Abstract: A circuit board carrier suitable for carrying a circuit board includes a first frame and a second frame. The second frame is formed by connecting a plurality of modulized components and is assembled with the first frame. The second frame has a plurality of supporting portions to support the circuit board at a surface thereof. Since the second frame of the circuit board carrier is formed by assembling a plurality of modulized components with smaller sizes, therefore, only less waste material is produced during manufacturing the second frame, which is advantageous in reducing production cost. In addition, the supporting portions of the circuit board carrier are capable of supporting the circuit board at the edges and the inner portion of the bottom of the circuit board, which is advantageous in reducing the twist deformation of the circuit board after passing through a solder pot.