Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a first hard mask on the first barrier layer; removing the first hard mask and the first barrier layer to form a recess; forming a second barrier layer in the recess; and forming a p-type semiconductor layer on the second barrier layer.

Abstract: According to an embodiment of the present invention, a method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a second barrier layer on the first barrier layer; forming a first hard mask on the second barrier layer; removing the first hard mask and the second barrier layer to form a recess; and forming a p-type semiconductor layer in the recess.

Abstract: According to an embodiment of the present invention, a method for fabricating semiconductor device includes the steps of: forming a semiconductor layer on a substrate; removing part of the semiconductor layer and part of the substrate to form a trench; forming a liner in the trench; removing part of the liner to form a spacer adjacent to two sides of the trench; and forming a bit line structure in the trench.

Abstract: According to an embodiment of the present invention, a method for fabricating semiconductor device includes the steps of: forming a semiconductor layer on a substrate; removing part of the semiconductor layer and part of the substrate to form a trench; forming a liner in the trench; removing part of the liner to form a spacer adjacent to two sides of the trench; and forming a bit line structure in the trench.

Abstract: A method of forming a semiconductor device includes following steps. First of all, plural mandrel patterns are formed on a target layer. Then, plural capping layers are formed to cover a top region and sidewalls of each of the mandrel patterns, respectively. Next, plural spacers are formed at two sides of each of the capping layers, respectively. Following these, a portion of the spacers and the capping layers covered on the top regions of the mandrel patterns are simultaneously removed, and the capping layers is then removed completely.

Abstract: A method of forming a semiconductor device includes following steps. First of all, plural mandrel patterns are formed on a target layer. Then, plural capping layers are formed to cover a top region and sidewalls of each of the mandrel patterns, respectively. Next, plural spacers are formed at two sides of each of the capping layers, respectively. Following these, a portion of the spacers and the capping layers covered on the top regions of the mandrel patterns are simultaneously removed, and the capping layers is then removed completely.

Abstract: A gate oxide formation process includes the following steps. A first gate oxide layer is formed on a substrate. The first gate oxide layer is thinned to a first predetermined thickness. The first gate oxide layer is then thickened to a second predetermined thickness, to thereby form a second gate oxide layer.

Abstract: A method of fabricating housing includes steps of: providing a sheet; providing a mold including a first core and a second core, in which the first core substantially extends along a plane, and the second core is adjacent to the first core; pressing the sheet to the mold to make the sheet attach to the second core, in which the second core is fixed to the sheet; and moving the sheet away from the first core along a vertical direction perpendicular to the plane to separate the second core and the first core so as to make the second core become an internal member, in which a housing is formed of the sheet and the internal member.

Abstract: A method of fabricating housing includes steps of: providing a sheet; providing a mold including a first core and a second core, in which the first core substantially extends along a plane, and the second core is adjacent to the first core; pressing the sheet to the mold to make the sheet attach to the second core, in which the second core is fixed to the sheet; and moving the sheet away from the first core along a vertical direction perpendicular to the plane to separate the second core and the first core so as to make the second core become an internal member, in which a housing is formed of the sheet and the internal member.

Abstract: A method of fabricating housing includes steps of: providing a sheet; providing a mold including a first core and a second core, in which the first core substantially extends along a plane, and the second core is adjacent to the first core; pressing the sheet to the mold to make the sheet attach to the second core, in which the second core is fixed to the sheet; and moving the sheet away from the first core along a vertical direction perpendicular to the plane to separate the second core and the first core so as to make the second core become an internal member, in which a housing is formed of the sheet and the internal member.

Abstract: A tiltable linkage mechanism including a first plate, a second plate, a swinging plate, a first hinge, a second hinge and a third hinge is provided. The first plate includes an upper surface, the second plate includes a bottom surface facing the upper surface of the first plate and a position limiting structure disposed on the bottom surface. The position limiting structure further has two opposite clamping surfaces. The first plate and the second plate pivotally connect with each other through the first hinge. The swinging plate and the first plate pivotally connect with each other through the second hinge. The swinging plate and the second plate pivotally connect with each other through the third hinge which is disposed in the position limiting structure. The third hinge has an end portion that can slide between the two clamping surfaces.

Abstract: A hand-held device includes a first body, a second body, a sliding module, and a guiding module. The sliding module is disposed between the first body and the second body, so that the second body is able to be slid on a two-dimensional plane relative to the first body. The guiding module includes a first guiding part and a second guiding part. The first guiding part is fixed to the first body. The second guiding part is fixed to the second body and coupled to the first guiding part. Besides, the second guiding part is able to be moved along a guiding path relative to the first guiding part, so that the second body is able to be slid along the guiding path on the two-dimensional plane relative to the first body.

Abstract: A handheld electronic device includes a first body, a second body stacked with the first body, a first plate between the first and second body and fixed to the first body, a second plate between the first plate and second body and fixed to the second body, a first locating structure, and a second locating structure. The first plate includes a sliding slot and a rib transversely disposed in the sliding slot and extended along the sliding slot. An edge of the second plate includes a sliding block clamped on the rib, so the second plate can move along the sliding slot. The first locating structure is disposed on the first plate and located on a moving path of the second plate. The second locating member is disposed on the sliding block, and adapted to interfere with the first locating structure on a locking position of the moving path.

Abstract: A hand-held device includes a first body, a second body, a sliding module, and a guiding module. The sliding module is disposed between the first body and the second body, so that the second body is able to be slid on a two-dimensional plane relative to the first body. The guiding module includes a first guiding part and a second guiding part. The first guiding part is fixed to the first body. The second guiding part is fixed to the second body and coupled to the first guiding part. Besides, the second guiding part is able to be moved along a guiding path relative to the first guiding part, so that the second body is able to be slid along the guiding path on the two-dimensional plane relative to the first body.

Abstract: A tiltable linkage mechanism including a first plate, a second plate, a swinging plate, a first hinge, a second hinge and a third hinge is provided. The first plate includes an upper surface, the second plate includes a bottom surface facing the upper surface of the first plate and a position limiting structure disposed on the bottom surface. The position limiting structure further has two opposite clamping surfaces. The first plate and the second plate pivotally connect with each other through the first hinge. The swinging plate and the first plate pivotally connect with each other through the second hinge. The swinging plate and the second plate pivotally connect with each other through the third hinge which is disposed in the position limiting structure. The third hinge has an end portion that can slide between the two clamping surfaces.

Abstract: A handheld electronic device includes a first body, a second body stacked with the first body, a first plate between the first and second body and fixed to the first body, a second plate between the first plate and second body and fixed to the second body, a first locating structure, and a second locating structure. The first plate includes a sliding slot and a rib transversely disposed in the sliding slot and extended along the sliding slot. An edge of the second plate includes a sliding block clamped on the rib, so the second plate can move along the sliding slot. The first locating structure is disposed on the first plate and located on a moving path of the second plate. The second locating member is disposed on the sliding block, and adapted to interfere with the first locating structure on a locking position of the moving path.

Abstract: A flexible printed circuit (FPC) board includes a flexible substrate, an electric terminal portion, and a reinforcing structure. The electric terminal portion is disposed on a bottom surface of the flexible substrate and is suitable to be inserted into an electrical connector to electrically connect therewith. The reinforcing structure is disposed on a top surface of the flexible substrate and located just above the electric terminal portion. The reinforcing portion includes a stiffener plate bonded to the top surface of the flexible substrate and a pad bonded to a top surface of the stiffener plate. The pad is shorter than the stiffener plate.

Abstract: An electronic device comprises a housing, a touch pad disposed on a first surface of the housing, the touch pad being capable of outputting a signal when touched, a processor disposed on a second surface, the processor being capable of processing the signal, wherein the second surface and the first surface are non-coplanar. The electronic device further comprises a flexible printed circuit formed integrally with the touch pad and the processor and the flexible printed circuit is capable of electrically connecting the touch pad on the first surface to the processor on the second surface.

Abstract: A retaining mechanism for a stylus. A hollow receiving passage is surrounded by a passage wall. A holding member is connected to the passage wall and includes an abutting portion. The abutting portion protrudes from the passage wall and is disposed in the hollow receiving passage. A wear-resistant portion is disposed on the abutting portion and in the hollow receiving passage. The wear-resistant portion is parallel to the passage wall. The maximum vertical distance between the wear-resistant portion and the passage wall is less than a caliber of the stylus. The stylus is tightly abutted between the wear-resistant portion and the passage wall when received in the hollow receiving passage.

Abstract: A flexible printed circuit (FPC) board includes a flexible substrate, an electric terminal portion, and a reinforcing structure. The electric terminal portion is disposed on a bottom surface of the flexible substrate and is suitable to be inserted into an electrical connector to electrically connect therewith. The reinforcing structure is disposed on a top surface of the flexible substrate and located just above the electric terminal portion. The reinforcing portion includes a stiffener plate bonded to the top surface of the flexible substrate and a pad bonded to a top surface of the stiffener plate. The pad is shorter than the stiffener plate.