in the acetic acid salt form under conditions whereby the iron salt is converted to the iron acetate and is coated on the silica sol, thereby producing an iron acetate coated silica sol.

Abstract: Semi-conductors can be polished with greater efficiency using as a polishing agent a blend of colloidal silica or silica gel, a water-soluble amine and a water-soluble quaternary ammonium salt or base.

Abstract: New alumina coated silica sols are produced by a method which comprises mixing a concentrated deionized silica sol with concentrated solutions of trivalent acid aluminum salts, heating this premix to at least 90.degree. C. for 1-15 minutes to form an alumina reacted silica sol solution, cooling this reacted silica sol solution to form a cooled alumina reacted silica sol solution, diluting with deionized water to about 10 weight percent solids, exposing this diluted alumina reacted silica sol to ultrafiltration through a membrane having a molecular weight cutoff of about 30,000, adding distilled or deionized water to the diluted alumina reacted silica sol during ultrafiltration to wash dissolved salts from this salt solution forming a diluted alumina-coated silica sol having a pH between about 4-5 and a conductivity between about 2,000-4,000 micromhos, concentrating this dilute alumina-coated silica sol to at least 30 weight percent solids, thereby obtaining a stable alumina-coated silica sol.

Abstract: Chemical complexing compounds such as salts of aminotrimethylene phosphonic acid or ethylenediamine tetracetic acid are added to alkali-stabilized silica sols in order to promote rapid and complete re-saturation of alumino-silicate fiber insulation previously formed and dried using colloidal silica products.

Abstract: New and useful silica sols especially suitable for polishing semiconductor wafers are prepared by a special process involving heating a broad distribution aqueous silica sol containing larger silica particles of which at least 50% in number have a particle size of at least 40 millimicrons, the remainder of the silica particles being smaller and of different sizes, whereby the resultant silica sol contains a number of the larger silica particles having a particle size of at least 40 millimicrons which is at least as great as the starting sol, the weight average of said larger silica particles is greater than that of the larger silica particles in the starting sol, the number of smaller particles is less than the number of smaller particles in the starting sol, and the resultant sol contains fewer particles of different sizes than the starting sol.

Abstract: Large particle aqueous silica sols are prepared in a single step by heating an alkaline aqueous slica sol containing smaller silica particles mixed with larger silica particles while maintaining the ratio of the total surface area of the smaller silica particles to the total surface area of the larger silica particles at a predetermined ratio and under conditions such that the smaller silica particles dissolve and redeposit on the larger silica particles thereby producing an aqueous silica sol in which the majority of the silica particles have a size significantly larger than the larger silica particles in the starting mixed sol.

Abstract: An unsaturated polyester resin which contains at least 0.3% by weight of silica particles having an ultimate particle size within the range of 4-70 millimicrons, whose particles have their surface coated with a quaternary ammonium salt which contains at least 1 organic radical of at least 6 carbon atoms in chain length.

Abstract: Semi-conductors can be polished with greater efficiency by using as a polishing agent a blend of colloidal silica or silica gel and a water-soluble amine.