Patents by Inventor CHE-HSANG HUANG
CHE-HSANG HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9899587Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.Type: GrantFiled: February 16, 2017Date of Patent: February 20, 2018Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: Yau-Tzu Jang, Yu-Liang Huang, Wen-Liang Tseng, Pin-Chuan Chen, Lung-Hsin Chen, Hsing-Fen Lo, Chao-Hsiung Chang, Che-Hsang Huang, Yu-Lun Hsieh
-
Publication number: 20170162477Abstract: A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.Type: ApplicationFiled: February 16, 2017Publication date: June 8, 2017Inventors: YAU-TZU JANG, YU-LIANG HUANG, WEN-LIANG TSENG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, HSING-FEN LO, CHAO-HSIUNG CHANG, CHE-HSANG HUANG, YU-LUN HSIEH
-
Patent number: 9620692Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.Type: GrantFiled: October 7, 2015Date of Patent: April 11, 2017Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: Yau-Tzu Jang, Yu-Liang Huang, Wen-Liang Tseng, Pin-Chuan Chen, Lung-Hsin Chen, Hsing-Fen Lo, Chao-Hsiung Chang, Che-Hsang Huang, Yu-Lun Hsieh
-
Publication number: 20160027983Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.Type: ApplicationFiled: October 7, 2015Publication date: January 28, 2016Inventors: YAU-TZU JANG, YU-LIANG HUANG, WEN-LIANG TSENG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, HSING-FEN LO, CHAO-HSIUNG CHANG, CHE-HSANG HUANG, YU-LUN HSIEH
-
Patent number: 9184358Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.Type: GrantFiled: October 22, 2013Date of Patent: November 10, 2015Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: Yau-Tzu Jang, Yu-Liang Huang, Wen-Liang Tseng, Pin-Chuan Chen, Lung-Hsin Chen, Hsing-Fen Lo, Chao-Hsiung Chang, Che-Hsang Huang, Yu-Lun Hsieh
-
Patent number: 9041022Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.Type: GrantFiled: August 27, 2013Date of Patent: May 26, 2015Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: Che-Hsang Huang, Pin-Chuan Chen, Lung-Hsin Chen, Wen-Liang Tseng, Yu-Liang Huang
-
Publication number: 20140321127Abstract: An LED module for use in a direct-type backlight module includes a printed circuit board, an LED arrange on the printed circuit board and electrically connected to the printed circuit board, and a lens covering the LED and fixed on the printed circuit board. A reflective layer is arranged on the printed circuit board. A semi-transparent surface is recessed and tampered from a top of a column-shaped protrusion at a center of the lens towards the LED. Part of light beams emitted from a center of the LED is refracted and diffused by the semi-transparent surface to an outside, and another part of the light beams emitted from a center of the LED is reflected by the semi-transparent surface to the reflective layer, and then reflected by the reflective layer to the outside.Type: ApplicationFiled: November 22, 2013Publication date: October 30, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHAO-HSIUNG CHANG, CHE-HSANG HUANG, HOU-TE LIN, PIN-CHUAN CHEN
-
Publication number: 20140319565Abstract: A light emitting diode (LED) package includes a substrate, a pin structure and a reflector formed on the substrate, an LED chip arranged on the pin structure and a first encapsulation layer mixed with phosphor filled in the reflector. The LED chip includes a top surface, a side surface extending downward from the top surface and a bottom surface opposite to the top surface. A bottom end of the first encapsulation layer is located above the top surface of the LED chip. A transparent second encapsulation layer is located below the first encapsulation layer and surrounds the LED die.Type: ApplicationFiled: March 19, 2014Publication date: October 30, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHE-HSANG HUANG, HSIN-CHIANG LIN, FU-HSIANG YEH
-
Publication number: 20140314303Abstract: A testing system for light-emitting diodes (LEDs) includes a data storage module, a data obtaining module and a comparison module. The data storage module stores pre-setting CIE spectrum data of a standard LED. The data obtaining module includes an image sensing module including a charge-coupled device sensor for capturing an image of a light distribution of an LED to be tested, a data reading module and a computing module. The data obtaining module obtains optical data from the captured and recorded image. The computing module computes to get CIE spectrum data based on the optical date. The comparsion module compares the pre-setting CIE spectrum data with the CIE spectrum data computed by the computing module to determine whether the tested LED passes the test. This disclosure also relates to a method for testing LEDs using the testing system.Type: ApplicationFiled: November 12, 2013Publication date: October 23, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventor: CHE-HSANG HUANG
-
Patent number: 8853733Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.Type: GrantFiled: August 12, 2013Date of Patent: October 7, 2014Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Che-Hsang Huang, Pin-Chuan Chen, Lung-Hsin Chen, Wen-Liang Tseng, Yu-Liang Huang
-
Patent number: 8791493Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.Type: GrantFiled: July 31, 2013Date of Patent: July 29, 2014Assignee: Advanced Optoelectronic Technology, Inc.Inventors: Che-Hsang Huang, Pin-Chuan Chen, Lung-Hsin Chen, Wen-Liang Tseng, Yu-Liang Huang
-
Publication number: 20140167078Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.Type: ApplicationFiled: October 22, 2013Publication date: June 19, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: YAU-TZU JANG, YU-LIANG HUANG, WEN-LIANG TSENG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, HSING-FEN LO, CHAO-HSIUNG CHANG, CHE-HSANG HUANG, YU-LUN HSIEH
-
Publication number: 20140084313Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.Type: ApplicationFiled: August 27, 2013Publication date: March 27, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHE-HSANG HUANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG, YU-LIANG HUANG
-
Publication number: 20140084315Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.Type: ApplicationFiled: July 31, 2013Publication date: March 27, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHE-HSANG HUANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG, YU-LIANG HUANG
-
Publication number: 20140084312Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.Type: ApplicationFiled: August 12, 2013Publication date: March 27, 2014Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHE-HSANG HUANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG, YU-LIANG HUANG