Patents by Inventor Chee Sheng Lim

Chee Sheng Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136478
    Abstract: Lighting systems and methods of combining visible and non-visible light converting phosphor are presented herein. A method comprises varying respective amounts of a non-visible light converting phosphor and respective amounts of a visible light converting phosphor that are included in respective encapsulants that have been used to encapsulate LED chips of respective samples of a group of LED chips within respective LED test packages; based on determined mathematical relationships and correlations associated with the varying, including a first amount of the non-visible light converting phosphor and a second amount of the visible light converting phosphor in an encapsulant; and encapsulating, using the encapsulant, a manufacturing portion of the group of LED chips within respective LED packages to facilitate categorization of the respective LED packages into a manufacturing bin represented by a defined target LED package light output intensity and a defined target LED package light output color coordinate.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Inventors: TEK BENG LOW, ENG WAH TAN, CHEE SHENG LIM
  • Publication number: 20230071389
    Abstract: A lighting system combining visible and non-visible light converting phosphor includes a light emitting diode (LED) package, an LED chip mounted on LED package, and a phosphor material covering the LED chip. In use, the phosphor material includes a first converting material and a second converting material. In addition, the spectral appearance of the lighting system is dependent upon a combination of the first converting material and the second converting material.
    Type: Application
    Filed: November 10, 2022
    Publication date: March 9, 2023
    Inventors: TEK BENG LOW, ENG WAH TAN, CHEE SHENG LIM
  • Publication number: 20220399482
    Abstract: A lighting system combining visible and non-visible light converting phosphor, wherein the lighting system includes: a light emitting diode (LED) package; at least one light emitting diode (LED) chip associated with the light emitting diode (LED) package; a phosphor material associated with at least a portion of the at least one light emitting diode (LED) chip, wherein the phosphor material includes: a first converting material that emits in the visible light spectrum; and a second converting material that emits in the non-visible light spectrum; and wherein the first converting material and the second converting material controllably regulate light output of the lighting system.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 15, 2022
    Inventors: TEK BENG LOW, ENG WAH TAN, CHEE SHENG LIM
  • Patent number: 11444225
    Abstract: A light emitting diode package, including: a housing, wherein the housing includes a top section having an aperture; a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; a light emitting diode light source, wherein the light emitting diode light source is associated with the aperture of the housing; an encapsulant, wherein the encapsulant is associated with at least a portion of the light emitting diode light source and the housing; and a protective coating associated with at least a portion of the encapsulant and the housing, wherein the protective coating reduces and/or eliminates oxidative degradation, thermal degradation, and/or photodegradation.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: September 13, 2022
    Inventors: Tek Beng Low, Chee Sheng Lim
  • Patent number: 11444227
    Abstract: A light emitting diode package including: a housing, wherein the housing has a first axis defined as a width (w), and a second axis defined as a height (h); a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; wherein the first electrode and the second electrode are spaced apart from each other to define an inter-digit region therebetween, wherein the inter-digit region comprises a length (l) that is offset (e.g., not parallel) relative to the width and/or height of the housing.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: September 13, 2022
    Inventors: Tek Beng Low, Eng Wah Tan, Chee Sheng Lim
  • Patent number: 11329206
    Abstract: A lead frame and housing sub-assembly for use in a light emitting diode package, including: a lead frame, wherein the lead frame includes a substrate metal alloy having a top surface and a bottom surface, and wherein the top surface and the bottom surface of the substrate have been pre-plated with a layer of nickel; and a housing, wherein the housing includes a top surface and a bottom surface, and wherein at least a portion of the bottom surface of the housing contacts the top surface of the lead frame that has been pre-plated with the layer of nickel.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: May 10, 2022
    Inventors: Tek Beng Low, Chee Sheng Lim
  • Publication number: 20220102600
    Abstract: A lead frame and housing sub-assembly for use in a light emitting diode package, including: a lead frame, wherein the lead frame includes a substrate metal alloy having a top surface and a bottom surface, and wherein the top surface and the bottom surface of the substrate have been pre-plated with a layer of nickel; and a housing, wherein the housing includes a top surface and a bottom surface, and wherein at least a portion of the bottom surface of the housing contacts the top surface of the lead frame that has been pre-plated with the layer of nickel.
    Type: Application
    Filed: September 28, 2020
    Publication date: March 31, 2022
    Inventors: Tek Beng LOW, Chee Sheng LIM
  • Publication number: 20220077353
    Abstract: A light emitting diode package, including: a housing, wherein the housing includes a primary cavity, a primary cavity light emitting surface, and a secondary cavity, wherein the secondary cavity is positioned adjacent to the primary cavity; a lead frame associated with the housing; a light emitting diode light source, wherein the light emitting diode light source is associated with the primary cavity of the housing; an encapsulant filled into the primary cavity, wherein the encapsulant is associated with a light converting element; and wherein the ratio of the surface area of the primary cavity light emitting surface to that of the light emitting diode light source is less than 2.0.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Inventors: Tek Beng LOW, Chee Sheng LIM
  • Publication number: 20220077359
    Abstract: A light emitting diode package, including: a housing, wherein the housing includes a top section having an aperture; a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; a light emitting diode light source, wherein the light emitting diode light source is associated with the aperture of the housing; an encapsulant, wherein the encapsulant is associated with at least a portion of the light emitting diode light source and the housing; and a protective coating associated with at least a portion of the encapsulant and the housing, wherein the protective coating reduces and/or eliminates oxidative degradation, thermal degradation, and/or photodegradation.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Inventors: Tek Beng LOW, Chee Sheng LIM
  • Publication number: 20210257348
    Abstract: A light emitting diode package, including: a housing, wherein the housing includes a top compartment having an aperture and a bottom compartment having an aperture; a lead frame, wherein the lead frame includes a first electrode and a second electrode, and wherein the lead frame is positioned between the top compartment and the bottom compartment of the housing; at least one light emitting diode light source, wherein the at least one light emitting diode light source is associated with the aperture of the top compartment of the housing; a light emitting diode driver, wherein the light emitting diode driver is associated with the aperture of the bottom compartment of the housing; and wherein the aperture of the top compartment of the housing and the aperture of the bottom compartment of the housing are positioned in a back-to-back configuration.
    Type: Application
    Filed: February 13, 2020
    Publication date: August 19, 2021
    Inventors: Tek Beng LOW, Chee Sheng LIM
  • Publication number: 20210098669
    Abstract: A light emitting diode package including: a housing, wherein the housing has a first axis defined as a width (w), and a second axis defined as a height (h); a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; wherein the first electrode and the second electrode are spaced apart from each other to define an inter-digit region therebetween, wherein the inter-digit region comprises a length (l) that is offset (e.g., not parallel) relative to the width and/or height of the housing.
    Type: Application
    Filed: November 18, 2019
    Publication date: April 1, 2021
    Inventors: Tek Beng LOW, Eng Wah TAN, Chee Sheng LIM
  • Publication number: 20190371977
    Abstract: A lighting system combining visible and non-visible light converting phosphor, wherein the lighting system includes: a light emitting diode (LED) package; at least one light emitting diode (LED) chip associated with the light emitting diode (LED) package; a phosphor material associated with at least a portion of the at least one light emitting diode (LED) chip, wherein the phosphor material includes: a first converting material that emits in the visible light spectrum; and a second converting material that emits in the non-visible light spectrum; and wherein the first converting material and the second converting material controllably regulate light output of the lighting system.
    Type: Application
    Filed: August 15, 2019
    Publication date: December 5, 2019
    Inventors: Tek Beng LOW, Eng Wah TAN, Chee Sheng LIM
  • Publication number: 20190355876
    Abstract: A light emitting diode (LED) package includes light emitting diode (LED) chips disposed within the package. Particularly, the light emitting diode (LED) chip is supported on a base, a light emitting window provide light emission surface to thelight emitting diode (LED) chip and a pair of leads electrically connected to the light emitting diode (LED) chip. The translucent housing of the light emitting diode (LED) chip has an elongated configuration for laterally enclosing each light emitting diode (LED) chip. The housing has at least a portion thereof forming a section having translucent properties.
    Type: Application
    Filed: May 21, 2018
    Publication date: November 21, 2019
    Applicant: DOMINANT Opto Technologies Sdn Bhd
    Inventors: Tek Beng LOW, Eng Wah TAN, Chee Sheng LIM
  • Publication number: 20190123246
    Abstract: A lighting system combining visible and non-visible light converting phosphor, includes, a light emitting diode (LED) package, a light emitting diode (LED) chip mounted on the light emitting diode (LED) package, a phosphor material covering the light emitting diode (LED) chip. In use, the phosphor material includes a first converting material and a second converting material. In addition, the spectral appearance of the lighting system is dependent upon a combination of the first converting material and the second converting material.
    Type: Application
    Filed: October 30, 2017
    Publication date: April 25, 2019
    Applicant: DOMINANT Opto Technologies Sdn Bhd
    Inventors: Tek Beng Low, Eng Wah Tan, Chee Sheng Lim
  • Publication number: 20190049512
    Abstract: A system for simplifying integration of a light emitting diode (LED) into multiple applications includes, an identification module to uniquely identify the light emitting diode (LED) during testing, a storage module for storing testing data of the light emitting diode (LED), a transfer module for transferring testing data of the light emitting diode (LED) down a supply chain to customer end for further processing to achieve a required final color mix, and, a light source molded around a frame, the light emitting diode (LED) being attached and electrically connected to the light source. In use, the testing data includes data relating to at least one characteristic of the light emitting diode (LED). In further use, the LED is a red, green and blue (RGB) LED.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 14, 2019
    Applicant: DOMINANT Opto Technologies Sdn Bhd
    Inventors: Tek Beng LOW, Eng Wah TAN, Chee Sheng LIM
  • Publication number: 20120025223
    Abstract: The invention relates to a light emitting diode (LED) lighting device that is comprised of a plurality of LED components and is characterized by the mixture of; a first group of light source provided by blue LEDs mixed with luminescence conversion element and the blue light has a dominant wavelength in the range from 430 nm to 460 nm and the luminescence conversion element absorbs a portion of this blue light and converts to a secondary light have a peak wavelength in the range of 520 nm to 545 nm; a second group of light source provided by LEDs with dominant wavelength in the range of 600 nm to 610 nm and a third group of light source provided by LEDs with dominant wavelength in the range of 615 nm to 625 nm to produce mixture of light that has good color re-producibility.
    Type: Application
    Filed: June 3, 2011
    Publication date: February 2, 2012
    Inventors: Tek Beng Low, Eng Wah Tan, Chee Sheng Lim
  • Patent number: D710809
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: August 12, 2014
    Assignee: DOMINANT Opto Technologies Sdn. Bhd.
    Inventors: Tek Beng Low, Chee Sheng Lim