Patents by Inventor Chase Liao

Chase Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a wire package
    Patent number: 6931830
    Abstract: A method for making a wire package for use as staples or brads is recited as forming a plurality of round wires, forming a plurality of flattened bonding sides on each wire to prepare even bonding surfaces on each wire and bonding each wire to an adjacent wire by adhering the surfaces of each wire. Each staple includes two or more flat surfaces to improve the bonding strength of each staple.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: August 23, 2005
    Inventor: Chase Liao
  • Method of forming a wire package
    Publication number: 20040118100
    Abstract: A method for making a wire package for use as staples or brads is recited as forming a plurality of round wires, forming a plurality of flattened bonding sides on each wire to prepare even bonding surfaces on each wire and bonding each wire to an adjacent wire by adhering the surfaces of each wire. Each staple includes two or more flat surfaces to improve the bonding strength of each staple.
    Type: Application
    Filed: December 23, 2002
    Publication date: June 24, 2004
    Inventor: Chase Liao