Patents by Inventor Chen-Hsiang Chao

Chen-Hsiang Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10644534
    Abstract: A solar mobile electronic device includes: a power supply device, including a battery in electric connection with a first voltage display module and outputting a first output voltage, the first voltage display module measuring and displaying the magnitude of the first output voltage; a solar power supply device, including at least one solar panel and a voltage display and control device, the solar panel in electric connection with the voltage display and control device and converting solar energy to a second output voltage, the voltage display and control device configured with a second voltage adjusting module and a second voltage display and control module also in electric connection with the first voltage display module, the second voltage display and control module controlling and displaying the magnitude of the second output voltage through the second voltage adjusting module and having a dynamic comparison unit adapted to set a predetermined voltage value.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: May 5, 2020
    Inventor: Chen-Hsiang Chao
  • Publication number: 20190305584
    Abstract: A solar mobile electronic device includes: a power supply device, including a battery in electric connection with a first voltage display module and outputting a first output voltage, the first voltage display module measuring and displaying the magnitude of the first output voltage; a solar power supply device, including at least one solar panel and a voltage display and control device, the solar panel in electric connection with the voltage display and control device and converting solar energy to a second output voltage, the voltage display and control device configured with a second voltage adjusting module and a second voltage display and control module also in electric connection with the first voltage display module, the second voltage display and control module controlling and displaying the magnitude of the second output voltage through the second voltage adjusting module and having a dynamic comparison unit adapted to set a predetermined voltage value.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 3, 2019
    Inventor: Chen-Hsiang Chao
  • Publication number: 20120302142
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a plurality of bundles of first long fibers and an elastomer embedded into the bundles. The bundles of first long fibers are entangled with each other.
    Type: Application
    Filed: July 23, 2012
    Publication date: November 29, 2012
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, CHEN-HSIANG CHAO, YUNG-CHANG HUNG
  • Publication number: 20110003536
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Yung-Chang Hung
  • Patent number: 7789738
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: September 7, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Patent number: 7762873
    Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a first concentration of ultrafine fibers by volume higher than 80% a total volume of the polishing layer. The first ultrafine fibers of the polymer layer have a second concentration of ultrafine fibers by volume to a total volume of the polymer layer. The first concentration is higher than the second concentration.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: July 27, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Chen-Hsiang Chao, I-Peng Yao
  • Patent number: 7629554
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: December 8, 2009
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20090252876
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface and a slightly rough layer. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Application
    Filed: June 10, 2009
    Publication date: October 8, 2009
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080287047
    Abstract: The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Application
    Filed: May 18, 2007
    Publication date: November 20, 2008
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, CHEN-HSIANG CHAO, YUNG-CHANG HUNG
  • Publication number: 20080227375
    Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a concentration of ultrafine fibers by volume higher than 80% and higher than that of the first ultrafine fibers of the polymer layer.
    Type: Application
    Filed: May 13, 2008
    Publication date: September 18, 2008
    Inventors: Chung-Chih Feng, Chen-Hsiang Chao, J-Peng Yao
  • Publication number: 20080220702
    Abstract: The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
    Type: Application
    Filed: May 21, 2008
    Publication date: September 11, 2008
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih FENG, I-Peng YAO, Chen-Hsiang CHAO, Kun-Cheng SUNG
  • Publication number: 20080220701
    Abstract: A method for making a polishing pad includes providing a non-woven fabric made of a plurality of fibers. The non-woven fabric is submerged with a polymer resin solution. The polymer resin submerged in non-woven fabric is cured to form a porous polymer having an outer face adapted for polishing a workpiece. The outer face of the porous polymer is finished to form a polishing pad with a plurality of naps on the outer face. The plurality of naps on the outer face have a density ranging from 1.0 to 2.0 g/cm3, and the plurality of naps on the outer face have a length ranging from 50 to 600 ?m.
    Type: Application
    Filed: May 20, 2008
    Publication date: September 11, 2008
    Inventors: Chung-Ching Feng, Chen-Hsiang Chao, I-Peng Yao, Yung-Chang Hung
  • Publication number: 20080171493
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The non-woven fabric is made of a long fiber and the elastomer is embedded into the fabric.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Yung-Chang Hung
  • Patent number: 7316605
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: January 8, 2008
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003927
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Application
    Filed: May 7, 2007
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003935
    Abstract: The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
    Type: Application
    Filed: July 3, 2006
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Kun-Cheng Sung
  • Publication number: 20080003932
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Application
    Filed: July 3, 2006
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003934
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Application
    Filed: March 19, 2007
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003933
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Application
    Filed: July 3, 2006
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20070202780
    Abstract: The present invention relates to a polishing pad having a surface texture and a method for fabricating the same. The fabricating method comprises the following steps: (a) providing a substrate which has a surface for polishing an object to be polished; (b) providing a freely movable high-energy laser; and (c) forming a surface texture on the surface of the substrate by using the high-energy laser. Thereby, burrs and deformation of fabricated polishing pad may not occur, and when the polishing pad is used, the slurry can maintain good flowage without scraping the object to be polished. Moreover, the desired surface texture can be fabricated rapidly and correctly by using a high-energy laser with extremely high reproducibility.
    Type: Application
    Filed: February 24, 2006
    Publication date: August 30, 2007
    Inventors: Chung-Ching Feng, Chen-Hsiang Chao, I-Peng Yao, Yung-Chang Hung