Abstract: An integrated circuit may include integrated memory that is formed from a chain of memory blocks. Each memory block may have configurable input and output circuits. The configurable input and output circuits may be interposed between memory circuitry such as a memory array from circuitry external to the memory circuitry. The configurable input and output circuits may have upstream and downstream memory block connection ports. In such a way, configurable input and output circuits in a first memory block may pass control and address signals and data to configurable input and output circuits in a second memory block. By using the configurable input and output circuits, the integrated memory in the integrated circuit may operate to accommodate large bandwidth flows without using the general routing fabric of the integrated circuit.

Abstract: The present invention relates to a system and method for transferring configuration, management, debug information and asynchronous events between network-on-chip (NOC) and external interface, wherein said system, referred to as secondary network (101), comprises of a plurality of configuration bus (CBUS) network elements such as a master network element (103) and a plurality of basic network elements (105); whereby said secondary network (101) is capable to convey events such as request, acknowledge assertions or de-assertions, saving the need for numerous wires connecting between main NOC elements such as nodes or routers.

Abstract: The present invention relates to a method of debugging a targeted area or the whole network-on-chip (NOC) (101), whereby said targeted area or the whole NOC is triggered to enter into a freeze state before capturing of the state of the targeted area or the whole NOC (101) and unloading of the debug information, before finally said targeted area or the whole NOC is triggered to enter into an unfreeze state to allow forward progress to resume, using existing buffer storage, thus allowing user to debug and identify the source of issue without requiring a significant amount of extra storage.

Abstract: A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2× clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.

Abstract: A memory controller system (and method of pre-scheduling memory transaction) for a storage device comprising a linked-list controller; a plurality of command buffers to store read commands or write commands, and an arbiter to issue command. Each command buffer containing variables set by the linked-list controller. The linked-list controller is configured to execute commands in sequence independent of logical command buffer sequence. The command buffer is configured to support read commands with maximum number of write commands. The linked-list controller is configured to merge multiple write commands that are going to the same address and snarfs read commands from write commands if both commands are going to the same address and the read commands that are snarfed are loaded into a separate command buffer. The variables contained in each of the command buffer indicates status and dependency of the command buffer to create a link forming a command sequence.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

Abstract: A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2× clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.

Abstract: Systems or methods of the present disclosure may provide high-bandwidth, low-latency connectivity for inter-die and/or intra-die communication of a modularized integrated circuit system. Such an integrated circuit system may include a first die of fabric circuitry sector(s), a second die of modular periphery intellectual property (IP), a passive silicon interposer coupling the first die to the second die, and a modular interface that includes a network-on-chip (NOC). The modular interface may provide high-bandwidth, low-latency communication between the first die and the second, between the fabric circuitry sector(s), and between the first die and a third die.

Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

Abstract: The present invention relates to a method and apparatus of calibrating memory interface, wherein said method and apparatus is able to periodically re-adjust the placement of the receive enable signal in order to have said receive enable signal to be in an optimum position in relation to the DQS signal from an external memory device to achieve maximum timing margin regardless of voltage or temperature drift and/or process aging to the integrated circuit.

Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Abstract: Systems and method include one or more die coupled to an interposer. The interposer includes interconnection circuitry configured to electrically connect the one or more die together via the interposer. The interposer also includes translation circuitry configured to translate communications as they pass through the interposer. For instance, in the interposer, the translation circuitry translates communications, in the interposer, from a first protocol of a first die of the one or more die to a second protocol of a second die of the one or more die.

Abstract: Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.

Abstract: A memory controller system (and method of pre-scheduling memory transaction) for a storage device comprising a linked-list controller; a plurality of command buffers to store read commands or write commands, and an arbiter to issue command. Each command buffer containing variables set by the linked-list controller. The linked-list controller is configured to execute commands in sequence independent of logical command buffer sequence. The command buffer is configured to support read commands with maximum number of write commands. The linked-list controller is configured to merge multiple write commands that are going to the same address and snarfs read commands from write commands if both commands are going to the same address and the read commands that are snarfed are loaded into a separate command buffer. The variables contained in each of the command buffer indicates status and dependency of the command buffer to create a link forming a command sequence.

Abstract: A memory controller system comprising a scheduling module, a data buffer module, a global order buffer module and a linked-list controlling module. The linked-list controlling module is configured to receive and process a first command comprising a write command or a read command. The linked-list controlling module constructs at least one linked-list head based on scheduling dependencies and determines whether the first command is dependency-hit by comparing the first command with the existing commands buffered in the global order buffer module. If the first command is dependency-hit, the linked-list controlling module is configured to trigger a write merging process or a read snarfing process.

Abstract: An integrated circuit die includes input buffer circuits that are enabled during an input mode of operation in response to first control signals to transmit input signals into the integrated circuit die from conductive bumps. Each of the input buffer circuits is coupled to one of the conductive bumps. The integrated circuit die also includes output buffer circuits that are each coupled to one of the conductive bumps. The output buffer circuits are enabled during an output mode of operation in response to second control signals to transmit output signals from the integrated circuit die to the conductive bumps. The input buffer circuits are disabled from transmitting signals during the output mode of operation in response to the first control signals. The output buffer circuits are disabled from transmitting signals during the input mode of operation in response to the second control signals.

Abstract: Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.

Abstract: The present invention relates a network-on-chip (NoC) system for optimizing data transfer, the system comprising a plurality of nodes including a source node and a destination node; characterized by a plurality of routers attached to the plurality of nodes that route a plurality of data packets from the source node to the destination node; wherein each of the plurality of packets is tagged with a routing information (RINFO), each node is assigned with a node unique identifier (ID) and each router is assigned with a router unique identifier (RID) for each horizontal and vertical routing direction for 2D and 3D interconnect topologies; wherein each of the router comprising at least a pair of ingress port and egress port, a route decoder and an arbiter to support a synchronous, an asynchronous and a source-synchronous operations. The present invention also relates to a method of optimizing data transfer using the NoC system.

Abstract: A device and method of clock synchronization for external memory interface. The device, and method, generating a clock output from a phase lock loop block via a sub-module clocking component; multiplexing the clock output through a global clock into different clock domains; clocking the data and an address or a command path by each clock domain; clocking the phase compensation FIFO by clock domain and clock phase alignment clock; generating the pointer for the phase compensation FIFO from central pointer generator block; and synchronizing the pointer of the adjacent intellectual property module with a parent intellectual property module.