Patents by Inventor Charlie McAndrew

Charlie McAndrew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6326738
    Abstract: An apparatus for illuminating an electronic display such as an LCD. A single hot wire is connected to multiple capacitors each dedicated to a cold cathode fluorescent tube, and multiple tubes are incorporated to illuminate the electronic display. Multiple hot wires are eliminated to eliminate excessive electrical losses and to reduce manufacturing cost.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: December 4, 2001
    Assignee: Innova Electronics, Inc.
    Inventor: Charlie McAndrew
  • Patent number: 6095404
    Abstract: A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.
    Type: Grant
    Filed: September 27, 1999
    Date of Patent: August 1, 2000
    Assignee: Innova Electronics, Inc.
    Inventor: Charlie McAndrew
  • Patent number: 6066402
    Abstract: A system for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: May 23, 2000
    Assignee: Innova Electronics, Inc.
    Inventor: Charlie McAndrew