Abstract: An apparatus, method and kit for dustless repair of a damaged wallboard. The apparatus having an insertion rod which engages a patching element and an insertion brace for inserting the patching element and insertion brace through a hole in the wallboard and adhering the patching element to an inner surface of the wallboard. A dustless method is then provided for patching the hole without producing any environmentally harmful dust. The kit includes all necessary materials for repairing a hole in the wallboard using the dustless method according to this invention.