Patents by Inventor Chee Khuen Stephen Wong

Chee Khuen Stephen Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect structure and a method of fabricating the same
    Patent number: 8462516
    Abstract: An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: June 11, 2013
    Assignees: Agency for Science Technology and Research, Nanyang Technological University
    Inventors: Chee Khuen Stephen Wong, Hock Lye John Pang, Wei Fan, Haijing Lu, Boon Keng Lok
  • Interconnect Structure And A Method Of Fabricating The Same
    Publication number: 20100246150
    Abstract: An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
    Type: Application
    Filed: October 21, 2008
    Publication date: September 30, 2010
    Applicants: Agency for Science Tecnology and Research, Nanyang Tecnological University
    Inventors: Chee Khuen Stephen Wong, Hock Lye John Pang, Wei Fan, Haijing Lu, Boon Keng Lock
  • Capacitor interconnection
    Patent number: 7705691
    Abstract: A substrate for power decoupling and a method of forming a substrate for power decoupling. The substrate comprises one or more decoupling capacitors; and one or more interconnections to the decoupling capacitors. At least one of the interconnections comprises a lossy material.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: April 27, 2010
    Assignee: Agency for Science, Technology & Research
    Inventors: Chee Wai Albert Lu, Boon Keng Lok, Chee Khuen Stephen Wong, Kai Meng Chua, Lai Lai Wai, Sunnappan Vasudivan