Abstract: A heat sink includes a heat dissipation fins assembly, a heat spreader, and a heat pipe. The heat dissipation fins assembly includes a plurality of heat dissipation fins. A guide plate extruding from a bottom of each of the heat dissipation fins. The guide plate being connected to an adjacent heat dissipation fins. The heat dissipation fins are connected in series by the guide plate thereby defining a number of air channels. Each heat dissipation fin includes a through hole defined therein and aligned with each other. The heat spreader is disposed under the heat dissipation fins assembly and a through groove is formed in the heat spreader. A heat pipe passes through the through hole and the through groove. The heat sink has improved heat dissipation efficiency.

Abstract: A solar cell charging device includes a base shown as a shell shape, a light-converging lens arranged at a top face of the base, a solar collector correspondingly located under the light-converging lens and a photoelectric converting unit. A plurality of charging troughs arranged on the base are recessed inwardly from circumferential faces thereof. The photoelectric converting unit is connected between each charging trough and the solar collector, converting the light energy absorbed by the solar collector into electric energy provided to be input into each charging trough, after the light-converging lens focuses the solar energy onto the solar collector.

Abstract: A LED lamp tube which includes a hollow transparent tube, a LED lamp assembly disposed in the transparent tube, two conductive caps provided on both ends of the transparent tube respectively, and a circuit control unit. The circuit control unit includes a plurality of separated sub-portions. The respective sub-portions of the circuit control unit are distributed uniformly on the circuit board of the LED lamp assembly. Via the uniform arrangement of respective sub-portions of the circuit control unit, the heat within the LED lamp tube can be distributed uniformly, thereby lowering the temperature and facilitating the heat dissipation.

Abstract: The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.

Abstract: A multi-phase driving circuit includes a single-phase pulse-width modulation (PWM) controller, a number of drivers, and a number of switch circuits connected to the number of drivers correspondingly. The single-phase PWM controller is configured for providing a single-phase PWM signal. Each of the number of drivers receives the single-phase PWM signal and adjusts a phase of the single-phase PWM signal to output an adjusted PWM signal. Each of the number of drivers also outputs a driving signal. Each of the number of switch circuits receives the adjusted PWM signal and the driving signal from a driver. Each of the number of switch circuits generates a driving voltage controlled by the driving signal and adjusts a phase of the driving voltage controlled by the adjusted PWM signal and then outputs the adjusted driving voltage, so as to make the number of switch circuits output a multi-phase driving voltage to a load.

Abstract: A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Abstract: A wireless heat sink, a wireless heat sink system and a wireless heat sinking method are disclosed. The wireless heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Abstract: A control circuit for a switching power supply (SPS) includes power input and output interfaces, a relay, a relay driving circuit, a microprocessor, and an alternating current/directing current (AC/DC) converter. The power input interface receives an external alternating current (AC) power signal, and transmits the AC power signal to the SPS via the power output interface. The AC/DC converter transforms the AC power signal into a direct current (DC) power signal to supply for the relay, the relay driving circuit, and the microprocessor. When a computer is turned on, the microprocessor sends a first control signal to control the relay driving circuit to drive the relay to connect the power input and output interfaces. When the computer is turned off, the microprocessor sends a second control signal to control the relay driving circuit to drive the relay to cut off connection between the power input and output interfaces.

Abstract: A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102).

Abstract: A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.

Abstract: A power supply saving system includes a power input interface, a power output interface, an alternating current/direct current (AC/DC) converter, a relay, a relay driving circuit, a trigger, and a timing sequence circuit. The AC/DC converter is capable of transforming the AC power signal to direct current (DC) power to supply to the relay, the relay driving circuit, the trigger, and the timing sequence circuit. The timing sequence circuit is capable of controlling the relay driving circuit via the trigger to turn on the relay to connect the power input interface to the power output interface when the timing sequence circuit receives a power-on signal. The timing sequence circuit is capable of controlling the relay driving circuit via the trigger to turn off the relay to cut off connection between the power input interface and the power output interface when the timing sequence circuit receives a power-off signal.

Abstract: In a manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes, the method is first to provide a plurality of heat pipes, each of which has an evaporator formed a heated face thereon; then, the evaporators are moved closely to one another in a manner, such that their heated faces are disposed onto a flat face; next, the evaporators are limited from multiple directions; afterward, pressing the evaporators toward the flat face makes their heated faces flush therewith; finally, injecting a bonding media into the gaps among the heat faces of the evaporators bonds the heat faces together to form a fixedly coplanar configuration.

Abstract: A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure includes a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. The amount of working fluid attached to the second wick portion is smaller than that of the first wick portion. After heating, the working fluid attached to the second wick portion is vaporized more quickly.

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.

Abstract: A road lamp holder structure includes a lamp guard (1), an LED unit (2) installed at the bottom of the lamp guard (1), and a heat dissipating device (30) installed in lamp guard (1) and having a base (30), a vapor chamber (31) and two heat dissipating elements (32) attached to the LED unit (2). The vapor chamber (31) includes a heated section (310) attached onto the base (30), two heat transmitting sections (311) bent and extended upward from both sides of the heated section (310) respectively, a condensing section (312) bent and extended laterally from each of the two heat transmitting sections (311), two heat dissipating elements (32) having a heated base (30), and heat dissipating fins (321) disposed on the heated base (30). The two heated bases (30) are attached onto external sides of the two heat transmitting sections (311) of the vapor chamber (31) respectively, and the two condensing sections (312) of the vapor chamber (31) are attached to the internal periphery of the top of the lamp guard (1).

Abstract: A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat has an integral structure and combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other.

Abstract: A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

Abstract: In a heat-conducting assembly for heat pipes of different diameters and a heat sink having such assembly, the heat-conducting assembly includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes. A heat-conducting surface of the heat-conducting base is provided with a plurality of accommodating troughs. The diameter of the set of second heat pipes is smaller than that of the set of first heat pipes. The first heat pipe and the second heat pipe of different diameters are disposed in the accommodating troughs respectively. The heat pipes penetrate a plurality of fins to form the heat sink. With this arrangement, the ratio of heat pipes arranged on the heat-conducting surface can be increased and the heat-conducting efficiency thereof can be improved.

Abstract: An assembly structure for a LED lamp includes a cover plate, a LED module, fasteners and a mask. An inner surface of the cover plate is provided with a fixing portion. Both sides of the cover plate are formed with a slot respectively. The LED module has a substrate and a plurality of LED mounted on the substrate. The substrate is provided with an insertion hole. One end of the fastener is detachably connected into the insertion hole of the substrate and the other end thereof is fixed to the fixing portion. The mask is made of transparent materials and has an accommodating space for allowing the LED module to be disposed therein. Both sides of the mask defining the accommodating space are formed with a locking flange for inserting into the slot of the cover plate. With the above arrangement, the operator can assemble or detach the LED lamp quickly.

Abstract: The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.