Abstract: Passivating coatings are formed on populated electronic boards, such as a sealed chip on board electronic module, or the like, using a high density plasma deposition method that employs an electron cyclotron resonance (ECR) reactor. A populated electronic board is disposed in the electron cyclotron resonance reactor. A high density nitride plasma is generated by means of electron resonance in the reactor. The plasma is formed adjacent to a magnetic field coil where an ECR condition is established. The high density plasma forms a passivating coating that covers the populated electronic board with a silicon nitride passivating layer. To form the plasma, a mixture of silane and ammonia may be injected into the reactor to produce excited atoms that form a substantially oxygen-free nitride passivating coating.

Abstract: A system for thinning wafers includes thickness measuring apparatus that provides information to a computer for generating a memory map of the wafer surface. The memory map is used to control a material removal apparatus that thins the wafer to a uniform thickness.

Abstract: A system for fabricating optical elements includes a source of optical radiation that provides an optical beam, the system includes an intensity controller in the path of the beam. The intensity controlled beam is directed toward a substrate disposed on a stage. The stage is adopted to be controllably translated in accordance with an optical intensity map.

Abstract: A process is described for the formation of high temperature superconducting materials from perovskites by inductively coupled plasma assisted oxidation. An inductively coupled plasma reactor is used to oxidize oxygen deficient perovskites in less time and at lower temperatures than previously possible. High power densities are created within the plasma reactor. This is thought to contribute to the rapid and low temperature phase change during oxidation from tetragonal to orthorhombic crystal structure apparently required for superconductivity at temperatures greater than approximately 77.degree. K. The low temperature and rapid processing time permits the application of conventional lithographic semiconductor manufacturing techniques to be applied to the potentially high temperature superconducting perovskite materials.