Abstract: A dual string packer may be provided with a crossover module located such that fluid communication may be provided from any tubular bore to the internal shifting chamber without completely disassembling the dual string packer. The crossover module may be attached to the through tubing mandrels at or near the bottom or lower end of the dual string packer.

Abstract: In order to overcome the need to completely disassemble a dual or even possibly a multiple string packer on the rig floor and avoid the delays and potential for failure that such a rebuild entails, a dual string packer may be provided with a crossover module located such that fluid communication may be provided from any tubular bore to the internal shifting chamber without completely disassembling the dual string packer. an indexing cassette may be attached to the through tubing mandrels at or near the bottom or lower end of the dual string packer.

Abstract: Methods are described for fabricating semiconductor devices and transistors thereof, in which a patterned gate length is measured and offset spacers are formed along the sides of the patterned gate prior to drain extension implants, wherein the offset spacer width is controlled according to the measured gate length. This facilitates consistent control over transistor channel length despite variability in the patterned gate length dimension from wafer to wafer and/or from lot to lot.