Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a first drift region, a first source/drain region, and a gate oxide layer. The gate structure and the gate oxide layer are disposed on the semiconductor substrate. The first drift region is disposed in the semiconductor substrate. The first source/drain region is disposed in the first drift region. At least a part of a first portion of the gate oxide layer is disposed between the gate structure and the semiconductor substrate in a vertical direction. A second portion of the gate oxide layer is disposed between the first portion and the first source/drain region in a horizontal direction. The second portion includes a bottom extending downwards and a first depressed top surface located above the bottom. A part of the first drift region is located under the first portion and the second portion of the gate oxide layer.

Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: A method includes forming a first dielectric layer, forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes forming a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, with a first center of conductive pad being offsetting from a second center of the conductive bump. The second via is further offset from the second center of the conductive bump.

Abstract: An ultrasonic sensing device includes a support body and an ultrasonic sensor. The support body includes an accommodating space, and a positioning space at a center of the accommodating space. The ultrasonic sensor includes a body portion in the positioning space, at least one sensing channel portion extending from the body portion and in the accommodating space, at least one piezoelectric unit at one end surface of the sensing channel portion, and a second channel passing through the body portion. An inner diameter of the positioning space is greater than an inner diameter of the accommodating space, and an outer diameter of the sensing channel portion is smaller than the inner diameter of the accommodating space. Thus, a gap is formed between the sensing channel portion and the accommodating space, and the piezoelectric unit is located outside the accommodating space to come into contact with an exterior.

Abstract: An ultrasonic sensing device includes a support body and an ultrasonic sensor. The support body includes an accommodating space, and a positioning space at a center of the accommodating space. The ultrasonic sensor includes a body portion in the positioning space, at least one sensing channel portion extending from the body portion and in the accommodating space, at least one piezoelectric unit at one end surface of the sensing channel portion, and a second channel passing through the body portion. An inner diameter of the positioning space is greater than an inner diameter of the accommodating space, and an outer diameter of the sensing channel portion is smaller than the inner diameter of the accommodating space. Thus, a gap is formed between the sensing channel portion and the accommodating space, and the piezoelectric unit is located outside the accommodating space to come into contact with an exterior.

Abstract: The present invention discloses a method and system for testing a dryer, which applies to test a dryer outputting hot air from an outlet to fill a drying space and evaluate the drying efficiency of the dryer. In the method of the present invention, a test pattern is arranged inside the drying space of the dryer, and an initial water content is added to the surface of the test pattern; next, the dryer is turned on to output hot air to the drying space to begin the test; during the test, the test pattern is moved inside the drying space to have a displacement travel; then, a drying loss and a drying test time is obtained and used to calculate the drying efficiency of the dryer. Therefore, the present invention simulates the behavior of a subject in using a dryer to attain an accurate drying efficiency of the dryer.

Abstract: A sensing multi-stage control system for hand dryers aims to be installed in a lavatory and energized by electric power to generate heat and airflow to dry human hands to improve shortcomings of conventional hand dryers that cannot control airflow amount and temperature level. The hand dryer according to the invention includes a heater, a fan motor and a detection unit. The detection unit has at least two sets of sensors located at an air outlet of the hand dryer and is electrically connected to a control circuit which starts, stops and controls the heater and fan motor at a desired temperature level and rotation speed to form the sensing multi-stage control system. The control circuit, incorporating with the sensors and a comparison and logic processor to process signals, can provide multi-stage control of the temperature level of the heater and rotation speed of the fan motor.

Abstract: An ultrasonic nebulizer for producing high-volume sub-micron droplets is disclosed. The ultrasonic nebulizer utilizes a 3 or 5 MHz frequency as an oscillation frequency for producing sub-micron droplets. The nebulizer can also use at least one piezoelectric ceramic oscillator for increasing the volume of the droplets. The ultrasonic nebulizer comprises an ac/dc converter, an oscillator circuit, an amplifying device, a nebulization chamber, and at least one piezoelectric ceramic oscillator. The ac/dc converter rectifies an ac current to a dc current. The oscillator circuit produces an oscillation signal with a frequency larger than or equal to 3 MHz. The amplifying device amplifies the oscillation signal. The nebulization chamber has a lower face for holding a liquid to be nebulized.

Abstract: A system and method for detecting hydrogen concentration of a metal object is provided. The system includes a water tank, a transducer and an electronic device. The water tank contains coupling fluid for submerging the metal object. The transducer is located aside the metal object for transmitting ultrasonic pulse signals to the metal object and receiving the reflective ultrasonic pulse signals from the metal object. The electronic device is connected to the transducer and stores a processing program for controlling the transmission and receiving of ultrasonic pulse signals of the transducer. The electronic device changes the relative distance between the metal object and the transducer. When receiving the ultrasonic pulse signals under a predetermined distance, the electronic device processes the pulse signals with the processing program through double fast Fourier Transform to obtain hydrogen concentration of the metal object.

Abstract: An ultrasonic nebulizer for producing high-volume sub-micron droplets is disclosed. The ultrasonic nebulizer utilizes a 3 or 5 MHz frequency as an oscillation frequency for producing sub-micron droplets. The nebulizer can also use at least one piezoelectric ceramic oscillator for increasing the volume of the droplets. The ultrasonic nebulizer comprises an ac/dc converter, an oscillator circuit, an amplifying device, a nebulization chamber, and at least one piezoelectric ceramic oscillator. The ac/dc converter rectifies an ac current to a dc current. The oscillator circuit produces an oscillation signal with a frequency larger than or equal to 3 MHz. The amplifying device amplifies the oscillation signal. The nebulization chamber has a lower face for holding a liquid to be nebulized.