Patents by Inventor Chen Chun Shao

Chen Chun Shao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device
    Patent number: 12002761
    Abstract: A semiconductor device includes a semiconductor substrate, a dielectric structure, an electrical insulating and thermal conductive layer and a circuit layer. The electrical insulating and thermal conductive layer is disposed over the semiconductor substrate. The dielectric structure is disposed over the electrical insulating and thermal conductive layer, wherein a thermal conductivity of the electrical insulating and thermal conductive layer is substantially greater than a thermal conductivity of the dielectric structure. The circuit layer is disposed in the dielectric structure.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih
  • Bonding method of package components and bonding apparatus
    Patent number: 11955378
    Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang
  • Flour Having Improved Organoleptic Properties
    Publication number: 20230284635
    Abstract: A fermented flour having an improved mouthfeel and taste includes a reduced concentration of off-flavor compounds. Methods of reducing the off-flavored compounds concentration in a flour include fermenting the flour under solid state fermenting conditions.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 14, 2023
    Inventors: Jin-E Shin, Antony Alex Tipton, Chen Chun Shao, Prabhakar Kasturi, Todd A. Rakofsky, Zhanfeng Xu
  • Split-Stream Processing Methods and Systems for Multi-Phase Food Products
    Publication number: 20080299276
    Abstract: Methods and systems are disclosed for producing a multi-phase food product by processing different phases of the food product in separate streams using different processing conditions for each stream. The separate streams are combined to produce the multi-phase food product.
    Type: Application
    Filed: May 31, 2007
    Publication date: December 4, 2008
    Inventors: Clint Eubanks, John Mathew, Sevugan Palaniappan, Chen Chun Shao