Patents by Inventor Charles Kirk
Charles Kirk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240165828Abstract: An end effector for attaching to a robotic arm includes a gripper fixedly attached to a carriage, and a platform. The gripper is configured for being in fluid communication with a vacuum source. The platform has a distal end and a proximal end that is configured for being coupled to the robotic arm. The carriage is operatively coupled to the platform and is configured to move back and forth between the distal and proximal ends of the platform. The gripper may include a plurality of suction cups configured for engaging a package, and the carriage may be configured for lifting the gripper and dragging the package onto the platform while the package is engaged by the gripper.Type: ApplicationFiled: October 28, 2023Publication date: May 23, 2024Inventors: Matthew Churchill, Wayne Kirk, Christopher Naville, Charles Costello, Paul Hvass
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Publication number: 20240121276Abstract: This disclosure describes embodiments of systems, methods, and non-transitory computer-readable storage media that can solve one or more of the foregoing (or other problems) in the art in addition to providing other benefits by applying customized security limitations to a secure digital account, and removing the security limitations based on efficiently verifying personal identity information associated with the secure digital account. For example, the disclosed system can receive a user interaction associated with a secure digital account and determine a fraud risk score corresponding to the interaction. The system can then assign the secure digital account a security tier and apply appropriate security limitations based on the security tier that corresponds with a determined risk of fraud.Type: ApplicationFiled: October 10, 2023Publication date: April 11, 2024Inventors: Joe Levering, Ryan Bahniuk, Lace Cheung, Kevin Shu, Jocelyn Takahashi, Dain Hall, Jeremy Steinberg, Varun Rai, Charles Kirk
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Publication number: 20230075401Abstract: Techniques for configuring a point of sale (POS) system may include using an optical sensing module to read an identifier associated with a POS component and associating the POS component with a zone that is monitored by the optical sensing module, where the zone includes the POS system. In response to optically sensing the identifier, the system may automatically configure the component to function within the POS system.Type: ApplicationFiled: November 14, 2022Publication date: March 9, 2023Inventors: David STEINER, Charles KIRK, Steven LOW, Nancy YAGUDA
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Patent number: 11501275Abstract: Techniques for configuring a point of sale (POS) system may include using an optical sensing module to read an identifier associated with a POS component and associating the POS component with a zone that is monitored by the optical sensing module, where the zone includes the POS system. In response to optically sensing the identifier, the system may automatically configure the component to function within the POS system.Type: GrantFiled: April 5, 2019Date of Patent: November 15, 2022Assignee: Toshiba Global Commerce Solutions Holdings CorporationInventors: David Steiner, Charles Kirk, Steven Low, Nancy Yaguda
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Publication number: 20200320496Abstract: Techniques for configuring a point of sale (POS) system may include using an optical sensing module to read an identifier associated with a POS component and associating the POS component with a zone that is monitored by the optical sensing module, where the zone includes the POS system. In response to optically sensing the identifier, the system may automatically configure the component to function within the POS system.Type: ApplicationFiled: April 5, 2019Publication date: October 8, 2020Inventors: David STEINER, Charles KIRK, Steven LOW, Nancy YAGUDA
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Patent number: 10667429Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.Type: GrantFiled: September 8, 2017Date of Patent: May 26, 2020Assignee: GENERAL ELECTRIC COMPANYInventors: Shakti Singh Chauhan, Hendrik Pieter Jacobus De Bock, Graham Charles Kirk, Stanton Earl Weaver, Jr., David Shannon Slaton, Tao Deng, Pramod Chamarthy
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Publication number: 20170374764Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.Type: ApplicationFiled: September 8, 2017Publication date: December 28, 2017Inventors: SHAKTI SINGH CHAUHAN, HENDRIK PIETER JACOBUS DE BOCK, GRAHAM CHARLES KIRK, STANTON EARL WEAVER, JR., DAVID SHANNON SLATON, TAO DENG, PRAMOD CHAMARTHY
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Patent number: 9839116Abstract: A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.Type: GrantFiled: April 29, 2013Date of Patent: December 5, 2017Assignee: Abaco Systems, Inc.Inventors: Graham Charles Kirk, Zeshan Jabar Hussain
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Patent number: 9826662Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.Type: GrantFiled: December 12, 2013Date of Patent: November 21, 2017Assignee: General Electric CompanyInventors: Joo Han Kim, Graham Charles Kirk, Jay Todd Labhart, Binoy Milan Shah, Yogen Vishwas Utturkar, Pramod Charmarthy, Tao Deng
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Publication number: 20170251572Abstract: A circuit card assembly includes a heat sink, a locking mechanism, and a thermal insert. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downwards along the upper surface thereof. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The thermal insert is disposed within the heat sink and is an elongated member. The thermal insert is configured to contact a portion of at least one of the solid wedges, thus assisting in removing a first amount of thermal energy from the circuit board.Type: ApplicationFiled: October 6, 2014Publication date: August 31, 2017Inventors: Graham Charles KIRK, Shakti Singh CHAUHAN, Stuart CONNOLLY, Zeshan Jabar HUSSAIN
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Publication number: 20170219303Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.Type: ApplicationFiled: April 13, 2017Publication date: August 3, 2017Inventors: Graham Charles Kirk, Stuart Connolly, Tao Deng, Zeshan Jabar Hussain, Binoy Milan Shah
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Patent number: 9658000Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.Type: GrantFiled: January 25, 2013Date of Patent: May 23, 2017Assignee: Abaco Systems, Inc.Inventors: Graham Charles Kirk, Stuart Connolly, Tao Deng, Zeshan Jabar Hussain, Binoy Milan Shah
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Patent number: 9615486Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.Type: GrantFiled: March 26, 2014Date of Patent: April 4, 2017Assignee: General Electric CompanyInventors: Hendrik Pieter Jacobus De Bock, Jay Todd Labhart, Shakti Singh Chauhan, Graham Charles Kirk, Joo Han Kim
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Patent number: 9333599Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.Type: GrantFiled: December 20, 2013Date of Patent: May 10, 2016Assignee: General Electric CompanyInventors: Hendrik Pieter Jacobus de Bock, Stanton Earl Weaver, Jr., Tao Deng, Jay Todd Labhart, Pramod Chamarthy, Shakti Singh Chauhan, Graham Charles Kirk, Brian Patrick Hoden
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Publication number: 20160081177Abstract: A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.Type: ApplicationFiled: April 29, 2013Publication date: March 17, 2016Applicant: GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC.Inventors: Graham Charles KIRK, Zeshan Jabar HUSSAIN
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Patent number: 9253871Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.Type: GrantFiled: October 31, 2013Date of Patent: February 2, 2016Assignee: General Electric CompanyInventors: Joo Han Kim, Hendrik Pieter Jacobus de Bock, Jay Todd Labhart, Shakti Singh Chauhan, Graham Charles Kirk, Stuart Connolly
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Publication number: 20160021788Abstract: An electronic device assembly includes a heat sink coupled to an electronic device to dissipate the heat produced by the electronic device. A heat spreader is coupled between the electronic device and the heat sink to transfer heat from the electronic device to the heat sink. Furthermore, at least one of the electronic device, the heat spreader, and the heat sink is disposed with a disordered carbon coating.Type: ApplicationFiled: April 1, 2015Publication date: January 21, 2016Inventors: Shakti Singh Chauhan, James Neil Johnson, Brian Patrick Hoden, Graham Charles Kirk
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Publication number: 20150282380Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.Type: ApplicationFiled: March 26, 2014Publication date: October 1, 2015Applicant: General Electric CompanyInventors: Hendrik Pieter Jacobus De Bock, Jay Todd Labhart, Shakti Singh Chauhan, Graham Charles Kirk, Joo Han Kim
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Publication number: 20150181763Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.Type: ApplicationFiled: December 20, 2013Publication date: June 25, 2015Applicant: General Electric CompanyInventors: Hendrik Pieter Jacobus de Bock, Stanton Earl Weaver, JR., Tao Deng, Jay Todd Labhart, Pramod Chamarthy, Shakti Singh Chauhan, Graham Charles Kirk, Brian Patrick Hoden
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Publication number: 20150168087Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.Type: ApplicationFiled: December 12, 2013Publication date: June 18, 2015Applicant: General Electric CompanyInventors: Joo Han Kim, Graham Charles Kirk, Jay Todd Labhart, Binoy Milan Shah, Yogen Vishwas Utturkar, Pramod Charmarthy, Tao Deng