Abstract: A leadless package receptacle for mounting and interconnecting to electronic devices (e.g. leadless package) which can be interconnected with a second receptacle for packaging such devices, said receptacles having improved spring contact members. The receptacle incorporates a plurality of uniquely designed spring contacts for connection to a printed circuit board or other circuit member in a conventional manner. The spring contacts are arranged and configured within the receptacle to yieldably engage the lower surface of the leadless package so as to maintain a line contact. In addition, each spring member has a separate arm member to engage the spring contact members of the second package. The leadless package includes a chip carrier which has a plurality of conductive areas on the lower surface thereof for engaging the spring contacts. Edge regions are cooperatively disposed on the carrier with respect to locking members on the receptacle for retaining the package in the receptacle.

Abstract: A leadless package receptacle for packaging and mounting electronic devices. The receptacle retains a plurality of spring contacts for soldering to a printed circuit board in a conventional manner and disposed within the receptacle to yieldably engage the lower surface of the package. The chip carrier has a plurality of conductive areas on the lower surface thereof for engaging the spring contacts and further has edge regions cooperatively disposed with respect to locking members on the receptacle for retaining the package in the receptacle. A mounting and removal tool is also disclosed.