Patents by Inventor Charles Singleton

Charles Singleton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9003642
    Abstract: The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: April 14, 2015
    Assignee: Intel Corporation
    Inventors: Jeffrey Wienrich, Charles Singleton
  • Publication number: 20120321430
    Abstract: The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.
    Type: Application
    Filed: August 30, 2012
    Publication date: December 20, 2012
    Inventors: Jeff Wienrich, Charles Singleton
  • Patent number: 8276262
    Abstract: Aspects of the present disclosure may include an apparatus for enclosing a thin wafer to prevent damage during an on-going manufacture of integrated circuit chip(s) on or in the thin wafer, and methods of utilizing the apparatus. The apparatus may include a lower support assembly and an upper retainer assembly which retains a thin wafer therebetween, wherein the lower support assembly and the upper retainer assembly may be coupled together by a magnetic attractive force.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: October 2, 2012
    Assignee: Intel Corporation
    Inventors: Jeff Wienrich, Charles Singleton
  • Patent number: 8222118
    Abstract: A method of relieving stress in a semiconductor wafer and providing a wafer backside surface finish capable of hiding cosmetic imperfections. Embodiments of the invention include creating a wafer backside surface which can be used for all dies on the semiconductor wafer intended for different product applications and be deposited with backside metallization (BSM) material. The method provides a rough texture on the wafer backside followed by isotropic etching of the wafer backside to recover the wafer strength as well as to preserve the rough texture of the wafer backside. After wafer backside metallization, the rough texture of the wafer backside hides cosmetic imperfections introduced by subsequent processes.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: July 17, 2012
    Assignee: Intel Corporation
    Inventors: Mark Dydyk, Arturo Urquiza, Charles Singleton, Tim McIntosh
  • Publication number: 20100151678
    Abstract: A method of relieving stress in a semiconductor wafer and providing a wafer backside surface finish capable of hiding cosmetic imperfections. Embodiments of the invention include creating a wafer backside surface which can be used for all dies on the semiconductor wafer intended for different product applications and be deposited with backside metallization (BSM) material. The method provides a rough texture on the wafer backside followed by isotropic etching of the wafer backside to recover the wafer strength as well as to preserve the rough texture of the wafer backside. After wafer backside metallization, the rough texture of the wafer backside hides cosmetic imperfections introduced by subsequent processes.
    Type: Application
    Filed: December 15, 2008
    Publication date: June 17, 2010
    Inventors: Mark Dydyk, Arturo Urquiza, Charles Singleton, Tim McIntosh
  • Publication number: 20100135764
    Abstract: The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.
    Type: Application
    Filed: December 3, 2008
    Publication date: June 3, 2010
    Inventors: Jeff Wienrich, Charles Singleton
  • Publication number: 20060238561
    Abstract: Various embodiments of a printing system including a vacuum duct are disclosed.
    Type: Application
    Filed: April 26, 2005
    Publication date: October 26, 2006
    Inventors: Anthony Carcia, Alan Shibata, Rick Tanaka, Justin Roman, Tanya Schneider, Charles Singleton, Shayler Backlund, Ernesto Garay, Angela Krauskopf
  • Publication number: 20040255490
    Abstract: An article of apparel (1, 601) has a chamber (9, 605) and a light source (11, 607) for illuminating the chamber with Light. The chamber (9) contains particles (900) which can scatter or reflect light from the light sources and has a window (9a) through which the effect of the particles (900) on the light from the light sources (11) can be viewed. Alternatively, the chamber (605) contains a light affecting means (606, 901, 1001) for reflecting, refracting or diffracting light from the light source (607). The light affecting means (606, 901, 1001) is moved by a hydraulic system (800) or vibrates in response to motion of the article of apparel (601).
    Type: Application
    Filed: January 30, 2004
    Publication date: December 23, 2004
    Inventors: Kin Yip Wan, Leo Charles Singleton, Christopher Jon Ford, David Bernard Mapleston