Patents by Inventor Charlie Centofante
Charlie Centofante has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110315987Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.Type: ApplicationFiled: September 2, 2011Publication date: December 29, 2011Inventors: Warren Middlekauff, Robert Miller, Charlie Centofante
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Patent number: 8013332Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.Type: GrantFiled: October 20, 2006Date of Patent: September 6, 2011Assignee: SanDisk Technologies Inc.Inventors: Warren Middlekauff, Robert Miller, Charlie Centofante
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Patent number: 7928010Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.Type: GrantFiled: October 20, 2006Date of Patent: April 19, 2011Assignee: SanDisk CorporationInventors: Warren Middlekauff, Robert Miller, Charlie Centofante
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Publication number: 20080185582Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.Type: ApplicationFiled: October 20, 2006Publication date: August 7, 2008Inventors: Warren Middlekauff, Robert Miller, Charlie Centofante
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Publication number: 20080096317Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.Type: ApplicationFiled: October 20, 2006Publication date: April 24, 2008Inventors: Warren Middlekauff, Robert Miller, Charlie Centofante
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Patent number: 7232074Abstract: A memory chip and embedded microprocessor (‘smart memory card’) with a sputtered memory ring for additional memory capacity. The card configuration allows use with ISO 7816 compliant readers. The smart memory card has a spring bolt-hole which allows use of the smart memory card on an adaptor with compact disc and digital video disc drives. The memory chip and sputtered memory ring have sufficient capacity for high-density memory applications such as high-level encrypted security systems, biometric identification systems, and combination access systems. The processor configuration may include a wireless transceiver for 802.11 series, Bluetooth™ and other wireless systems.Type: GrantFiled: September 30, 2004Date of Patent: June 19, 2007Inventors: Morgan Maher, Charlie Centofante, Thomas Maher, Larry Maher, Jim Jacques
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Publication number: 20060065742Abstract: A memory chip and embedded microprocessor (‘smart memory card’) with a sputtered memory ring for additional memory capacity. The card configuration allows use with ISO 7816 compliant readers. The smart memory card has a spring bolt-hole which allows use of the smart memory card on an adaptor with compact disc and digital video disc drives. The memory chip and sputtered memory ring have sufficient capacity for high-density memory applications such as high-level encrypted security systems, biometric identification systems, and combination access systems. The processor configuration may include a wireless transceiver for 802.11 series, Bluetooth™ and other wireless systems.Type: ApplicationFiled: September 30, 2004Publication date: March 30, 2006Inventors: Charlie Centofante, Morgan Maher, Larry Maher, Jim Jacques, Thomas Maher
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Patent number: 5490891Abstract: A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.Type: GrantFiled: December 1, 1994Date of Patent: February 13, 1996Assignee: Duel SystemsInventors: Jim Farquhar, Ken Dorf, Brandt Weibezahn, Iggoni Fajardo, Charlie Centofante
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Patent number: 5397857Abstract: A container for a memory card and the process by which the container is manufactured. The container comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The frame has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.Type: GrantFiled: July 15, 1993Date of Patent: March 14, 1995Assignee: Dual SystemsInventors: Jim Farquhar, Charlie Centofante, Ken Dorf, Brandt Weibezahn, Iggoni Fajardo