Abstract: A plunger, a hydraulic end and a plunger pump are disclosed. The plunger includes a plunger body, the plunger body includes a flow channel; a first liquid inlet hole is located in the plunger body and passes through the sidewall of the plunger body; the plunger body includes a first end portion and a second end portion, a flow channel extends from the first end portion to the second end portion, a part of the flow channel close to the first end portion is closed, the flow channel extends to the second end portion and forms a first opening, the first liquid inlet hole is communicated with the flow channel, the first valve assembly is located at the first opening, and is configured to allow fluid to flow out from the flow channel at the first opening and prevent fluid from flowing back to the flow channel from outside.

Abstract: A phenyl-containing compound, an intermediate thereof, a preparation method therefor and an application thereof. Provided is a compound represented by formula I or a pharmaceutically acceptable salt thereof, where R1, R2, R3, R4 and R5 are independently hydrogen, C1-C6 alkyl, C1-C6 alkoxy or C(?O)OR8; where R8 is C1-C4 alkyl; R6 is (II), (III) or (IV); and R7 is —OH, —NH2, —NHCH3, —N(CH3)2 or C1-4 alkoxy. The compound has a low critical micelle concentration (CMC) and good dilution resistance and is capable of enclosing an insoluble drug to form a small-molecule micelle having a high drug loading capacity and good stability.

Abstract: The present invention discloses a high-threshold power semiconductor device and a manufacturing method thereof. The high-threshold power semiconductor device includes, in sequence from bottom to top: a metal drain electrode, a substrate, a buffer layer, and a drift region; further including: a composite column body which is jointly formed by a drift region protrusion, a columnar p-region and a columnar n-region on the drift region, a channel layer, a passivation layer, a dielectric layer, a heavily doped semiconductor layer, a metal gate electrode and a source metal electrode. The composite column body is formed by sequentially depositing a p-type semiconductor layer and an n-type semiconductor layer on the drift region and then etching same. The channel layer and the passivation layer are formed in sequence by deposition. Thus, the above devices are divided into a cell region and a terminal region.

Abstract: A phenyl-containing compound, an intermediate thereof, a preparation method therefor and an application thereof. Provided is a compound represented by formula I or a pharmaceutically acceptable salt thereof, where R1, R2, R3, R4 and R5 are independently hydrogen, C1-C6 alkyl, C1-C6 alkoxy or C(?O)OR8; where R8 is C1-C4 alkyl; R6 is (II), (III) or (IV); and R7 is —OH, —NH2, —NHCH3, —N(CH3)2 or C1-4 alkoxy. The compound has a low critical micelle concentration (CMC) and good dilution resistance and is capable of enclosing an insoluble drug to form a small-molecule micelle having a high drug loading capacity and good stability.

Abstract: A multi-zone end effector assembly is described in the present disclosure. As a non-limiting example, the multi-zone end effector assembly comprises a manifold that comprises a first interior chamber and a second interior chamber. A first port connects to the first interior chamber, and a second port connects to the second interior chamber. A first compression cup region can be connected to the first interior chamber. The first compression cup region is in air connection with the first port. The first compression cup region is configured to be independently activated in order to create a first vacuum zone. A second compression cup region is connected to the second interior chamber. The second compression region cup is in air connection with the second port. The second compression cup region is configured to be independently activated in order to create a second vacuum zone.

Abstract: An apparatus for unloading packages (103) from a container (106), the apparatus comprising: a conveyor system (109); a supporting frame (209) mounted on the conveyor system, the supporting frame being substantially perpendicular to a length of the conveyor system; and an end effector assembly (112) coupled to the supporting frame and being moveable about a horizontal axis relative to the supporting frame, the end effector assembly comprising: a manifold plate (203) extending along a vertical plane that is generally parallel to the supporting frame; a gripping component (115) coupled to and extending outwardly from the manifold plate along the horizontal axis relative to the supporting frame, the gripping component being configured to engage with one or more of the packages stacked in the container; and one or more sensors (303), the one or more sensors being configured to determine a distance between the end effector assembly and the packages.

Abstract: Disclosed are various embodiments for an automated package unloading system. An automated package unloading system can include an end effector supported by a supporting frame which is mounted to a conveyor system. The end effector and/or the conveyor can be configured to move into and out of a container containing stacked packages. The end effector can be configured to attach to the packages and pull the packages from their original position. The end effector can further be configured to release the packages onto the underlying conveyor.

Abstract: Disclosed are various embodiments for an automated package unloading system. An automated package unloading system can include an end effector supported by a supporting frame which is mounted to a conveyor system. The end effector and/or the conveyor can be configured to move into and out of a container containing stacked packages. The end effector can be configured to attach to the packages and pull the packages from their original position. The end effector can further be configured to release the packages onto the underlying conveyor.