Abstract: A reusable device for transporting integrated circuits comprising a hub having a substantially cylindrical shape, a top surface, and a bottom surface, a top flange for connecting to the top surface of the hub and a bottom flange for connecting to the bottom surface of the hub, a tape mechanism for holding the integrated circuits during shipment, and a lock mechanism located on the hub for locking the top and bottom flanges into place on the hub whereby the hub and top and bottom flanges, when assembled, form a reel for shipment of the integrated circuits.

Abstract: A multifunctional shipping container for integrated circuits, and methods of using and reusing the container are described. The compact container coupled with foam inserts is dimensioned to securely ship and store integrated circuits in either tray or reel format. The container with an expandable cavity allows ease of access for loading and unloading the contents at multiple work stations, and may be converted to an in-house "tote". Multifunctionality of the container supports use as a shipping system from the tray or reel supplier, to the IC assembly and test site, to distribution centers, and to the IC customer, thus eliminating multiple costs of disposal, inventory and new shipping materials.

Abstract: Disclosed is a semiconductor device package for a multielement electro-optical device. The package includes a base structure, a cover and an environmental seal. The cover is secured with screws to the base structure and sealed at this interface to provide an environmentally protected package. The base structure includes a base member and a fine geometry lead pattern substrate loosely attached to the base member internal to the package. Connector pins are mounted either in retainer blocks or in the substrate attached to the base. The multielement electro-optical device is mounted upon a support member and its elements electrically coupled to leads to provide for testing prior to incorporation into the package. The device and support member or members constitute a subassembly which is electrically coupled to the lead pattern of the package substrate.