Patents by Inventor Che-Hui Lee

Che-Hui Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230375684
    Abstract: A target measurement device is provided. The target measurement device includes a fixing ring, a main body, and a transceiver. The fixing ring has a first surface. The main body is over the first surface of the fixing ring. The transceiver is coupled to the main body. The transceiver is at least movable between a center of the fixing ring to an edge of the fixing ring from a top view perspective. A method for measuring a target is also provided.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 23, 2023
    Inventors: PRADIP GIRDHAR CHAUDHARI, CHE-HUI LEE, CHIH-CHENG WEI, WEN-CHENG YANG, CHYI-TSONG NI
  • Publication number: 20230343635
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Application
    Filed: June 28, 2023
    Publication date: October 26, 2023
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Li-Li Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li
  • Patent number: 11754691
    Abstract: A target measurement device is provided. The target measurement device includes a fixing ring, a main body, and a transceiver. The fixing ring has a first surface. The main body is over the first surface of the fixing ring. The transceiver is coupled to the main body. The transceiver is at least movable between a center of the fixing ring to an edge of the fixing ring from a top view perspective. A method for measuring a target is also provided.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: September 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pradip Girdhar Chaudhari, Che-Hui Lee, Chih-Cheng Wei, Wen-Cheng Yang, Chyi-Tsong Ni
  • Patent number: 11747131
    Abstract: A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: September 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pradip Girdhar Chaudhari, Che-Hui Lee
  • Patent number: 11728208
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Li-Li Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li
  • Patent number: 11532470
    Abstract: A method includes providing a jig including a predetermined center and a magnetron installed on the jig; rotating the magnetron and obtaining a measured first magnetic flux density at the predetermined center of the jig; defining a first area of the magnetron based on the measured first magnetic flux density; rotating the magnetron and measuring a plurality of second magnetic flux densities within the first area of the magnetron; deriving a measured second magnetic flux density among the plurality of second magnetic flux densities; comparing the measured second magnetic flux density with a predetermined threshold; and performing an operation based on the comparison.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: December 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pradip Girdhar Chaudhari, Che-Hui Lee, Wen-Cheng Yang
  • Publication number: 20220373412
    Abstract: A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.
    Type: Application
    Filed: August 8, 2022
    Publication date: November 24, 2022
    Inventors: PRADIP GIRDHAR CHAUDHARI, CHE-HUI LEE
  • Publication number: 20220359175
    Abstract: A method includes providing a jig including a predetermined center and a magnetron installed on the jig; rotating the magnetron and obtaining a measured first magnetic flux density at the predetermined center of the jig; defining a first area of the magnetron based on the measured first magnetic flux density; rotating the magnetron and measuring a plurality of second magnetic flux densities within the first area of the magnetron; deriving a measured second magnetic flux density among the plurality of second magnetic flux densities; comparing the measured second magnetic flux density with a predetermined threshold; and performing an operation based on the comparison.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: PRADIP GIRDHAR CHAUDHARI, CHE-HUI LEE, WEN-CHENG YANG
  • Patent number: 11460290
    Abstract: A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: October 4, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pradip Girdhar Chaudhari, Che-Hui Lee
  • Publication number: 20210265195
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Li-Li Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li
  • Patent number: 11004724
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Li-Li Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li
  • Publication number: 20210095950
    Abstract: A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.
    Type: Application
    Filed: August 18, 2020
    Publication date: April 1, 2021
    Inventors: PRADIP GIRDHAR CHAUDHARI, CHE-HUI LEE
  • Publication number: 20210096229
    Abstract: A target measurement device is provided. The target measurement device includes a fixing ring, a main body, and a transceiver. The fixing ring has a first surface. The main body is over the first surface of the fixing ring. The transceiver is coupled to the main body. The transceiver is at least movable between a center of the fixing ring to an edge of the fixing ring from a top view perspective. A method for measuring a target is also provided.
    Type: Application
    Filed: June 19, 2020
    Publication date: April 1, 2021
    Inventors: PRADIP GIRDHAR CHAUDHARI, CHE-HUI LEE, CHIH-CHENG WEI, WEN-CHENG YANG, CHYI-TSONG NI
  • Publication number: 20200168444
    Abstract: A method includes providing a jig including a predetermined center and a magnetron installed on the jig; rotating the magnetron and obtaining a measured first magnetic flux density at the predetermined center of the jig; defining a first area of the magnetron based on the measured first magnetic flux density; rotating the magnetron and measuring a plurality of second magnetic flux densities within the first area of the magnetron; deriving a measured second magnetic flux density among the plurality of second magnetic flux densities; comparing the measured second magnetic flux density with a predetermined threshold; and performing an operation based on the comparison.
    Type: Application
    Filed: June 3, 2019
    Publication date: May 28, 2020
    Inventors: PRADIP GIRDHAR CHAUDHARI, CHE-HUI LEE, WEN-CHENG YANG
  • Publication number: 20190252240
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Li-Li Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li
  • Patent number: 10269618
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Li-Li Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li
  • Publication number: 20180082883
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Application
    Filed: November 27, 2017
    Publication date: March 22, 2018
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Li-Li Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li
  • Patent number: 9831116
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: November 28, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Li-Li Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li
  • Publication number: 20170076973
    Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.
    Type: Application
    Filed: January 20, 2016
    Publication date: March 16, 2017
    Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Lilly Su, Chien-Chang Su, Heng-Wen Ting, Jung-Chi Tai, Che-Hui Lee, Ying-Wei Li