Patents by Inventor Charles R. Lindemulder

Charles R. Lindemulder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6541699
    Abstract: An improved electromagnetic interference connection between a pair of electromagnetic interference enclosures that provides electromagnetic compatibility for electrical devices housed in the pair of electromagnetic interference enclosures. The connection includes of a detachable lap joint integrally formed along a first pair of edges in a first electromagnetic interference enclosure and a second pair of edges in a second electromagnetic interference enclosure. The lap joint forms a detachable overlapping metallic joint between the pair of electromagnetic interference enclosures that prevents electromagnetic emissions from the joint without the use of seals or fasteners.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: April 1, 2003
    Assignee: Avaya Technology Corp.
    Inventors: Charles R. Lindemulder, Michael L. Nienaber
  • Patent number: 5989061
    Abstract: The low profile backplane jumper board is mounted over the connector pins on the circuit pack side of the backplane to thereby selectively interconnect designated conductors in the connectors. These interconnections among connector conductors can be within a single connector or can span multiple connecters. The low profile backplane jumper board comprises a circuit board that contains holes for each of the backplane connector pins over which it is inserted. The ones of these holes that require an electrical connection to the associated backplane connector conductor are filled with a miniature spring socket assembly contact which is soldered to or press fit into the plated hole and associated conductors formed on the surface of the circuit board to interconnect a plurality of the holes formed in the circuit board. The thickness of the circuit board is selected to be of sufficient thinness to not interfere with the connection of the circuit packs to the associated connectors.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: November 23, 1999
    Assignee: Lucent Technologies Inc.
    Inventors: Mark F. Amberg, Charles R. Lindemulder, Michael L. Nienaber
  • Patent number: 5937130
    Abstract: The present method and apparatus for installing fiber optic jumper cables in an equipment enclosure enables the simple installation of fiber optic jumper cables in an equipment enclosure that is provisioned with traditional wire jumper cables and connectors. This apparatus includes a fiber optic pass through tool that enables the craftsperson to thread the fiber optic jumper cables through the equipment enclosure with minimal effort and avoids damage to the fiber optic jumper cable. The fiber optic pass through tool comprises two parts: an extender and a hybrid fiber optic coupling adapter. The extender provides the craftsperson with sufficient reach to pull the fiber optic jumper cable through the entire length of the equipment enclosure, with sufficient flexibility to bend the tool around comers, and yet with sufficient stiffness to control the passage of the tool through the equipment enclosure.
    Type: Grant
    Filed: April 20, 1998
    Date of Patent: August 10, 1999
    Inventors: Mark F. Amberg, Robert Leonard Bryant, Jr., Charles R. Lindemulder
  • Patent number: 5926540
    Abstract: For use with a rack having a carrier backplane and capable of receiving modular circuit packs therein to be coupled to the carrier backplane, a circuit pack cable adapter that allows the modular circuit packs additionally to process signals originating from other than the carrier backplane, and a method of operation thereof. The circuit pack cable adapter includes: (1) a cable interface proximate a rear end of the circuit pack cable adapter and (2) an extension cable, coupled to the cable interface and couplable via the cable interface to a main cable passing through an aperture in the carrier backplane proximate the rear end, the extension cable deployable from a front end of the circuit pack cable adapter to at least one of the modular circuit packs to allow the modular circuit packs additionally to process signals originating from the main cable.
    Type: Grant
    Filed: March 5, 1997
    Date of Patent: July 20, 1999
    Assignee: Lucent Technologies Inc.
    Inventor: Charles R. Lindemulder