Abstract: Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of applying adhesion promoter to a clean surface of the substrate, and curing the adhesion promoter. SPIE varnish is applied over the cured adhesion promoter, and is itself cured. A further layer of adhesion promoter is applied over the cured SPIE varnish, and is cured. The polyimide dielectric material is then laminated to the adhesion promoter. Cleaning of the copper-containing substrate portions is performed by etching with etchant including cupric chloride, cleaning of the titanium-containing substrate portions is performed with etchant including HF, and cleaning of copper- and titanium-containing portions is performed by HF etching followed by cupric chloride etching. Aluminum-containing portions of the substrate are not etched.

Abstract: An improved material particularly suited for the thermal insulation of building structures, such as residential housing, and a process for making the same, are disclosed. The thermally insulating composite comprises a low-density, cellular, fiber-containing, cementitious material and at least one structural surface element made of the cellular, fiber-containing, cementitious material, the structural surface element of which has a higher density than the low-density, cellular, fiber-containing, cementitious material from which it is formed therefrom and integral therewith. The thermally insulating composite is made by placing a foam of the low-density, cementitious material having entrapped gas therein, in an enclosure at least part of which is permeable to the gas and the liquid medium of the foam, and applying pressure to a surface of that enclosure to remove the gas and the liquid medium at the permeable enclosure.

Abstract: An improved material particularly suited for the thermal insulation of building structures such as residential housing. The material comprises an inorganic, low-density cellular thermally insulating foam comprising a gypsum matrix having minute cavities homogeneously distributed therein. The material has a dry density of less than about 6 pounds per cubic foot and a thermal coefficient of less than about 0.37. The gypsum matrix includes therein approximately 1 to 15% by weight of cement, approximately 0.5 to 7% by weight of mineral wool and at least approximately 0.25% by weight of chopped glass.

Abstract: An improved material particularly suited for the thermal insulation of building structures such as residential housing. The material comprises an inorganic, low-density cellular thermally insulating foam comprising a gypsum matrix having minute cavities homogeneously distributed therein. The material has a dry density of less than about 3 pounds per cubic foot and a thermal coefficient of less than about 0.37.

Abstract: An improved material particularly suited for the thermal insulation of building structures such as residential housing and a process for making the same. The material comprises an inorganic, low-density foam with gypsum as the major constiuent.