Abstract: A non-dedicated pallet assembly (10) is provided to carry and precisely position a plurality of integrated circuit package (12). The pallet assembly includes an exterior frame subassembly (14) encompassing an interior frame subassembly (16) formed to include a plurality of receiving nests (48) arrayed in rows thereon. Each receiving nest (48) is adapted to receive a modular package holder (18) in one of several selectable rotational orientations. The preferred modular package holders (18) may be in the form of a finger support holder (126), a surface protection holder (128) or a multi-nest holder (130), each conformed to the shape and dimensions of a selected package (12). Vertical support to the package holders (18) and the packages (12) is provided by a leaf spring (60) associated with each receiving nest (48) and by an openable and closable gate subassembly (20) associated with each pair of rows of receiving nests (48).

Abstract: A non-dedicated pallet assembly (10) is provided to carry and precisely position a plurality of integrated circuit packages (12). The pallet assembly includes an exterior frame subassembly (14) emcompassing an interior frame subassembly (16) formed to include a plurality of receiving nests (48) arrayed in rows thereon. Each receiving nest (48) is adapted to receive a modular package holder (18) in one of several selectable rotational orientations. The preferred modular package holders (18) may be in the form of a finger support holder (126), a surface protection holder (128) or a multi-nest holder (130), each conformed to the shape and dimensions of a selected package (12). Vertical support to the package holders (18) and the packages (12) is provided by a leaf spring (60) associated with each receiving nest (48) and by an openable and closable gate subassembly (20) associated with each pair of rows of receiving nests (48).