Abstract: A modular system for manufacturing includes a modular housing, at least one manufacturing platform disposed within the modular housing for direct digital manufacturing of an item, and a modular grid for power and network connections positioned along a plurality of interior walls of the modular housing.

Abstract: A method of additive manufacturing of an object includes directing laser energy from a laser to a region for material deposition, extruding material using an extruder at the region of material deposition, sensing temperature within the region of the material deposition, and electronically controlling the laser energy using the temperature so as to sufficiently heat the region for material deposition prior to extruding the material to increase strength of the object.

Abstract: A method of additive manufacturing of an object may include directing laser energy from a laser to a region for material deposition, extruding material using an extruder at the region of material deposition, sensing temperature within the region of the material deposition, and electronically controlling the laser energy using the temperature so as to sufficiently heat the region for material deposition prior to extruding the material to increase strength of the object. The method may include hardening or freezing extruded material through cooling in real-time.

Abstract: An apparatus for use in 3D fabrication includes a heat sink, a melt tube extending through the heat sink, the melt tube having a first end and an opposite second end and adapted for melting filament or other material as the material is conveyed from the first end to the second end, a pen tip having an opening therein for ejecting melted material, the pen tip at the second end of the melt tube, and a pen tip holder for securely holding the pen tip during printing, the pen tip holder having a heater element associated therewith.

Abstract: A reflector assembly includes a monolithic and adaptive reflector having a single and continuous reflecting surface and a focusing shape. The reflector assembly further includes a plurality of trusses for supporting the monolithic and adaptive reflector and a plurality of actuators, each of the plurality of actuators operatively connected to one of the plurality of trusses. Actuation of each of the plurality of actuators exerts a force which flexes at least a portion of the continuous reflecting surface.

Abstract: An apparatus includes a rigid frame or girder system, a first computer controlled motion system associated with the rigid frame or girder system and configured to move in coordinated positions, a second computer controlled motion system associated with a part to be worked on and configured to move in coordinated positions, and a plurality of sensors associated with the first motion system and the second motion system. The first computer controlled motion system and the second computer controlled motion system use information from the plurality of sensors to assist in coordination between the first computer controlled motion system and the second computer controlled motion system.

Abstract: A method of additive manufacturing of an object may include directing laser energy from a laser to a region for material deposition, extruding material using an extruder at the region of material deposition, sensing temperature within the region of the material deposition, and electronically controlling the laser energy using the temperature so as to sufficiently heat the region for material deposition prior to extruding the material to increase strength of the object. The method may include hardening or freezing extruded material through cooling in real-time.

Abstract: A method of additive manufacturing of an object includes directing laser energy from a laser to a region for material deposition, extruding material using an extruder at the region of material deposition, sensing temperature within the region of the material deposition, and electronically controlling the laser energy using the temperature so as to sufficiently heat the region for material deposition prior to extruding the material to increase strength of the object.

Abstract: An apparatus includes a rigid frame or girder system, a first computer controlled motion system associated with the rigid frame or girder system and configured to move in coordinated positions, a second computer controlled motion system associated with a part to be worked on and configured to move in coordinated positions, and a plurality of sensors associated with the first motion system and the second motion system. The first computer controlled motion system and the second computer controlled motion system use information from the plurality of sensors to assist in coordination between the first computer controlled motion system and the second computer controlled motion system.

Abstract: An apparatus for use in 3D fabrication includes a heat sink, a melt tube extending through the heat sink, the melt tube having a first end and an opposite second end and adapted for melting filament or other material as the material is conveyed from the first end to the second end, a pen tip having an opening therein for ejecting melted material, the pen tip at the second end of the melt tube, and a pen tip holder for securely holding the pen tip during printing, the pen tip holder having a heater element associated therewith.

Abstract: A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may include arranging first and second unsintered ceramic layers and the at least one capacitive structure therebetween. The at least one capacitive structure may include a pair of electrode layers, an inner dielectric layer between the pair of electrode layers, and at least one outer dielectric layer adjacent at least one of the electrode layers and opposite the inner dielectric layer. The at least one outer dielectric layer preferably has a dielectric constant less than a dielectric constant of the inner dielectric layer. The unsintered ceramic layers and the at least one capacitive structure may also be heated, and at least one electronic device may be mounted on the LTCC substrate and electrically connected to the at least one embedded capacitive structure.

Abstract: A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may include arranging first and second unsintered ceramic layers and the at least one capacitive structure therebetween. The at least one capacitive structure may include a pair of electrode layers, an inner dielectric layer between the pair of electrode layers, and at least one outer dielectric layer adjacent at least one of the electrode layers and opposite the inner dielectric layer. The at least one outer dielectric layer preferably has a dielectric constant less than a dielectric constant of the inner dielectric layer. The unsintered ceramic layers and the at least one capacitive structure may also be heated, and at least one electronic device may be mounted on the LTCC substrate and electrically connected to the at least one embedded capacitive structure.

Abstract: An electro-fluidic device may include a substrate having at least one substrate fluid passageway therein, and at least one substrate electrical conductor carried by the substrate. Moreover, an external interface may be spaced from the substrate and include at least one interface electrical conductor. The electro-fluidic device may also include at least one electro-fluidic interconnect extending between the substrate and the external interface. More particularly, the at least one electro-fluidic interconnect may include an interconnect body having at least one interconnect fluid passageway extending therethrough and connected to the at least one substrate fluid passageway, and at least one interconnect electrical conductor carried by the interconnect body. The at least one interconnect electrical conductor may connect the at least one substrate electrical conductor and the at least one interface electrical connector.

Abstract: A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may include arranging first and second unsintered ceramic layers and the at least one capacitive structure therebetween. The at least one capacitive structure may include a pair of electrode layers, an inner dielectric layer between the pair of electrode layers, and at least one outer dielectric layer adjacent at least one of the electrode layers and opposite the inner dielectric layer. The at least one outer dielectric layer preferably has a dielectric constant less than a dielectric constant of the inner dielectric layer. The unsintered ceramic layers and the at least one capacitive structure may also be heated, and at least one electronic device may be mounted on the LTCC substrate and electrically connected to the at least one embedded capacitive structure.

Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

Abstract: A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a plurality of unsintered ceramic layers having passageways therein. The plurality of unsintered ceramic layers and at least one resistive element may be assembled in stacked relation so that the passageways align to define the fluid cooling circuit and so that the at least one resistive element extends in a cantilever fashion into the vertical passageway. Furthermore, the unsintered ceramic layers and the at least one resistive element may be heated to sinter and to cause the at least one resistive element to soften and deform downwardly adjacent vertical sidewall portions of the vertical passageway. The method may also include mounting at least one electronic device on the cooling substrate in thermal communication with the fluid cooling circuit.

Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a plurality of cooling fluid dissociation electrodes carried by the cooling substrate for dissociating cooling fluid to control a pressure thereof. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber.