Abstract: A hinge module includes a base, a torsional force providing structure, two axles, two brackets, and at least one fixing component. The base has at least one first concave. The torsional force providing structure is disposed in the base and has two torsional force providing portions. The two axles penetrate the two torsional force providing portions respectively. The two brackets are connected to the two axles respectively. The fixing component is disposed in the first concave and abuts the torsional force providing structure, such that the torsional force providing structure is fixed to the base. In addition, an electronic device including the hinge module is also provided.

Abstract: An electronic device includes at least one hinge assembly and two bodies. The hinge assembly includes a main body and two shafts. One end of each of the shafts is pivotally connected to the main body, another end of each of the shafts has an embedded portion, and the embedded portion has a roughened structure thereon. The two bodies correspond to the two shafts respectively, each of the bodies has at least one depression, and the embedded portion of each of the shafts is embedded in the depression of the corresponding body and contacts an inner wall of the depression through the roughened structure.

Abstract: An electronic device is provided, including at least one body, at least one functional assembly, and at least one elastic positioning assembly. The functional assembly is slidably disposed on the body along a sliding direction. The elastic positioning assembly is disposed on the body and adapted to prop the functional assembly along a direction perpendicular to the sliding direction, so that a gap is formed between the functional assembly and the body. When the functional assembly slides to a predetermined position with respect to the body, the elastic positioning assembly provides a positioning force to the functional assembly along a direction parallel to the sliding direction.

Abstract: An electronic device includes two bodies, at least one hinge structure, a functional assembly, and at least one linkage structure. The two bodies are pivotally connected to each other through the hinge structure. The functional assembly is movably disposed on one of the two bodies. The linkage structure is connected between the two bodies, and the functional assembly is connected to the linkage structure. The linkage structure is adapted to drive the functional assembly to move relative to the corresponding body as the two bodies are rotated relative to each other.

Abstract: A synchronous hinge module includes a first axle, a second axle, a third axle, a fourth axle, at least one central frame, at least two connecting bases, a plurality of first baffle plates, at least two side frames, and a plurality of second baffle plates. The at least one central frame is disposed around the first axle and the second axle. The at least two connecting bases are engaged with two opposite ends of the at least one central frame respectively. The plurality of first baffle plates is respectively disposed around the first axle, the third axle and the second axle, the fourth axle. Each of the first baffle plates extends outside each of the at least two connecting bases and the at least one central frame.

Abstract: A torque hinge module including a rotating element and a torque assembly is provided. The torque assembly rotatably sleeves the rotating element to generate torque. One of the rotating element and the torque assembly has a first bearing surface, and the other one has a second bearing surface and a third bearing surface corresponding to the first bearing surface. There is a first included angle between a plane where the second bearing surface is located and a plane where the third bearing surface have is located. A shape of the first bearing surface corresponds to a shape of the second bearing surface and a shape of the third bearing surface. When the rotating element rotates relative to the torque assembly to make the first bearing surface bear against the second bearing surface or the third bearing surface, the torque is reduced.

Abstract: An electronic device including a first body, a second body, a hinge structure, a first functional assembly, and a first linkage structure is provided. The first body and the second body are pivotally connected to each other by the hinge structure. The first functional assembly is movably arranged on the first body. The first linkage structure is connected between the hinge structure and the first functional assembly, wherein the first linkage structure is adapted for driving the first functional assembly to move relative to the first body with the relative rotation of the first body and the second body.

Abstract: A hinge assembly and an electronic device using the hinge assembly are provided. The hinge assembly includes a pair of gear brackets coaxially staggered in an axial direction, wherein each gear bracket has a plate portion and an arc portion, and the arc portion has an inner gear; a shaft holder, which is provided between the arc portion of the gear bracket, wherein the shaft holder has a pair of first fixing holes; a pair of gear shafts, which passes through the first fixing hole and is fixed to the shaft holder in parallel to the axial direction, each of the gear shafts has an outer gear portion, the outer gear portion has an outer gear, and the outer gear and the inner gear of the arc portion are engaged with each other; and a pair of torque elements, which are respectively sleeved on opposite ends of the gear shaft; a plurality of gears, which are sleeved on the ends of the gear shaft in a one-to-one manner, and the gears disposed on the same side of the gear shaft are engaged with each other.

Abstract: A foldable electronic device includes a first body, a second body, a pivot module, a linkage mechanism, and an input module. The pivot module is connected to the first body and the second body. The second body is pivoted on the first body through the pivot module. The linkage mechanism is disposed in the first body and is connected to the pivot module. The input module is movably disposed on the first body through the linkage mechanism. The linkage mechanism is configured to be driven by the pivot module to cause the input module to move to be close to or away from the pivot module and cause the input module to be inclined or parallel to the first body.

Abstract: A hidden hinge includes a first fixing assembly, a second fixing assembly, a first rotating part and a second rotating part, a first bearing frame, a second bearing frame, and at least one torque member. The first rotating part and the second rotating part are rotatably disposed through the first fixing assembly and the second fixing assembly. The first rotating part and the second rotating part are parallel to each other and respectively have a first teeth portion and a second teeth portion. The first teeth portion and the second teeth portion are arranged in a vertically-staggered manner. The first bearing frame is slidably disposed on the first fixing assembly and has a first rack portion engaged with the first teeth portion. The second bearing frame is slidably disposed on the second fixing assembly and has a second rack portion engaged with the second teeth portion. The at least one torque member is sleeved around the first rotating part and the second rotating part.

Abstract: A manufacturing method of a semiconductor device includes the following steps. A semiconductor substrate with gate structures formed thereon is provided. A source/drain region is formed in the semiconductor substrate and formed between the gate structures. A dielectric layer is formed on the source/drain region and located between the gate structures. An opening penetrating the dielectric layer on the source/drain region is formed. A lower portion of a first conductive structure is formed in the opening. A dielectric spacer is formed on the lower portion and on an inner wall of the opening. An upper portion of the first conductive structure is formed in the opening and on the lower portion. The dielectric spacer surrounds the upper portion of the first conductive structure. The first conductive structure is formed by two steps for forming the dielectric spacer surrounding the upper portion and improving the electrical performance of the semiconductor device.

Abstract: A hinge structure connected between two bodies of an electronic device is provided. The bodies are rotated to be folded or unfolded relatively through the hinge structure. The hinge structure includes a first rotating shaft, a second rotating shaft, and a torsion member that the first and the second rotating shafts being pivoted thereto, such that the torsion member surrounds and grasps an axial surface of the first rotating shaft and an axial surface of the second rotating shaft respectively. The first rotating shaft has a first actuating portion and a second actuating portion. The second rotating shaft has a third actuating portion and a fourth actuating portion. The torsion member has a first torsion providing portion located on a moving path of the first and the second actuating portions and a second torsion providing portion located on a moving path of the third and the fourth actuating portions.

Abstract: A foldable electronic device includes a first body, a second body, a dual-axis hinge module, a first linkage mechanism, a second linkage mechanism, a first object and a second object. The dual-axis hinge module is disposed between the first body and the second body. The first linkage mechanism is disposed to the first body and is coupled to the dual-axis hinge module. The second linkage mechanism is disposed to the second body and is coupled to the dual-axis hinge module. The first object is slidably disposed to the first body and connected to the first linkage mechanism. The second object is slidably disposed to the second body and connected to the second linkage mechanism.

Abstract: An electronic device including a first body, a second body, a hinge structure, an electronic assembly and a linkage mechanism is provided. The first body and the second body are pivoted to each other through the hinge structure. The electronic assembly is disposed on the first body. The linkage mechanism is disposed in the first body and connected between the hinge structure and the electronic assembly. When the second body is closed to the first body, the electronic assembly is hidden between the first body and the second body. When the second body is opened relative to the first body with an opening angle less than a predetermined angle, the hinge structure does not drive the linkage mechanism. When the second body is opened relative to the first body with the opening angle not less than the predetermined angle, the hinge structure drives the linkage mechanism and the linkage mechanism drives the electronic assembly to be opened relative to the first body.

Abstract: A semiconductor structure includes a semiconductor substrate, at least a silicon germanium (SiGe) epitaxial region disposed in the semiconductor substrate, and a contact structure disposed on the SiGe epitaxial region. The contact structure includes a titanium nitride (TiN) barrier layer and a metal layer surrounded by the TiN barrier layer. A crystalline titanium germanosilicide stressor layer is disposed in the SiGe epitaxial region and between the TiN barrier layer and the SiGe epitaxial region.

Abstract: A hinge module includes a housing and at least one carrying assembly. The housing includes two accommodation spaces. The at least one carrying assembly is disposed at the housing and includes a torque element, two rotation shafts and two brackets. The torque element is disposed in one of the accommodation spaces. The two rotation shafts pass through the torque element. The two brackets are respectively connected to the two rotation shafts and located outside the housing. Each bracket is adapted to rotate along with the corresponding rotation shaft and rotate relative to the torque element.

Abstract: A sliding hinge including a torque module, two brackets, a support plate, a driving gear set, and a sliding bracket is provided. The torque module has a first shaft and a second shaft adapted to rotate in opposite directions and produce a torque. The brackets are respectively disposed on the first shaft and the second shaft. The support plate is disposed on one of the brackets. The driving gear set is disposed on the support plate and coupled to the first shaft. The sliding bracket is coupled to the driving gear set and slidably disposed on a top surface of the support plate. The brackets are adapted to rotate relative to the torque module by the first shaft and the second shaft, such that the brackets are overlapped or unfolded with each other while the driving gear set drives the sliding bracket to slide along the support plate.