Abstract: An electrical contact formed from a plurality of interlaced and annealed wires by weaving or braiding the wires together to form a mesh, annealing the mesh, and cutting the annealed mesh so as to form a plurality of individual electrical contacts. A method for forming a precursor material for use in manufacturing an electrical contact is also provided that includes manipulating a plurality of wires so as to interlace the wires into a unitary structure. The unitary structure is then annealed. An electrical contact may then be formed from the precursor material by elastically rolling a portion of the unitary structure so as to form a tube, annealing the tube, and then cutting the unitary structure so as to release the tube thereby to form an electrical contact.

Abstract: A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with a woven contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the woven contact is spaced away from the at least one of the conductive pads, and a second position where woven contact electrically engages one of the conductive pads.

Abstract: An electrical contact (2) and method of making the electrical contact (2), and a connector (11) and method making the connector (11), wherein the electrical contact (2) is an electrically conducting, interlaced mesh (40), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (2), wherein the mesh (40) is annealed while restrained in the form of the electrical contact (2) wherein the mesh (40) is free of internal elastic strain, or the mesh (40) is hardened, and wherein the connector (11) retains the electrical contact (2) for edgewise connection.

Abstract: An electrical contact (2) and method of making the electrical contact (2), and a connector (11) and method making the connector (11), wherein the electrical contact (2) is an electrically conducting, nonwoven mesh (60), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (2), wherein the mesh (60) is annealed while restrained in the form of the electrical contact (2) wherein the mesh (60) is free of internal elastic strain, and wherein the connector (11) retains the electrical contact (2) for edgewise connection.

Abstract: An electrical contact having transmission-coil sections with at least two tightly wound turns. Active-coil sections are integral with, and positioned between the transmission-coil sections so as to provide electrical signal communication between the two transmission-coil sections, and spring characteristics. The transmission-coil sections are over coated with a conductive noble metal so as to fuse each of the tightly wound turns together to thereby provide for a shortened electrical transmission pathway through the electrical contact. An LGA interposer for providing data communication between a first and a second array of contact pads is also provided having a dielectric housing with an array of cavities; and a plurality of electrical contacts positioned within the cavities.

Abstract: An electrical contact formed from a plurality of interlaced and annealed wires by weaving or braiding the wires together to form a mesh, annealing the mesh, and cutting the annealed mesh so as to form a plurality of individual electrical contacts. A method for forming a precursor material for use in manufacturing an electrical contact is also provided that includes manipulating a plurality of wires so as to interlace the wires into a unitary structure. The unitary structure is then annealed. An electrical contact may then be formed from the precursor material by elastically rolling a portion of the unitary structure so as to form a tube, annealing the tube, and then cutting the unitary structure so as to release the tube thereby to form an electrical contact.

Abstract: The present invention provides an electrical contact having transmission-coil sections with at least two tightly wound turns. Active-coil sections are integral with, and positioned between the transmission-coil sections so as to provide electrical signal communication between the two transmission-coil sections, and spring characteristics. The transmission-coil sections are over coated with a conductive noble metal so as to fuse each of the tightly wound turns together to thereby provide for a shortened electrical transmission pathway through the electrical contact. An LGA interposer for providing data communication between a first and a second array of contact pads is also provided having a dielectric housing with an array of cavities; and a plurality of electrical contacts positioned within the cavities.

Abstract: A method for cutting an elastomer cable into ultra-precise, defect-free segments of consistent length, and an apparatus to perform the same. The invented apparatus comprises cable advancement, cable clamping and cable shearing systems. The cable advancement system comprises rollers with a groove substantially matching the diameter of the cable. The cable clamping system comprises a pair of dies with a preferably conical feed hole and a clamping hole substantially matching the diameter of the cable. The cable shearing system comprises a preferably extra keen coated cryo treated movable razor blade that is held at an adjustable angle against the face of the clamping dies and slides in a linear path at a low sawing angle. In one embodiment, a second razor blade for nicking the cable prior to shearing—on substantially the opposite side of the cable from where shearing begins—is used to prevent tears in cable slices. The invented apparatus can be manually operated, or it can be motorized.

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Abstract: An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.

Abstract: The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.

Abstract: A board-to-board connector system is provided that may be used with a flex circuit, interposer, or polymer housing that includes a plurality of contacts that are arranged in an array. Each of the plurality of contacts includes a resilient body. A first conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor is electrically connected to at least one of a plurality of signal conductor traces on a printed wiring board or the like. A second conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor and the second conductor are in spaced apart relation to one another, and the second conductor is electrically connected to at least one of the plurality of ground path conductors arranged on the printed wiring board.

Abstract: A board-to-board connector system is provided that may be used with a flex circuit, interposer, or polymer housing that includes a plurality of contacts that are arranged in an array. Each of the plurality of contacts includes a resilient body. A first conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor is electrically connected to at least one of a plurality of signal conductor traces on a printed wiring board or the like. A second conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor and the second conductor are in spaced apart relation to one another, and the second conductor is electrically connected to at least one of the plurality of ground path conductors arranged on the printed wiring board.

Abstract: The present invention is a family of memory modules. In one embodiment a memory module with granularity and upgradeability of bandwidth, and a low profile uses 256 MB SDRAM or DDR SDRAM memory devices in chip scale packages (CSPs) to support a memory data bus width of up to at least 512 bits. Each module includes an impedance-controlled substrate having contact pads, memory devices, and other components on its surfaces. In one embodiment, the inclusion of spaced apart multiple area array interconnections allows a row of memory devices to be symmetrically mounted on each side of each of the area array interconnections, thereby reducing the interconnect lengths and facilitating matching of interconnect lengths. Short area array interconnections, including ball grid array (BGA) and land grid array (LGA) options, provide electrical communication between modules and the rest of the system. Thermal control structures may be included to maintain reliable operating temperatures.

Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.

Abstract: The present invention provides an electrical contact comprising a first member having spring properties and a second member wrapped around at least a portion of the first member wherein the second member has a greater electrical conductivity than the first member. In one embodiment, a conductor is wrapped around at least a portion of a spring. In another embodiment, the spring is formed into a coil or helix with a wire wrapped around at least a portion of the helical spring. In one form of this embodiment, the spring has a plurality of turns and the wire is wrapped around at least two of the turns. In another form of this embodiment, the spring has a plurality of turns and the wire is wrapped around all of the turns. An interposer connector is also provided having a frame including a top surface and a bottom surface and a plurality of apertures arranged in a pattern and opening onto the top and bottom surfaces of the frame.

Abstract: A memory module with any combination of driver line terminators, power supply circuits, and components integral to a memory control subsystem mounted directly on the memory module for use with high speed, impedance-controlled memory buses. The memory module may be formed on a conventional printed circuit card with unpacked or packed memory chips attached directly to the memory module. Including the additional functionality directly on the memory modules improves the EMC/EMI performance as well as signal quality and integrity, thereby enhancing the memory subsystem performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity to be used to address additional memory capacity on the module. Another embodiment features a module with the additional features but without memory devices.

Abstract: A shielded carrier with electrical components is provided, resulting in LGA interposer connectors with improved electrical performance and enhanced functionality. The carrier includes components such as resistors and capacitors on and/or in the carrier. The components are preferably of the surface mount variety or are imbedded within the carrier, due to the inherent lower profile of these form factors. Decoupling capacitors and terminating resistors are two examples of components that may improve performance.

Abstract: The present invention features methods and apparatuses for sealing tiled, flat-panel displays (FPDs). Tile edges corresponding with the display's perimeter edges are designed with a wide seal. Interior edges, however, have narrow seals in order to maintain the desired, constant, pixel pitch across tile boundaries. In some cases, this invention applies specifically to arrays of tiles 2×2 or less, and, in other cases, to N×M arrays, where N and M are any integer numbers. The tiles are enclosed with top and bottom glass plates, which are sealed with an adhesive bond to the tiles on the outside perimeter of the tiled display. Vertical seams (where tiles meet at the perimeter of the FPD) are sealed with a small amount of polymer. The seal may be constructed between a cover plate and a back plate, sandwiching the tiles. The AMLCD edges may be coated with either a non-permeable material or a polymer having an extremely low permeability (for example, Parylene™).

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.