Abstract: A terminal crimping device includes crimp tooling comprising an anvil and a ram movable toward the anvil with a crimp zone being defined between the anvil and the ram configured to receive a wire and a terminal configured to be crimped to the wire by the crimp tooling. An ultrasonic transmitting transducer is coupled to at least one of the anvil and the ram that transmits acoustic signals through the wire and terminal.

Abstract: A terminal crimping device includes crimp tooling defining a crimp zone configured to receive a wire and a terminal. The terminal is configured to be crimped to the wire by the tooling during a crimp stroke of the crimp tooling to from a crimped terminal. The crimp tooling includes an ultrasound module ultrasonically coupled to the crimp tooling and the wire and the crimped terminal when present. The ultrasound module transmits acoustic signals through the crimped terminal and the wire. The ultrasound module also receives echo acoustic signals being reflected back to the ultrasound module. The ultrasound module generates echo signals based on the echo acoustic signals. The terminal crimping device also includes a crimp quality module that receives the echo signals from the ultrasound module and determines a crimp height of the crimped terminal based on the reflected echo acoustic signals received by the ultrasound module.

Abstract: A device control module for making a non-demand management system capable electrical device demand responsive to a demand management system includes a relay configured to be electrically connected to a power circuit of the electrical device to control power supply to a load device of the electrical device. The device control module includes a relay driver operated to open and close the relay and a controller operating the relay driver. The controller receives a demand state signal from the demand management system supplying power to the electrical device and operates the relay driver based on the demand state signal. The relay is configured to power off the load device of the electrical device irrespective of the main control operation of the electrical device.

Abstract: A communication module adaptor adapted for mating with a device connector of a smart electronic device includes an adaptor circuit having a communication module and an adaptor connector coupled to the adaptor circuit. The communication module has a mating interface differing from a mating interface of the device connector such that the communication module is unable to directly connect to the device connector. The adaptor connector has a mating interface complementary to the mating interface of the device connector for mating with the device connector to electrically connect the communication module adaptor to the smart electronic device. The adaptor circuit electrically connects the adaptor connector and the communication module and control signals are transmitted from a controller of the communication module to the device connector of the smart electronic device via the adaptor connector.

Abstract: A wire sorting fixture includes a cable support configured to support a multi-wire cable and a wire support configured to support wires of the cable. The wire support has a top surface. The wire support has cradles open at the top surface. The wire support has separating walls between corresponding cradles. A top plate is positioned above the wire support. The top plate is moved toward the wire support to a clamping position after the wires are positioned in the corresponding cradles. The top plate holds the wires between the top plate and the wire support in the clamping position.

Abstract: A soldering machine includes a frame and a fixture held by the frame that supports a substrate and a cable. A guidance system is supported by the frame with a camera viewing the fixture that is movable relative to the fixture. A positioning system is supported by the frame. The positioning system has a camera positioner and a soldering mechanism positioner. A soldering mechanism is coupled to the soldering mechanism positioner and is moved by the soldering mechanism positioner relative to the fixture. The soldering mechanism solders wires to the substrate. A controller communicates with the positioning system and the guidance system to operates the positing system to control positions of the camera and soldering mechanism relative to the fixture based on an image obtained by the camera.

Abstract: A wire sorting machine includes a frame and a fixture held by the frame. The fixture is configured to support a cable having a plurality of wires. A positioning system is supported by the frame. A guidance system is supported by the positioning system. The guidance system has a camera viewing the fixture that is movable relative to the fixture. A wire manipulator is supported by the positioning system and is moved by the positioning system relative to the fixture. The wire manipulator is configured to engage the wires of the cable to position the wires relative to the fixture. A controller communicates with the positioning system and the guidance system. The controller operates the positing system to control a position of the wire manipulator relative to the fixture based on an image obtained by the camera.

Abstract: A fluid dispensing machine includes a frame and a fixture held by the frame. The fixture is configured to support a substrate. A positioning system is supported by the frame. A guidance system is supported by the positioning system. The guidance system has a camera viewing the fixture that is movable relative to the fixture. A fluid dispenser is supported by the positioning system and is moved by the positioning system relative to the fixture. The fluid dispenser is configured to dispense fluid onto the substrate. A controller communicates with the positioning system and the guidance system.

Abstract: A contactless connector includes a transmitter having a first transmit integrated circuit generating a first signal and a second transmit integrated circuit generating a second signal. A first pick-up antenna is adjacent the first transmit integrated circuit and conveys the first signal along a first transmission line to a first propagation antenna. A second pick-up antenna is adjacent the second transmit integrated circuit and conveys the second signal along a second transmission line to a second propagation antenna. The first and second propagation antennas transmit the first and second signals to a propagation path at different and separable polarizations to allow duplex communication with the propagation path.

Abstract: A method for detecting a touch event on a touch panel comprises obtaining at least first and second signals from at least two sensors where the at least first and second signals are responsive to a touch event. A first amplitude magnitude associated with the first signal is calculated and a second amplitude magnitude associated with the second signal is calculated. A magnitude ratio is determined between the first and second amplitude magnitudes, and a touch location is identified based on the magnitude ratio.

Abstract: A receptacle assembly includes a housing having a front mating face and receptacles configured to receive plugs therein through the front mating face, where the plugs have connectivity pins attached thereto. The receptacle module includes connectivity sensor areas associated with the receptacles, where each connectivity sensor area is positioned adjacent the corresponding receptacle. Each connectivity sensor area has a first connectivity sensor and a second connectivity sensor that is electrically isolated from the first connectivity sensor when the plug is disconnected from the receptacle. Both the first and second connectivity sensors are configured to be engaged by different connectivity pins of the plug when the plug is received in the corresponding receptacle to form a sense circuit.

Abstract: A plug assembly includes a body extending between a mating end and a cable end. A sensor assembly is supported by the body that has an integrated circuit component having a first pad and a second pad. The sensor assembly also has a first sensor probe mounted to the first pad and a second sensor probe mounted to the second pad.

Abstract: A receptacle assembly includes a housing having a front mating face and receptacles configured to receive plugs therein through the front mating face, where the plugs have connectivity pins attached thereto. The receptacle module includes connectivity sensor areas associated with the receptacles, where each connectivity sensor area is positioned adjacent the corresponding receptacle. Each connectivity sensor area has a first connectivity sensor and a second connectivity sensor that is electrically isolated from the first connectivity sensor when the plug is disconnected from the receptacle. Both the first and second connectivity sensors are configured to be engaged by different connectivity pins of the plug when the plug is received in the corresponding receptacle to form a sense circuit.

Abstract: A method for detecting a touch event on a touch panel comprises obtaining at least first and second signals from at least two sensors where the at least first and second signals are responsive to a touch event. A first amplitude magnitude associated with the first signal is calculated and a second amplitude magnitude associated with the second signal is calculated. A magnitude ratio is determined between the first and second amplitude magnitudes, and a touch location is identified based on the magnitude ratio.

Abstract: A touch based control system for a device includes a first sensor and a second sensor proximate the first sensor. At least one of the first and second sensors includes a touch sensitive area associated therewith. A controller is coupled to the first and second sensors. The controller monitors detected activations of the first and second sensors. The controller is configured to distinguish between an activation resulting from a touch to the touch sensitive area and an activation resulting from contamination between the first and second sensors. Further, a method for detecting contamination in a sensor array is provided that includes selecting a sensor as the active sensor, pulsing the selected sensor, and if a response is detected during the pulse to the selected sensor, the pulse to the selected sensor is repeated and the non-selected sensors are checked for a response after the pulse.