Abstract: An auxiliary control apparatus mechanically couples forces exerted on a manually operable auxiliary hand control knob to an input member of a micro-manipulator of the type used to move a point of an object such as an ultrasonic bonding tool tip relative to a workpiece in scaled ratios of motions at an end of the micro-manipulator input member. The apparatus includes a 4-bar parallelogram linkage which is mounted to a structural support member of a micro-manipulator, and which includes a rear laterally disposed lateral linkage bar pivotably connected to inner and outer parallel longitudinally disposed linkage bars which are pivotably coupled at front ends thereof to a front laterally disposed linkage bar.

Abstract: A method for contextual computer-based instruction concerning a discipline. Information-units that are relevant to the discipline are stored in a computer that includes interactive user-interface software. The user-interface software accepts at least one input data set having a data-type. Data sets are rendered as iconic representations with which the user interacts and can select one or more representations. In response to the selection of one or more iconic representations, the software establishes a selectable list of user-operations available through the software and further enables one of the information units for user-selection through the software on the basis of the currently selected iconic representation. The particular information unit enabled can provide contextually-sensitive information regarding the selected iconic representation.

Abstract: A method and apparatus for confirming whether wire bonds are successfully made to sites on a workpiece by an ultrasonic bonding tool using wire supplied to an entrance bore through the tool from a despooling wire supply spool, and for providing a fault detection status signal if bonds are not successfully made, utilizes an automatic wire despooler which includes a spool drive motor for rotating a wire supply spool to thereby pay out wire from the supply spool to form a drooping catenary-shaped length of slack wire, located between the spool and an output wire guide having an aperture through which wire is supplied to a bonding machine head that supports an ultrasonic bonding tool. The apparatus includes a proximity-type feed sensor for detecting when the catenary straightens and shortens a predetermined amount in response to tension caused by moving the tool tip between successive bond sites, thereby drawing wire out through an exit opening of the bonding tool bore.

Abstract: An apparatus for detecting whether bonding wire supplied to an ultrasonic bonding tool of an ultrasonic bonding machine is present in a bore of the tool tip and providing an alarm signal if a wire segment normally within the bore is absent because of inadvertent breakage or misfeeding of the wire includes an electronic switching and detection module connected between a machine ground terminal connected to a wire supply reel and a bonding tool electrically isolated from the machine ground. In response to an enable signal input to the module prior to making the first of a pair of ultrasonic bonds to interconnect a pair of binding sites by a bonding wire, electronic switching means within the module electrically isolate the machine ground from the tool, and electric continuity detection means within the module determines whether the tool has been brought to voltage level near that of the machine ground by electrical conductive contact between the wire segment within the tool bore, and the bore wall.

Abstract: An automatic ultrasonic wire bonding machine for bonding interconnecting wires to electrically conductive sites on a workpiece includes a gantry which supports a generally downwardly cascaded series of support platforms linearly translatable with respect to the gantry and to one another in response to translation drive signals provided from a remote source to a separate translation motor for each platform. A head support assembly mounted to the last translatable platform in the series rotatably supports via a hollow elongated spindle an orbital bonding tool head rotatable with respect to the head support assembly in response to a rotational drive signals provided to a head rotation motor from a remote source.

Abstract: An automatic ultrasonic wire bonding machine for bonding interconnecting wires to electrically conductive sites on a workpiece includes a gantry which supports a generally downwardly cascaded series of support platforms linearly translatable with respect to the gantry and to one another in response to translation drive signals provided from a remote source to a separate translation motor for each platform. A head support assembly mounted to the last translatable platform in the series rotatably supports via a hollow elongated spindle an orbital bonding tool head rotatable with respect to the head support assembly in response to a rotational drive signals provided to a head rotation motor from a remote source.

Abstract: A machine for automatically making ultrasonic bonds between metallic conductors using a metal bonding wire precisely positions the tip of an ultrasonic bonding tool relative to a workpiece with a positioning mechanism which includes a first, upper tool support platform rollably supported by a support structure and translatable in a first direction with respect to the support structure by a first remotely operable drive motor, at least a second tool support platform rollably supported by the first tool support platform and translatable with respect thereto in a second direction by a second drive motor, and preferably, a third, end tool support platform rollably supported by the second tool support platform and translatable with respect thereto by a third drive motor.

Abstract: An improved apparatus and method for forming a fusion ball at the end of a wire protruding from an ultrasonic bonding tool preparatory to making a ball bond to a workpiece includes shielding means for attenuating electromagnetic interference (EMI) emissions from an electrical arc discharge used to form the ball, which EMI emissions may damage sensitive electronic circuitry on a workpiece. In a preferred embodiment, a ball-forming arc discharge to a wire end occurs with a spark chamber in an electrically conductive electrostatic shield and preferably includes a ferromagnetic shield cup surrounding the chamber. According to the method of the present invention, a capillary ultrasonic bonding tool having a severed end of a gold bonding wire protruding from a capillary bore through the tool is moved away from a vertical line of action between the tool and a workpiece.

Abstract: A micro-manipulator apparatus for precisely positioning the tip of an ultrasonic bonding tool or similar implement relative to a work piece includes a pantograph-like input manipulator mechanism coupled by a downward depending ball joint coupling to the rear end portion of a tool support plate comprising part of a follower mechanism.

Abstract: A Trellis decoder allows for real time decoding of high rate input data more than 10 MHz, with a compact layout and without the need to generate very high speed clocks, by use of a branch metric generator feeding multiple parallel Add/Compare/Select modules, which in turn feed a traceback processor using pre-traceback shift registers and traceback memory. The decoder performs n-state Trellis decoding in real time while simultaneously de-interleaving a multiplexed data stream. The architecture can be expanded to provide programmable length traceback in a fixed number of clock cycles. The invention performs de-interleaving in parallel with the Trellis decoding, and symbols coming out of the decoder need no further processing for de-interleaving. Moreover, the invention allows complete traceback in one symbol period at video rates without the need for very high speed clocks or multi-read port memories. Programmability allows for flexible tradeoff of output error rate and traceback memory space.

Abstract: An ultrasonic bonding method and apparatus utilizes a locking mechanism which limits motion of an ultrasonic bonding tool tip during formation of a bond. In a basic embodiment of tie invention, motion of the tool tip in the up/down, z-axis direction is inhibited during bond formation. Preferably motion in the longitudinal, in/out y-axis direction is also inhibited, and motion in the lateral, x-direction may optionally be limited. A separate locking mechanism or brake is provided for each orthogonal direction in which it is desired to inhibit motion during bond formation. Each brake is actuated in response to a bond initiation command signal, locking the tool tip against motion in particular coordinate directions prior to application of ultrasonic energy to a bond site, and maintaining the tip in that position for a period sufficient to melt wire insulation, weld the stripped wire to a bond site such as the microcircuit pad or lead, and allow the weld to cool and solidify.

Abstract: A micropositioner affording the ability to precisely move the tip of an ultrasonic bonding tool relative to a miniature workpiece such as a microcircuit includes a pantograph-like input manipulator mechanism coupled by a single ball joint coupling to a follower mechanism which supports an ultrasonic transducer support housing from which a transducer and bonding tool attached thereto protrudes. In the preferred embodiment, the input manipulator includes a longitudinally outwardly protruding control arm having a control knob at the outer longitudinal end thereof, for grasping between the thumb and fingers of a human operator. The control arm is coupled to the outer lateral end of a four-bar parallelogram linkage comprising part of a pantograph mechanism, while the inner lateral end of the pantograph mechanism is pivotably connected through vertically and horizontally disposed pivot support bearings to a support structure.

Abstract: An improved tool for ultrasonic wire bonding, and a novel method by which the tool may be semi-automatically threaded with bonding wire are disclosed. The overall exterior shape of the tool is that of an elongated rectangular cross-section bar having at the lower end thereof a tapered, smaller cross-section tip. The tip includes a flattened front toe section for applying ultrasonic energy to wire and a bonding pad, and an upawardly angled oblique lower face rearward of the toe section. A wire guide hole through the tip that has a longitudinal axis that slopes upward at a steeper angle than the oblique lower face has an exit opening in the lower oblique face, just rearward of the front toe section. The guide hole has an enlarged opening in the rear face of the tip. An elongated straight shallow groove formed in a side wall of the tip extends obliquely downwards from the rear face to front face of the tip.

Abstract: A method and apparatus for attaching semiconductor dice to substrates includes a novel die-grasping apparatus and technique which employs a tweezer-like clamping device which has one fixed leg. The second leg of the clamping device is movable laterally towards the fixed leg by means of a linear actuator coupled to the movable leg through a spring. Lateral spacing between the linear actuator and the movable leg is adjustable, allowing the spring to be prestressed to a precisely adjustable value, thereby resulting in a precisely pre-adjustable side-gripping force on the lateral sides of a semiconductor chip or die, ensuring that the fragile die will not be broken by the grasping action. The preferred embodiment employs a micro-manipulator to precisely position a die in place on a molten solder pre-form on a substrate, and a vacuum probe for first placing the pre-form on the substrate.