Abstract: A method includes characterizing the effects of an electric field on a first set of printed wiring boards (PWBs) by testing the first set of PWBs to generate test data, using the test data to determine a dielectric life curve of the first set of PWBs, and based on the dielectric life curve, defining a screening time and a screening voltage to screen for premature failures in a second set of PWBs due to electric fields.

Abstract: A modular electronic control system is disclosed. The modular electronic control system may have a base control unit to which one or more internal subsystem module and/or external subsystem module may be mounted. Each subsystem module may perform a different function, or may connect with different sensors/effectors, however, each subsystem module has a standardized subsystem module mounting apparatus by which it can mechanically and electrically connect to the base control unit. As such, a standardized base control unit may receive any type of internal subsystem module and/or external subsystem module and intermediate communication and power provision between subsystem module and other aircraft systems, such as an aircraft data network.

Abstract: Embodiments are directed to an apparatus comprising a thermal block coupled to an electronic device, a thermal strap coupled to the thermal block, and retention hardware coupled to the thermal strap and configured to retain the thermal block within the thermal strap when the apparatus is exposed to at least one variable environmental condition.

Abstract: A method includes characterizing the effects of an electric field on a first set of printed wiring boards (PWBs) by testing the first set of PWBs to generate test data, using the test data to determine a dielectric life curve of the first set of PWBs, and based on the dielectric life curve, defining a screening time and a screening voltage to screen for premature failures in a second set of PWBs due to electric fields.

Abstract: A sealing washer assembly includes a main washer with a bottom annular groove for a removable O-ring and a top recess for a sealing washer. A fastener such as a screw or bolt passes through the sealing washer and the main washer, into a hole in a mounting surface. When the fastener is tightened, the main washer is clamped to the mounting surface to create a metal-to-metal seal, the O-ring is deformed to create a seal between the main washer and the mounting surface, and the sealing washer is deformed to create a seal between the fastener and the main washer.

Abstract: A sealing washer assembly includes a main washer with a bottom annular groove for a removable O-ring and a top recess for a sealing washer. A fastener such as a screw or bolt passes through the sealing washer and the main washer, into a hole in a mounting surface. When the fastener is tightened, the main washer is clamped to the mounting surface to create a metal-to-metal seal, the O-ring is deformed to create a seal between the main washer and the mounting surface, and the sealing washer is deformed to create a seal between the fastener and the main washer.

Abstract: An assembly includes a housing, a first locking rail, and a second locking rail. The housing has first and second sidewalls. First and second guiderails extend from the first sidewall toward the second sidewall. Third and fourth guiderails extend from the second sidewall toward the first sidewall. The first locking rail is positioned between the first guiderail and the second guiderail. The first locking rail has a first surface nearest the first guiderail and a second surface nearest the second guiderail. The first surface is inclined with respect to the second surface. The second locking rail is positioned between the third guiderail and the fourth guiderail. The second locking rail has a third surface nearest the third guiderail and a fourth surface nearest the fourth guiderail. The third surface is inclined with respect to the fourth surface.

Abstract: An adaptor for connecting ball grid array components to a circuit board with a leaded grid array joint, utilizing electric leads which can connect to a ball grid array on one end and a leaded grid array pad pattern on the opposite end.

Abstract: An adaptor for connecting ball grid array components to a circuit board with a leaded grid array joint, utilizing electric leads which can connect to a ball grid array on one end and a leaded grid array pad pattern on the opposite end.