Patents by Inventor Che-Ting Chu

Che-Ting Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin capped channel layers of semiconductor devices and methods of forming the same
    Patent number: 8883598
    Abstract: Semiconductor devices and methods of forming the same. The method includes providing a semiconductor substrate having a channel layer over the substrate. A capping layer including silicon and having a first thickness is formed over the channel layer. The capping layer is partially oxidized to form an oxidized portion of the capping layer. The oxidized portion of the capping layer is removed to form a thinned capping layer having a second thickness less than the first thickness.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: November 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Che-Ting Chu, Shih-Hsun Chang, Pang-Yen Tsai
  • THIN CAPPED CHANNEL LAYERS OF SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
    Publication number: 20130230977
    Abstract: Semiconductor devices and methods of forming the same. The method includes providing a semiconductor substrate having a channel layer over the substrate. A capping layer including silicon and having a first thickness is formed over the channel layer. The capping layer is partially oxidized to form an oxidized portion of the capping layer. The oxidized portion of the capping layer is removed to form a thinned capping layer having a second thickness less than the first thickness.
    Type: Application
    Filed: March 5, 2012
    Publication date: September 5, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Che-Ting Chu, Shih-Hsun Chang, Pang-Yen Tsai