Patents by Inventor Charles Vandommelen

Charles Vandommelen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5689089
    Abstract: An electronic control module (10) includes a package substrate (12) having an interior cavity (28) through which a package lead (22) traverses. The interior cavity (28) is filled with an expandable polymer material (34). The expandable polymer material (34) is constrained within the cavity by a pressure resistive layer (32, 35) that overlies expandable polymer material (34) In one embodiment, an epoxy layer (32) forms an upper surface of the interior cavity (28). The expandable polymer material (34) is responsive to a fluid, such that upon contact with a fluid diffusing along the package lead (22), the expandable polymer material (34) will swell and form a fluid-tight pressure seal around the package lead (22). The fluid-tight pressure seal prevents the fluid from diffusing to interior portions of the electronic control module (10) and causing the failure of electronic components (18) mounted within the electronic module (10).
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: November 18, 1997
    Assignee: Motorola, Inc.
    Inventors: Anthony J. Polak, Charles Vandommelen, Fred E. Ostrem