Abstract: An information sensing device includes a substrate, an information sensing chip mounted on and electrically connected to the substrate, at least one electroconductive structure mounted on and electrically connected to the substrate and disposed on one side of the information sensing chip, and a molding compound material partially surrounding the information sensing chip and the electroconductive structure to expose a chip surface of the information sensing chip and a first surface of the electroconductive structure. Thus, an electrostatic charge approaching the information sensing device is conducted from the electroconductive structure to the substrate. The chip surface is to be in contact with an object to sense an image of the object.