Abstract: A compliant interconnect is described that is useful for coupling semiconductor dies to other components. In one embodiment, the interconnect includes a base to couple to a first component and an arch extending from and integral with the base to couple to a second component. The interconnect may be formed by coating a substrate with photoresist, exposing the photoresist with a defined pattern, developing the photoresist, baking the photoresist at a first temperature for a first amount of time to reflow the photoresist, and baking the photoresist at a second higher temperature for a second amount of time to reflow the photoresist.

Abstract: Embodiments of a method of forming a tapered via using a receding mask are disclosed. In one embodiment, an etch mask formed on a substrate includes a first aperture in a first photoresist layer and a second, larger aperture in an overlying second photoresist layer. Peripheries of the first and second apertures may be tapered as a result of an out-of-focus exposure. An etching process may be performed to create a tapered via in the substrate, and during this etching process, the first, relatively thinner photoresist layer will recede outwardly toward the aperture in the second photoresist layer. Other embodiments are described and claimed.

Abstract: A process, apparatus, and associated controls are provided in a system for loading bulk material into a flexible, collapsed container from an overhead storage bin. The container can be positioned on a scale in the loading station. A discharge conduit from the bin is connected to a discharge spout which is movable into communication with the container. An exhaust conduit from a dust collection system is connected to an exhaust spout which is also movable into communication with the container. The discharge and exhaust spouts are mounted on a carriage movable on a platform toward and away from the container. The platform is movable transversely of the container between a loading position behind the container and a retracted position which accommodates movement of the container therepast. A line is provided for supplying inert gas to the discharge spout. Valves are provided on the exhaust conduit, discharge conduit, and inert gas line for controlling the flows through the conduits.

Abstract: A process, apparatus, and associated controls are provided in a system for loading bulk material into a flexible, collapsed container from an overhead storage bin. The container can be positioned on a scale in the loading station. A dicharge conduit from the bin is connected to a discharge spout which is movable into communication with the container. An exhaust conduit from a dust collection system is connected to an exhaust spout which is also movable into communication with the container. The discharge and exhaust spouts are mounted on a carriage movable on a platform toward and away from the container. The platform is movable transversely of the container between a loading position behind the container and a retracted position which accommodates movement of the container therepast. A line is provided for supplying inert gas to the discharge spout. Valves are provided on the exhaust conduit, discharge conduit, and inert gas line for controlling the flows through the conduits.