Abstract: A carrier structure is provided with a plurality of package substrates connected via connecting sections, and a functional element and a groove are formed on the connecting section, such that the groove is located between the package substrate and the functional element. Therefore, when a cladding layer covering a chip is formed on the package substrate, the groove can accommodate a glue material overflowing from the cladding layer to prevent the glue material from contaminating the functional element.

Abstract: A power supply with lightning protection includes a surge voltage suppression apparatus, an electromagnetic interference control circuit, a surge current bypass apparatus, an active bridge rectifier circuit, a power factor correction circuit, and a DC-to-DC conversion circuit. The surge voltage suppression apparatus is used to increase a tolerance of a surge voltage for the power supply. The electromagnetic interference control circuit is coupled to the surge voltage suppression apparatus. The surge current bypass apparatus is used to increase a tolerance of a surge current for the power supply. The active bridge rectifier circuit is used to rectify an input voltage. The power factor correction circuit is used to adjust the rectified input voltage to provide an adjusted input voltage on a bulk capacitor. The DC-to-DC conversion circuit is used to convert the adjusted input voltage into a DC output voltage.

Abstract: An inductor package is described comprising a mold interconnection substrate having an embedded spiral coil inductor, a fan-out redistribution layer connected to the spiral coil inductor by a copper post wiring structure, a ferrite toroid coil in between the copper posts, and a semiconductor die mounted on the mold interconnection substrate and connected to the fan-out redistribution layer.

Abstract: A single-side stack up system in package is described. The system in package comprises a first interconnection having redistribution layers therein and having a top surface and a bottom surface, at least one first silicon die mounted on the top surface of the first interconnection and embedded in a first molding compound, at least one first passive component mounted on the top surface of the first interconnection side-by-side with the at least one first silicon die and embedded in a second molding compound, and solder balls mounted on the bottom surface of the first interconnection wherein the solder balls provide package output.

Abstract: A power supply with lightning protection includes a surge voltage suppression apparatus, an electromagnetic interference control circuit, a surge current bypass apparatus, an active bridge rectifier circuit, a power factor correction circuit, and a DC-to-DC conversion circuit. The surge voltage suppression apparatus is used to increase a tolerance of a surge voltage for the power supply. The electromagnetic interference control circuit is coupled to the surge voltage suppression apparatus. The surge current bypass apparatus is used to increase a tolerance of a surge current for the power supply. The active bridge rectifier circuit is used to rectify an input voltage. The power factor correction circuit is used to adjust the rectified input voltage to provide an adjusted input voltage on a bulk capacitor. The DC-to-DC conversion circuit is used to convert the adjusted input voltage into a DC output voltage.

Abstract: A power conversion module includes a circuit board and a transformer mounted on the circuit board. The transformer includes a primary winding, a plurality of secondary windings, and a magnetic core assembly. The secondary winding includes a plurality of conductive plates each has a main body, two pins and two intermediate segments. The two pins extends along a first direction and couples to the main body via intermediate segments extending along a second direction; the transformer is electrically connected to the circuit board through the pins; wherein the main body has an opening, and the intermediate segments are positioned at two sides of the opening. The magnetic core assembly includes a middle post, and a coil section of the primary winding and the main bodies of the conductive plates are arranged in a staggered configuration and surround the middle post.