Abstract: A method to improve CdTe-based photovoltaic device efficiency is disclosed. The CdTe-based photovoltaic device can include oxygen or silicon in semiconductor layers.

Abstract: A method to improve CdTe-based photovoltaic device efficiency is disclosed. The CdTe-based photovoltaic device can include oxygen or silicon in semiconductor layers.

Abstract: A method of making sputter targets using rotary axial forging is described. Other thermomechanical working steps can be used prior to and/or after the forging step. Sputter targets are further described which can have unique grain size and/or crystal structures.

Abstract: A method of making sputter targets using rotary axial forging is described. Other thermomechanical working steps can be used prior to and/or after the forging step. Sputter targets are further described which can have unique grain size and/or crystal structures.

Abstract: A method of making sputter targets using rotary axial forging is described. Other thermomechanical working steps can be used prior to and/or after the forging step. Sputter targets are further described which can have unique grain size and/or crystal structures.

Abstract: A process is described for processing metal which includes clock rolling a metal plate until the desired thickness is achieved to form a rolled plate. Sputtering targets and other metal articles are further described.

Abstract: Air quality in a workplace can be monitored to ensure worker safety.

Abstract: A process is described for processing metal which includes clock rolling a metal plate until the desired thickness is achieved to form a rolled plate. Sputtering targets and other metal articles are further described.

Abstract: A process is described for processing metal which includes clock rolling a metal plate until the desired thickness is achieved to form a rolled plate. Sputtering targets and other metal articles are further described.

Abstract: A method for monitoring a quantity of a particle in a sample of air may include heating a particle to form a vapor; detecting the particle; measuring a change in quantity of the particle; and indicating the change in quantity.

Abstract: Methods for reducing inclusion content of sputter targets and targets so produced are disclosed. Inclusions may be reduced by adding a small amount of Si to the molten Al or molten Al alloy followed by filtering of the molten metals through a filter medium. Targets having substantially no inclusions therein of greater than about 400 ?m are especially useful in the sputtering of large flat panel displays and result, upon sputtering, in a reduction in the amount of macroparticles sputtered onto the substrate.

Abstract: A system and method are provided for manufacturing workpieces, such as metal articles like sputtering target, the system comprising: comparing one or more physical or chemical values of a respective one of a plurality of metal target blanks to one or more comparable values of at least one desired criterion; selecting one of the metal target blanks from a plurality of metal target blanks as a work-in-progress; assigning a serial route for the work-in-progress; processing the work-in-progress by translating the work-in-progress from note to node with an automated transport, after completion of the events at each node; rejecting or accepting the work-in-progress as a metal target by evaluating a result of at least one event of the one or more respective events to be completed at, at least one of the plurality of nodes.

Abstract: A method for non-destructively detecting the presence of banded regions in a metal is described. The method involves sending an ultrasonic wave into the metal and obtaining reflected signals. The reflected signals are compared with each other to determine variations in signal intensity. A banded region within the metal can be observed as a weaker reflected signal than a reflected backwall signal, thus accurately identifying a location of banding within the metal. Metal articles with a low percent of banding are also described.

Abstract: Methods for reducing inclusion content of sputter targets and targets so produced are disclosed. Inclusions may be reduced by adding a small amount of Si to the molten Al or molten Al alloy followed by filtering of the molten metals through a filter medium. Targets having substantially no inclusions therein of greater than about 400 ?m are especially useful in the sputtering of large flat panel displays and result, upon sputtering, in a reduction in the amount of macroparticles sputtered onto the substrate.

Abstract: A fixture and method is provided for gripping an article, such as a sputtering target. The fixture comprises a base, a first set of contact rollers, and a second set of contact rollers, wherein at least one of the first set and the second set are adjustably positioned relative to the other of the first set and the second set on the base. The contact rollers can be configured as v-grooved wheels that will only touch chamfered portions of an outer diameter of the sputtering target when the contact rollers are clamped against the sputtering target. At least one of the first set and the second set of contact rollers can be pivotally mounted on a slide, with the slide being adjustably positioned on the base of the fixture.

Abstract: A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.

Abstract: A system and method are provided for manufacturing a sputtering target. The system is preferably automated. Sub systems of the manufacturing system include a robotic part handling sub system, a weighing sub system adapted to measure the weight of a part to be manufactured into a sputtering target, and a machining sub system adapted to finish machine a part to be manufactured into a sputtering target. The system can further include a cleaning sub system adapted to clean a part to be manufactured into a sputtering target, an inspection sub system adapted to measure dimensions of a part to be manufactured into a sputtering target, and a feedback control sub system adapted to provide control signals to one or more of the robotic handling sub system, the weighing sub system, the cleaning sub system, and the inspection sub system to control processing performed by one or more of the sub systems.

Abstract: A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.

Abstract: A system and method are provided for manufacturing workpieces, such as metal articles like sputtering target, the system comprising: comparing one or more physical or chemical values of a respective one of a plurality of metal target blanks to one or more comparable values of at least one desired criterion; selecting one of the metal target blanks from a plurality of metal target blanks as a work-in-progress; assigning a serial route for the work-in-progress; processing the work-in-progress by translating the work-in-progress from note to node with an automated transport, after completion of the events at each node; rejecting or accepting the work-in-progress as a metal target by evaluating a result of at least one event of the one or more respective events to be completed at, at least one of the plurality of nodes.

Abstract: A fixture and method is provided for gripping an article, such as a sputtering target. The fixture comprises a base, a first set of contact rollers, and a second set of contact rollers, wherein at least one of the first set and the second set are adjustably positioned relative to the other of the first set and the second set on the base. The contact rollers can be configured as v-grooved wheels that will only touch chamfered portions of an outer diameter of the sputtering target when the contact rollers are clamped against the sputtering target. At least one of the first set and the second set of contact rollers can be pivotally mounted on a slide, with the slide being adjustably positioned on the base of the fixture.