Patents by Inventor Chen Heping

Chen Heping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7111783
    Abstract: An automated dimensional inspection system is provided that modifies sensor planning based on real-time measurement feedback. The dimensional inspection system includes a sensor planner, an error map generator, and a sensor affixed to a movable member. The sensor planner is adapted to receive three dimensional design data for a workpiece to be measured and generate path data in part based on the dimensional design data for the workpiece, where the path data is indicative of a path for moving the sensor in relation to the surface of the workpiece. The error map generator is adapted to receive the dimensional design data and the three dimensional measurement data for the workpiece, and determine error data between the measurement data and the dimensional design data. Based on the error data, the sensor planner is able to further modify the path data for the sensor to increase the measurement accuracy.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: September 26, 2006
    Assignee: Board of Trustees operating Michigan State University
    Inventors: Ning Xi, Chen Heping, Quan Shi
  • Publication number: 20050284937
    Abstract: An automated dimensional inspection system is provided that modifies sensor planning based on real-time measurement feedback. The dimensional inspection system includes a sensor planner, an error map generator, and a sensor affixed to a movable member. The sensor planner is adapted to receive three dimensional design data for a workpiece to be measured and generate path data in part based on the dimensional design data for the workpiece, where the path data is indicative of a path for moving the sensor in relation to the surface of the workpiece. The error map generator is adapted to receive the dimensional design data and the three dimensional measurement data for the workpiece, and determine error data between the measurement data and the dimensional design data. Based on the error data, the sensor planner is able to further modify the path data for the sensor to increase the measurement accuracy.
    Type: Application
    Filed: June 25, 2004
    Publication date: December 29, 2005
    Inventors: Ning Xi, Chen Heping, Quan Shi