Patents by Inventor Charles Ney

Charles Ney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050005606
    Abstract: A compressor includes first-stage and second-stage impellers arranged back-to-back such that fluid is discharged from the first-stage impeller into a generally annular interstage duct that conducts the fluid into the second-stage impeller and the fluid discharged from the second-stage impeller enters into a volute that is arranged generally concentrically within the interstage duct. A discharge duct from the volute passes through the interstage duct at one circumferential location. An array of non-axisymmetric deswirl vanes is arranged upstream of the second-stage impeller. One of the vanes is thick and envelops the discharge duct. The remaining vanes are thinner and are differently configured about the circumference of the vane array to account for the flowfield effects of the thick vane.
    Type: Application
    Filed: July 11, 2003
    Publication date: January 13, 2005
    Inventors: Gary Vrbas, Charles Ney
  • Patent number: 6834501
    Abstract: A compressor includes first-stage and second-stage impellers arranged back-to-back such that fluid is discharged from the first-stage impeller into a generally annular interstage duct that conducts the fluid into the second-stage impeller and the fluid discharged from the second-stage impeller enters into a volute that is arranged generally concentrically within the interstage duct. A discharge duct from the volute passes through the interstage duct at one circumferential location. An array of non-axisymmetric deswirl vanes is arranged upstream of the second-stage impeller. One of the vanes is thick and envelops the discharge duct. The remaining vanes are thinner and are differently configured about the circumference of the vane array to account for the flowfield effects of the thick vane.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: December 28, 2004
    Assignee: Honeywell International, Inc.
    Inventors: Gary Vrbas, Charles Ney