Patents by Inventor Charles Joseph Buondelmonte

Charles Joseph Buondelmonte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6600659
    Abstract: A new physical design for electronic devices (100) comprises a multi-layer stacked assembly (104-110) of a plurality of pan-shaped conductive units that form the layers of the assembly. Each unit is preferably formed from a single sheet of metal into which electronic components, such as an antenna array (208) or a filter array (314) of a transceiver, have been stamped, cut, or etched, and which is then bent around its periphery to form a pan shape. The pans are oriented to face the same direction, are stacked one on top of another, and are fixedly attached to each other by weld, solder, or adhesive. The electrical components defined by the different units are electrically interconnected in a connectorless manner, preferably by flanges (122, 124) formed in the same sheets of metal as the units themselves and extending between the units. Adjacent units in the stack define electromagnetically isolated chambers, e.g., for the filter array. Some layers perform double duty, e.g.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: July 29, 2003
    Assignee: Avaya Technology Corp.
    Inventors: Ron Barnett, Charles Joseph Buondelmonte, Ilya Alexander Korisch, Louis Thomas Manzione, Richard F Schwartz, Thaddeus Wojcik, Hui Wu
  • Patent number: 6317011
    Abstract: A resonant capacitive coupler (124) couples signals across a gap (126) between signal transmission lines (112, 118) of two printed wiring boards (100, 102). The coupler has a conductive contact member (202 or 302) that is either positioned in close proximity to one of the transmission lines (112) or is connected to the one transmission line via a dielectric (204 or 304), and forms a capacitor therewith. The coupler further has a conductive interconnect member (200 or 300) that is connected to the contact member, and also to the other transmission line (108) either directly (FIG. 3) or via a second conductive contact member (202) (FIG. 2). The conductive interconnect member is dimensioned to have an inductive impedance at the frequency of the signals that equals, and hence cancels out, the capacitive impedance of the one or two capacitors formed by the one or two contact members.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: November 13, 2001
    Assignee: Avaya Technology Corp.
    Inventors: Ron Barnett, Charles Joseph Buondelmonte, Ilya Alexander Korisch, Louis Thomas Manzione, Richard F Schwartz, Hui Wu
  • Patent number: 6188579
    Abstract: A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the pallet and a second portion that is bonded to the bottom surface of the printed wiring board so that the insert is movable, relative to the pallet, in a plane parallel to the PWB. In one embodiment, the pallet includes an opening having a first portion and a second portion that is larger than the first portion, and the first and second portions of the insert fit at least partially in the respective first and second portions of the pallet opening. In another embodiment, the insert has a thickness that is equal to or greater than the thickness of the pallet.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: February 13, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Charles Joseph Buondelmonte, Walter J. Picot
  • Patent number: 6182958
    Abstract: A fixture assembly for securing a component to a heat sink includes a frame having two parallel longitudinal members connected by first and second transverse crossbeams, which together define a receptacle into which a component is received. A spring clip is rotatably attached to the frame and has a position in which the spring clip presses the component against a heat sink. The frame includes at least two depending legs for supporting the frame above the surface of a heat sink, and at least one opening for receiving a fastener that secures the frame to the heat sink. A guide peg or similar positioning structure may also be provided for positioning the frame on the heat sink. The spring clip includes a proximal end having a non-round cross section which is rotatably attached to the first transverse crossbeam of the frame, and a distal end which includes a resilient lip which is detachably engage able with the second transverse crossbeam.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: February 6, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Girard Sidone, Nagesh Ramamoorthy Basavanhally, Charles Joseph Buondelmonte