Abstract: An over-current protection device includes a heat-sensitive layer and an electrode layer. The electrode layer includes a top metal layer and a bottom metal layer, and the heat-sensitive layer attached therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based homopolymer and a polyolefin-based copolymer. The polyolefin-based homopolymer has a first coefficient of thermal expansion (CTE), and the polyolefin-based copolymer has a second CTE lower than the first CTE. The polyolefin-based homopolymer and the polyolefin-based copolymer together form an interpenetrating polymer network (IPN).

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.

Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A projector mount is provided, which includes a foundation, a base, a Y axis translation unit, a rod, an X axis translation unit, a telescopic element, a Z axis translation unit and an angle adjusting unit. The base is connected to the foundation. The base is moved in the Y axis relative to the foundation via the Y axis translation unit. The rod is connected to the base. The rod is moved in the X axis relative to the base via the X axis translation unit. The telescopic element is connected to the rod. The telescopic element is moved in the Z axis relative to the rod via the Z axis translation unit. The angle adjusting unit is connected to the telescopic element.

Abstract: An electrical circuit for use as a string of lights is provided with a load including a plurality of lamps connected in series, the lamps including a plurality of LEDs and a plurality of incandescent light bulbs, and a plurality of electrical resistors connected in series, the electrical resistors being in parallel with the lamps. The load is activated by a source of AC. The LEDs are alternate with the incandescent light bulbs.

Abstract: An artificial knee joint is to be connected between a prosthetic thigh and a prosthetic lower leg. The artificial knee joint includes a knee joint body, a processor mounted in the knee joint body, a damping unit that is coupled to the processor and configurable to provide various damping levels, and an accelerometer coupled to the processor. The accelerometer is configured to measure acceleration subjected to the artificial knee joint, and to generate and transmit a measuring signal according to the measurement to the processor. The processor is configured to control the damping unit to provide one of the damping levels, based on the measuring signal.

Abstract: A projector mount is provided, which includes a foundation, a base, a Y axis translation unit, a rod, an X axis translation unit, a telescopic element, a Z axis translation unit and an angle adjusting unit. The base is connected to the foundation. The base is moved in the Y axis relative to the foundation via the Y axis translation unit. The rod is connected to the base. The rod is moved in the X axis relative to the base via the X axis translation unit. The telescopic element is connected to the rod. The telescopic element is moved in the Z axis relative to the rod via the Z axis translation unit. The angle adjusting unit is connected to the telescopic element.

Abstract: An electrical circuit for use as a string of lights in one embodiment includes a rectifier for converting AC into DC; and a plurality of lamps connected in series, each lamp having an LED, and wherein at least one of the lamps each has a Zener diode connected in series with the LED, a positive terminal of the lamp proximate the rectifier is connected to a positive terminal of an output of the rectifier, and a negative terminal of the lamp distal the rectifier is connected to a negative terminal of the output of the rectifier. In another embodiment, the Zener diode is replaced with a resistor. Hence, no resistors are provided externally of the lamp.

Abstract: In one embodiment an electrical circuit for use as a string of lights includes a load comprising a plurality of lamps connected in series, the lamps comprising a first group of lamps including an LED and a first Zener diode in parallel therewith, and a second group of lamps including an incandescent light bulb and a second Zener diode in parallel therewith; and a rectifier for converting a source of AC into DC which is supplied to the load. The first group of lamps are alternate with the second group of lamps.

Abstract: An electrical circuit for use as a string of lights in one embodiment includes a full-wave rectifier for converting an electrical source of AC into DC; and a load comprising a plurality of lamps connected in series, each of the lamps comprising an LED, a loading member in parallel with the LED, and a conductor interconnecting the LED and the loading member. The loading member is either a bidirectional Zener diode or a resistor element.

Abstract: In one embodiment an electrical circuit for use as a string of lights includes a load comprising a plurality of lamps connected in series, the lamps comprising a first group of lamps including an LED and a first Zener diode in parallel therewith, and a second group of lamps including an incandescent light bulb and a second Zener diode in parallel therewith; and a rectifier for converting a source of AC into DC which is supplied to the load. The first group of lamps are alternate with the second group of lamps.

Abstract: A string of LED light is provided. The string of LED light has a full-wave rectifier with a capacitor based filter for increasing output voltage to the range of 2.6 to 2.84 times as compared with the output voltage of a typical full-wave rectifier without filter so that an increased number of lamps each having an LED and a Zener diode in parallel therewith can be attached to the string of LED light.